BS EN 62047-9:2011

BS EN 62047-9:2011

Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS

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Details

Semiconductor devices,Bonding,Tensile testing,Substrates (insulating),Electrostatics,Electronic equipment and components,Electromechanical devices,Bend testing,Shear testing,Visual inspection (testing),Adhesive strength,Integrated circuits,Semiconductor technology,Adhesion tests

Additional Info

Author British Standards Institution (BSI)
Committee EPL/47 - Electrical
Published by BSI
Document type Standard
EAN ISBN 978 0 580 78793 5
ICS 31.080.99 : Other semiconductor devices
Number of pages 30
Cross references IEC 62047-9:2011/COR1:2012
Keyword BS EN 62047-9:2011