Name | Support | Language | Availability | Edition date | Price | ||
---|---|---|---|---|---|---|---|
PDF |
German |
Active |
5/1/2018 |
€99.35 |
|
Details
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
Additional Info
Author | Deutsche Institut für Normung e.V. (DIN) |
---|---|
Published by | DIN |
Document type | Standard |
ICS | 31.240 : Mechanical structures for electronic equipment
|
Number of pages | 21 |
Replace | DIN EN 61191-3(1999-06),DIN EN 61191-3(2016-01) |
Cross references | EN 61191-3 (2017-09), IDT,IEC 61191-3 (2017-05), IDT |
Set | MYSTD-20STD |
Document history | DIN EN 61191-3 (2018-05),DIN EN 61191-3 (2016-01),DIN EN 61191-3 (1999-06),DIN IEC 91/98/CDV (1996-10) |
Keyword | DIN EN 61191-3 |