IPC-9707 (09/11) - Hard copy

Spherical Bend Test Method for Characterization of BoardLevel Interconnects

Langue : Anglais
Support : Papier (15 pages)
N° Ref : 47387
N° d'édition : - 09/2011
Type de document : Norme
Statut : actif

Catégories :
Assemblages de composants électroniques

Recueils contenant le document :
IPC-C-1000 - Hard copy
IPC-C-103 - Hard copy

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This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations.

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IPC-9707 (09/11) - Hard copy

Spherical Bend Test Method for Characterization of BoardLevel Interconnects