IPC 7711/21C - version 2017

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Rework, Modification and Repair of Electronic Assemblies


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This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures. Color illustrations are included in many procedures. Over 300 pages. Released January 2017.

 IPC A-620C traduite en français

Requirements and Acceptance for Cable and Wire Harness Assemblies


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 This is the latest revision of the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies, and it includes new sections for safety wiring, safety cable, grommets, and raceways along with updated information across many of the sections. With over 700 photographs and illustrations, this standard describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.

 IPC 9241

Guidelines for Microsection Preparation 






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This standard is intended as a guideline in the proper preparation of a metallographic sample (microsection) of a printed board. The finished microsection is used for evaluating the quality of the laminate system and plated structures (e.g. PTHs and vias). Microsection sample preparation is regarded by many as a highly developed skill. The guidelines in this standard discuss the many variables and problems associated with the process from sample removal to micro-etch. The guidelines do not promote any one vendor’s process, but discuss the variables common to microsectioning.