IPC 6012F:2023

IPC 6012F:2023

Qualification and Performance Specification for Rigid Printed Boards



IPC-6012F, covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6012 revision F incorporates many new and expanded requirements in areas such as printed board cavities, copper wrap plating, “intermediate” target lands, solderability testing, dewetting, microsection evaluation, internal plated layers, dielectric spacing and reliability issues with microvia structures. IPC 6012F is used with IPC-6011 and supersedes IPC-6012E.

Additional Info

Author Association Connecting Electronics Industries (IPC)
Published by IPC
Document type Standard
Theme General
Edition F
EAN ISBN 978-1-63816-151-6
ICS 31.180 : Printed circuits and boards
Number of pages 80
Replace IPC 6012E:2020
Keyword 6012F 6012-STD-0-D-0-EN-F