DIN EN 61191-3:2018-05

DIN EN 61191-3:2018-05

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017), German version EN 61191-3:2017.

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Details

This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Additional Info

Author Deutsche Institut für Normung e.V. (DIN)
Published by DIN
Document type Standard
ICS 31.240 : Mechanical structures for electronic equipment
Number of pages 21
Replace DIN EN 61191-3(1999-06),DIN EN 61191-3(2016-01)
Cross references EN 61191-3 (2017-09), IDT,IEC 61191-3 (2017-05), IDT
Set MYSTD-20STD
Document history DIN EN 61191-3 (2018-05),DIN EN 61191-3 (2016-01),DIN EN 61191-3 (1999-06),DIN IEC 91/98/CDV (1996-10)
Keyword DIN EN 61191-3