| Name | Support | Language | Availability | Edition date | Price | ||
|---|---|---|---|---|---|---|---|
|
PDF |
German |
Active |
8/1/2013 |
€92.62 |
|
||
Details
This part from IEC 60191 provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
Additional Info
| Author | Deutsche Institut für Normung e.V. (DIN) |
|---|---|
| Published by | DIN |
| Document type | Standard |
| ICS | 01.100.25 : Electrical and electronics engineering drawings
31.240 : Mechanical structures for electronic equipment |
| Number of pages | 18 |
| Cross references | EN 60191-6-22 (2013-03), IDT,IEC 60191-6-22 (2012-12), IDT |
| Set | MYSTD-20STD |
| Document history | DIN EN 60191-6-22 (2013-08),DIN EN 60191-6-22 (2011-08) |
| Keyword | DIN EN 60191-6-22 |
