| Name | Support | Language | Availability | Edition date | Price | ||
|---|---|---|---|---|---|---|---|
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Paper |
German |
Active |
9/1/2018 |
€98.49 |
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Details
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This document provides procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.
Additional Info
| Author | VDE |
|---|---|
| Document type | Standard |
| ICS | 19.040 : Environmental testing
|
| Number of pages | 44 |
| Replace | DIN EN 60068-2-58 (2016-01),DIN EN 60068-2-58/A1 (2016-12) |
| Cross references | EN 60068-2-58 (2015-05), IDT,EN 60068-2-58/A1 (2018-04), IDT,IEC 60068-2-58 (2015-03), IDT,IEC 60068-2-58 AMD 1 (2017-07), IDT |
| Weight(kg.) | 0.1748 |
| Document history | DIN EN 60068-2-58 (2018-09),DIN EN 60068-2-58/A1 (2016-12),DIN EN 60068-2-58 (2016-01),DIN EN 60068-2-58 (2011-07),DIN EN 60068-2-58 (2005-03),DIN 45598 (2001-05),DIN EN 60068-2-58 (1999-10),DIN IEC 50/390/CDV (1997-06),DIN IEC 60068-2-58 (1992-04),DIN IE |
| Keyword | DIN EN 60068,DIN EN 60068-2,EN 60068,EN 60068-2,EN 60068-2-58,60068 |
