IEC 62137-1-2 ed1.0 (2007-07)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

Langue : bilingue français/anglais
Support : Papier (17 pages)
N° Ref : 43802
N° d'édition : 1/07/07
Type de document : Norme
Statut : actif

Catégories :
Assemblages de composants électroniques


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The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress.
 
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