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01.100.25 : Dibujo de electrónica y electrotecnia

43 artículo(s)

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  • VG 95340-2:2017-10

    01/10/2017 - PDF - Inglés, Alemán - Alemania - DIN - - Complete circuit diagram - Part 2: Installation of power installations in cabins and motorcar box bodies, 230 V, 50 Hz, 16 A, interface standard; Text in German and English
    Más información
    € 46,70

  • BS IEC 60191-2:1966+A19:2012

    01/04/1992 - papier - Inglés - Reino Unido - BSI - - Mechanical standardization of semiconductor devices. Dimensions
    Más información
    € 521,92

  • BS EN 60191-6-1:2001

    29/03/2002 - papier - Inglés - Reino Unido - BSI - - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals
    Más información
    € 109,76

  • BS EN 60191-6-2:2002

    29/03/2002 - papier - Inglés - Reino Unido - BSI - - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
    Más información
    € 109,76

  • BS EN 60191-6-5:2001

    15/11/2001 - papier - Inglés - Reino Unido - BSI - - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitchball grid array (FBGA)
    Más información
    € 109,76

  • BS EN 60191-6-8:2001

    16/11/2001 - papier - Inglés - Reino Unido - BSI - - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP)
    Más información
    € 109,76

  • BS EN 60191-6-6:2001

    05/09/2001 - papier - Inglés - Reino Unido - BSI - - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine pitch land grid array (FLGA). Proposed amendment on terminology
    Más información
    € 129,92

  • BS EN 60139:2001

    15/08/2001 - papier - Inglés - Reino Unido - BSI - - Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges
    Más información
    € 212,80

  • BS EN 60191-6-3:2001

    15/05/2001 - papier - Inglés - Reino Unido - BSI - - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)
    Más información
    € 129,92

  • BS EN 60191-6-17:2011

    30/06/2011 - papier - Inglés - Reino Unido - BSI - - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
    Más información
    € 183,68

  • BS EN 60191-6-12:2011

    31/08/2011 - papier - Inglés - Reino Unido - BSI - - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
    Más información
    € 183,68

  • BS EN 60848:2013

    31/07/2013 - papier - Inglés - Reino Unido - BSI - - GRAFCET specification language for sequential function charts
    Más información
    € 255,36

  • VG 95340-1:2017-10

    01/10/2017 - PDF - Inglés, Alemán - Alemania - DIN - - Complete circuit diagram - Part 1: Installation of power installations in cabins and motorcar box bodies, 400/230 V, 50 Hz, 32 A, interface standard; Text in German and English
    Más información
    € 46,70

  • DIN EN 61837-2:2017-10

    01/10/2017 - PDF - Inglés, Alemán - Alemania - DIN - - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1218/CD:2017)
    Más información
    € 327,70

  • DIN EN 61240:2017-08

    01/08/2017 - PDF - Alemán - Alemania - DIN - - Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (IEC 61240:2016); German version EN 61240:2017)
    Más información
    € 94,10

  • DIN EN 60191-1:2017-05

    01/05/2017 - PDF - Inglés, Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 47D/886/CDV:2016); German version prEN 60191-1:2016
    Más información
    € 122,80

  • NF C03-254, NF EN 62744 (03/2015)

    25/03/2015 - PDF - Francés - Francia - UTE - - Representation of states of objects by graphic symbols
    Más información
    € 93,25

  • NF C03-251-1, NF EN 61082-1 (05/2015)

    15/05/2015 - PDF - Francés - Francia - UTE - - Preparation of documents used in electrotechnology - Part 1 : rules
    Más información
    € 181,30

  • NF C03-251-1, NF EN 61082-1 (11/2006)

    01/11/2006 - PDF - Francés - Francia - UTE - - Preparation of documents used in electrotechnology - Part 1 : rules
    Más información
    € 175,55

  • NF C93-548-3-1, NF EN 61988-3-1 (03/2006)

    01/03/2006 - PDF - Francés - Francia - UTE - - Plasma display panels - Part 3-1 : mechanical interface
    Más información
    € 70,75

  • BS EN 60191-3:2000

    15/06/2000 - papier - Inglés - Reino Unido - BSI - - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of integrated circuits
    Más información
    € 255,36

  • DS-Handbook 166:2010

    02/09/2010 - PDF - Inglés - Dinamarca - DS - - A Guide to Reference Designations. Preparation of TAG Numbers, Letter Codes, Modularization and Interfaces between Systems
    Más información
    € 144,00

  • DIN EN 60191-6-2:2002-09

    01/09/2002 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002
    Más información
    € 73,90

  • DIN EN 60191-6-17:2011-09

    01/09/2011 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
    Más información
    € 111,90

  • DIN EN 60191-6-21:2011-03

    01/03/2011 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
    Más información
    € 94,10

  • DIN EN 60191-6-20:2011-03

    01/03/2011 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
    Más información
    € 81,00

  • DIN EN 60191-6-18:2010-08

    01/08/2010 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
    Más información
    € 101,00

  • DIN EN 60191-6:2010-06

    01/06/2010 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009
    Más información
    € 134,10

  • DIN EN 60191-1:2007-11

    01/11/2007 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2007); German version EN 60191-1:2007
    Más información
    € 111,90

  • DIN EN 60191-3 Beiblatt 1:2006-08

    01/08/2006 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
    Más información
    € 53,70

  • DIN EN 60191-6-10:2004-05

    01/05/2004 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003
    Más información
    € 73,90

  • DIN EN 60191-6-12:2011-12

    01/12/2011 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011
    Más información
    € 94,10

  • DIN EN 60191-6-22:2013-08

    01/08/2013 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
    Más información
    € 94,10

  • DIN EN 61837-2:2014-10

    01/10/2014 - PDF - Alemán - Alemania - DIN - - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011 + A1:2014); German version EN 61837-2:2011 + A1:2014
    Más información
    € 219,80

  • DIN EN 60191-6-6:2002-02

    01/02/2002 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001
    Más información
    € 73,90

  • DIN EN 60139:2001-10

    01/10/2001 - PDF - Alemán - Alemania - DIN - - Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges (IEC 60139:2000); German version EN 60139:2001
    Más información
    € 111,90

  • DIN EN 60191-3:2000-07

    01/07/2000 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
    Más información
    € 139,10

  • DIN EN 60191-6-8:2002-05

    01/05/2002 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
    Más información
    € 73,90

  • DIN EN 60191-6-5:2002-05

    01/05/2002 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001
    Más información
    € 73,90

  • DIN EN 60191-6-3:2001-06

    01/06/2001 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
    Más información
    € 60,50

  • DIN EN 60191-6-1:2002-08

    01/08/2002 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001
    Más información
    € 53,70

  • DIN 1304-9:2003-01

    01/01/2003 - PDF - Alemán - Alemania - DIN - - Letter symbols for physical quantities - Part 9: Symbols for equivalent circuits of piezoelectric crystals
    Más información
    € 46,70

  • DIN EN 60191-6-4:2004-01

    01/01/2004 - PDF - Alemán - Alemania - DIN - - Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
    Más información
    € 87,30

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