BS EN 62047-25:2016

BS EN 62047-25:2016

Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength micro bonding area

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Details

Semiconductor technology,Integrated circuits,Electronic equipment and components,Resonance,Electromechanical devices,Thin-film devices,Bend testing,Vibration,Test specimens,Fatigue testing,Test equipment,Semiconductor devices

Additional Info

Author British Standards Institution (BSI)
Committee EPL/47 - Electrical
Published by BSI
Document type Standard
EAN ISBN 978 0 580 85615 0
ICS 31.080.99 : Other semiconductor devices
Number of pages 28
Cross references IEC 62047-25:2016,EN 60745-2-8:2003/A11:2007,EN 62047-25:2016
Keyword BS EN 62047-25:2016