| Name | Support | Language | Availability | Edition date | Price | ||
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PDF |
German |
Active |
11/1/2014 |
€99.35 |
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Details
This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.
Additional Info
| Author | Deutsche Institut für Normung e.V. (DIN) |
|---|---|
| Published by | DIN |
| Document type | Standard |
| ICS | 25.160.50 : Brazing and soldering
31.190 : Electronic component assemblies |
| Number of pages | 24 |
| Cross references | EN 61190-1-2 (2014-05), IDT,IEC 61190-1-2 (2014-02), IDT |
| Set | MYSTD-20STD |
| Document history | DIN EN 61190-1-2 (2014-11),DIN EN 61190-1-2/A1 (2012-03),DIN EN 61190-1-2 (2007-11),DIN IEC 61190-1-2 (2005-09),DIN EN 61190-1-2 (2003-01),DIN IEC 91/142/CD (1998-11) |
| Keyword | DIN EN 61190-1-2 |
