BS IEC 62047-38:2021

BS IEC 62047-38:2021

Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection

Availability: In stock

€180.00

Details

Vocabulary,Electromechanical devices,Integrated circuits,Terminology,Electronic equipment and components,Semiconductor technology,Semiconductor devices

Additional Info

Author British Standards Institution (BSI)
Committee EPL/47 - Electrical
Published by BSI
Document type Standard
EAN ISBN 978 0 539 06751 4
ICS 31.080.99 : Other semiconductor devices
Number of pages 16
Keyword BS IEC 62047-38:2021