IPC-2251 (11/03) - Hard copy

Design Guide for the Packaging of High Speed Electronic Circuits

Langue : Anglais
Support : Papier (99 pages)
N° Ref : 3189
N° d'édition : - 11/2003
Type de document : Norme
Statut : actif

Catégories :
Cartes et circuits imprimés

Recueils contenant le document :
IPC-C-1000 - Hard copy
IPC-C-105 - Hard copy
IPC-C-106 - Hard copy

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This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered stripline and dual stripline geometries, expanded EMI layout practices ...

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IPC-2251 (11/03) - Hard copy

Design Guide for the Packaging of High Speed Electronic Circuits