BS EN IEC 61190-1-3:2018

BS EN IEC 61190-1-3:2018

Attachment materials for electronic assembly Requirements grade solder alloys and fluxed non-fluxed solid soldering applications

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Details

Electrical connections,Solders,Pastes,Test methods,Quality assurance,Bonding,Particulate materials,Fluxes (materials),Soldering,Classification systems,Bars (materials),Quality control,Electronic engineering,Electronic equipment and components

Additional Info

Author British Standards Institution (BSI)
Committee EPL/501 - Electrical
Published by BSI
Document type Standard
EAN ISBN 978 0 580 89238 7
ICS 31.190 : Electronic component assemblies
Number of pages 50
Replace BS EN 61190-1-3:2007+A1:2010
Cross references EN 60076-1:2011,IEC 61190-1-3:2017,EN IEC 61190-1-3:2018
Keyword BS EN IEC 61190-1-3:2018