IPC 6013E:2021

IPC 6013E:2021

Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards



IPC-6013E standard covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias.

The IPC-6013E standard incorporates new and updated requirements for final finishes, rigid-to-flex transition zones, foreign inclusions, surface mount land anomalies, plated internal layers, dielectric removal as a function of wicking and etchback, copper filled via structures microvia structures.

Additional Info

Author Association Connecting Electronics Industries (IPC)
Published by IPC
Document type Standard
Theme General
Edition E
EAN ISBN 978-1-63816-020-5
ICS 31.180 : Printed circuits and boards
Number of pages 84
Replace IPC 6013D (2017-09-01), IPC 6013D AMD 1 (2018-04-01)
Keyword 6013-STD-0-D-0-EN-E, 6013-STD-0-D-0-EN-E