| Name | Support | Language | Availability | Edition date | Price | ||
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PDF |
German |
Active |
7/1/2015 |
€131.96 |
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Details
This part of IEC 62137 specifies the test method to evaluate for solder joint durability of area array type packages against thermo-mechanical stress which are applied to solder joints while they are mounted on the printed wiring board.
Additional Info
| Author | Deutsche Institut für Normung e.V. (DIN) |
|---|---|
| Published by | DIN |
| Document type | Standard |
| ICS | 31.020 : Electronic components in general
31.190 : Electronic component assemblies |
| Number of pages | 44 |
| Cross references | EN 62137-4 (2014-12), IDT,EN 62137-4/AC (2015-02), IDT,IEC 62137-4 (2014-10), IDT |
| Set | MYSTD-20STD |
| Document history | DIN EN 62137-4 (2015-07),DIN EN 62137-4 (2013-01),DIN EN 62137 (2005-04),DIN IEC 62137 (2001-08) |
| Keyword | DIN EN 62137-4 |
