| Name | Support | Language | Availability | Edition date | Price | ||
|---|---|---|---|---|---|---|---|
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Paper |
German |
Active |
5/1/2018 |
€0.00 |
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Details
This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. This Corrigendum replaces Table 2 - Maximum limits of solder bath contaminants.
Additional Info
| Author | VDE |
|---|---|
| Document type | Corrigendum |
| ICS | 19.040 : Environmental testing
31.190 : Electronic component assemblies |
| Number of pages | 6 |
| Cross references | EN 60068-2-69/AC (2018-03), IDT,IEC 60068-2-69 Corrigendum 1 (2018-01), IDT |
| Modify | DIN EN 60068-2-69 (2018-01)
|
| Weight(kg.) | 0.1102 |
| Document history | |
| Keyword | DIN EN 60068,DIN EN 60068-2,DIN EN 60068-2-69,EN 60068,EN 60068-2,EN 60068-2-69,EN 60068-2-69 Berichtigung 1,60068 |
