19/30396945 DC:2019

19/30396945 DC:2019

BS EN IEC 63251. Test Method for Mechanical Property of Flexible Opto-Electric Circuit Boards under Thermal Stress

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Details

Test methods,Printed-circuit boards,Stress,Thermal stress,Reliability,Assessed reliability

Additional Info

Author British Standards Institution (BSI)
Committee EPL/501 - Electrical
Published by BSI
Document type Draft standard
ICS 31.180 : Printed circuits and boards
Number of pages 17
Cross references IEC 63251 Ed.1.0
Keyword 19/30396945 DC