IPC-7095B (03/08) - Kit hardcopy & CD non printable

Design and Assembly Process Implementation for BGAs

Langue : Anglais
Support : CD-Rom (non imprimable) et Papier (152 pages)
N° Ref : 3253
N° d'édition : - 03/2008
Type de document : Norme
Statut : actif

Catégories :
Cartes et circuits imprimés

Recueils contenant le document :
IPC-C-1000 - Hard copy
IPC-C-103 - Hard copy

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Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats, This has become especially important due to the change in the alloys being used, both on the BGA packages and the solder alloy used to attach it to the printed board land pattern.

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IPC-7095B (03/08) - Kit hardcopy & CD non printable

Design and Assembly Process Implementation for BGAs