IPC-9704A (02/12) - Kit hardcopy & CD non printable

Printed Circuit Assembly Strain Gage Test Guideline

Langue : Anglais
Support : CD-Rom (non imprimable) et Papier (25 pages)
N° Ref : 3294
N° d'édition : - 02/2012
Type de document : Norme
Statut : actif

Catégories :
Assemblages de composants électroniques

Recueils contenant le document :
IPC-C-1000 - Hard copy
IPC-C-103 - Hard copy

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Strain gage testing allows for objective analysis of the strain and strain rate levels to which a surface mount package may be subjected to during assembly, test and operation. Excessive strain can result in various failure modes for different solder alloys, package types, surface finishes or laminate materials. This document describes specific guidelines for strain gage testing during the printed board manufacturing process, including board assembly, test, system integration ...

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IPC-9704A (02/12) - Kit hardcopy & CD non printable

Printed Circuit Assembly Strain Gage Test Guideline