IPC 2010

IPC Printed Circuits Expo, APEX and the Designers Summit

Come to the industry’s own event — a celebration of printed circuit board and electronics manufacturing and test technology. Find the technology you need, meet new suppliers, network with industry experts, learn from new research papers and return to your company with the solutions you need.

It’s Your Show! Designed by and for the industry, it’s the one place to get the answers you need for 2008 and beyond. Please take some time to view the latest show information using the links in the left column. In addition, learn more about Las Vegas, peruse the exhibitor list, make your travel plans, and check out what your colleagues think about the show in these case studies.

Show Announcements:

The IPC certification program is an audit of an electronics assembly facility —whether it’s an OEM or EMS facility — to determine if the facility is capable of producing product to meet the lead-free requirements of the RoHS Directive.

Commenting on the certification, Janco Electronics’ president and CEO, Rolly Janetos said, "IPC's lead-free certification will benchmark our lead-free processes from which we will continue to develop and expand opportunities in lead-free manufacturing. The process controls we have developed will ensure our customers that our leaded and lead-free processes will be segregated or controlled."

According to Susan Filz, IPC director of industry programs, certification is an excellent way for a facility to validate its lead-free electronics assembly processes capabilities. “A facility can usually perform a simple test to see if they are producing lead-free product, but this program takes the analysis a step further. The audit questions are specifically designed to get a company to think about its lead-free processes and make sure they are operating at an optimum level.”

Nouveaux standards et nouvelles normes

Nouvelles normes IPC

	Product Code	Titre
	1751A(D)F	Generic Requirements for Declaration Process Management
	1756(D)F	Manufacturing Process Data Management
	TIC09-HDIAERO	HDI Implementation for Aerospace/Military Applications
	1752A(D)F	Materials Declaration Management
	2152-DE	Designrichtlinie für die Bestimmung der Stromtragfähigkeit von Leiterplatten (German)
	2611	Generic Requirements for Electronic Product Documentation
	2612	Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
	2612-1	Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
	2614	Sectional Requirements for Board Fabrication Documentation
	4202A	Flexible Base Dielectrics for Use in Flexible Printed Circuitry
	6012C	Qualification and Performance Specification for Rigid Printed Boards
	7351B	Generic Requirements for Surface Mount Design and Land Pattern Standard
	7711/21B-PL	Wprowadzanie Poprawek, Modyfikacja i Naprawa Zespołów Elektronicznych (Polish)
	9151C	Process Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database
	9592A	Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
	A-600H	Acceptability of Printed Boards
	A-610E	Acceptability of Electronic Assemblies
	APEX10-S15	Telecomm Head-in-Pillow Case Study
	APEX10-S35	Lead-Free Processing Session from IPC APEX EXPO
	APEXPO10-CD	IPC APEX EXPO 2010 Proceedings
	BENCHE-10	Study of Quality Benchmarks for the Electronics Manufacturing Services (EMS) Industry for 2009
	CC0201-CD	Conformal Coating Applications, Inspection, Rework & Quality Control Interactive CD-ROM
	DVD-14C	Hand Soldering for Terminals
	DVD-91C-94C	Surface Mount Rework - Four DVD Series
	TIC09-PCBMILRDMP	North American PCB Military Technology Roadmap
	DVD-95C	Surface Mount Rework Stations
	DVD-96C	Ball Grid Array Rework
	DVD-CH93	Gull Wing Rework, CHINESE/ENGLISH
	DVD-SP78C	The Seven Sins of ESD Control, SPANISH / ENGLISH
	EXMG0410-consol	Are the Consequences of Industry Consolidation Good or Bad
	DVD-CHPTH-D	Through-Hole Solder Joint Workmanship Standards, CHINESE / ENGLISH
	EXMG0410-costactg	How Does Cost Accounting Impact Pricing
	EXMG0410-lean	The Lean Surface Mount Line
	EXMT10-AUTO	Automotive Electronics in Harsh Environment
	EXMT10-COST	Analysis of the Cost Impact of Supplying High-Reliability Products
	J-STD-033B-CN	潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用 (Chinese)
	JIG101ED3	Joint Industry Guide Material Composition Declaration for Electrotechnical Products
	J-STD-001E	Requirements for Soldered Electrical and Electronic Assemblies
	J-STD-033B-RU	Обращение, упаковка, транспортировка и использование компонентов для поверхностного монтажа, чувствительных к влаге при пайке методом оплавления (на русском языке)
	J-STD-609A	IPC/JEDEC Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes
	TIC09-COMMILMFG	Integration of Commercial and Military Manufacturing
	SPVC-LAT1	Analytical Procedures for Portable Lead-Free Alloy Test Data

Who is IPC? Since 1957, IPC — Association Connecting Electronics Industries® has been guiding the electronics interconnection industry through its dramatic changes. A global trade association dedicated to the competitive excellence and financial success of more than 2,500 member companies, IPC is the only electronics interconnect organization that brings together all industry players, including designers, board manufacturers, assembly companies, suppliers, and original equipment manufacturers. IPC supports the industry through industry standards, training, market research, management programs and public policy advocacy. IPC has offices in Bannockburn, Ill., Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.

Identifiez-vous

IPC 2010

IPC Printed Circuits Expo, APEX and the Designers Summit

Show Announcements:

Nouveaux standards et nouvelles normes