DIN EN 61189-3-719:2016-12

DIN EN 61189-3-719:2016-12

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016), German version EN 61189-3-719:2016

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Details

The purpose of this test is to monitor the resistance of single plated-through holes (PTHs) in printed boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling, which results in thermo-mechanical fatigue of PTHs.

Additional Info

Author Deutsche Institut für Normung e.V. (DIN)
Published by DIN
Document type Standard
ICS 31.180 : Printed circuits and boards
Number of pages 13
Replace DIN EN 61189-3-719(2014-04)
Cross references EN 61189-3-719 (2016-04), IDT,IEC 61189-3-719 (2016-01), IDT
Set MYSTD-20STD
Document history DIN EN 61189-3-719 (2016-12),DIN EN 61189-3-719 (2014-04)
Keyword DIN EN 61189-3-719