31.240 : Mechanical structures for electronic equipment

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  • DIN EN 60286-1:2018-04

    Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes (IEC 60286-1:2017); German version EN 60286-1:2017
    4/1/2018 - PDF - German - DIN
    Learn More
    €82.60

  • PR NF C93-013-3, PR NF EN 60286-3 (03/2018)

    Packaging of components for automatic handling - Part 3 : Packaging of surface mount components on continuous tapes
    3/16/2018 - Paper - French - AFNOR
    Learn More
    €87.16

  • PR NF C93-627-2, PR NF EN 62610-2 (03/2018)

    Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 2: Method for the determination of forced air cooling structure
    3/2/2018 - Paper - French - AFNOR
    Learn More
    €54.48

  • DIN EN 61587-1 VDE 0687-587-1:2018-03

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor condition use and transportation (IEC 61587-1:2016); German version EN 61587-1:2017
    3/1/2018 - Paper - German - VDE
    Learn More
    €116.31

  • DIN EN 61587-6 VDE 0687-587-6:2018-02

    Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 6: Security aspects for indoor cabinets (IEC 61587-6:2017); German version EN 61587-6:2017
    2/1/2018 - Paper - German - VDE
    Learn More
    €61.54

  • PR NF C93-636-1, PR NF EN 62966-1 (01/2018)

    Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 1: Dimensions and mechanical requirements
    1/19/2018 - Paper - French - AFNOR
    Learn More
    €63.76

  • BS EN 60286-1:2017

    Packaging of components for automatic handling. Tape packaging of components with axial leads on continuous tapes
    12/7/2017 - Paper - English - BSI
    Learn More
    €139.08

  • UNE-EN 60286-1:2017

    Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes (Endorsed by Asociación Española de Normalización in December of 2017.)
    12/1/2017 - PDF - English - AENOR
    Learn More
    €62.00

  • UNE-EN 61191-4:2017

    Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2017.)
    12/1/2017 - PDF - English - AENOR
    Learn More
    €70.00

  • BS EN 61191-2:2017

    Printed board assemblies. Sectional specification. Requirements for surface mount soldered assemblies
    10/26/2017 - Paper - English - BSI
    Learn More
    €225.72

  • BS EN 61076-3-122:2017

    Connectors for electrical and electronic equipment. Product requirements. Detail specification for 8-way, shielded, free and fixed connectors for I/O and Gigabit Ethernet applications in harsh environments
    10/4/2017 - Paper - English - BSI
    Learn More
    €225.72

  • DIN EN 61837-2:2017-10

    Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1218/CD:2017)
    10/1/2017 - PDF - English, German - DIN
    Learn More
    €334.30

  • BS EN 61191-3:2017

    Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies
    9/25/2017 - Paper - English - BSI
    Learn More
    €193.80

  • BS EN 61587-6:2017

    Mechanical structures for electrical and electronic equipment. Tests for IEC 60917 and IEC 60297 series. Security aspects for indoor cabinets
    9/18/2017 - Paper - English - BSI
    Learn More
    €139.08

  • IEC 60286-1 (2017-07)

    IEC 60286-1:2017 Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes
    7/26/2017 - PDF - English - CEI
    Learn More
    €77.00

  • IEC 61191-4 (2017-07)

    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    7/26/2017 - PDF - English - CEI
    Learn More
    €110.00

  • NF C93-471-1, NF EN 61587-1 (06/2017)

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1 : environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor condition use and transportation
    6/24/2017 - PDF - French - AFNOR
    Learn More
    €118.29

  • NF C93-471-1, NF EN 61587-1 (06/2017)

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1 : environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor condition use and transportation
    6/24/2017 - PDF - English - AFNOR
    Learn More
    €118.29

  • DIN EN 60191-6-13:2017-06

    Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016
    6/1/2017 - PDF - German - DIN
    Learn More
    €96.00

  • UNE-EN 61587-1:2017

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor condition use and transportation (Endorsed by Asociación Española de Normalización in June of 2017.)
    6/1/2017 - PDF - English - AENOR
    Learn More
    €86.00

  • IEC 61191-3 (2017-05)

    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    5/30/2017 - PDF - English - CEI
    Learn More
    €110.00

  • BS EN 61587-1:2017

    Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297 series. Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor condition use and transportation
    5/26/2017 - Paper - English - BSI
    Learn More
    €271.32

  • IEC 61191-2 (2017-05)

    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    5/23/2017 - PDF - English - CEI
    Learn More
    €220.00

  • IEC 61587-6 (2017-05)

    IEC 61587-6:2017 Mechanical structures for electrical and electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 6: Security aspects for indoor cabinets
    5/19/2017 - PDF - English - CEI
    Learn More
    €77.00

  • DIN EN 60191-1:2017-05

    Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 47D/886/CDV:2016); German version prEN 60191-1:2016
    5/1/2017 - PDF - English, German - DIN
    Learn More
    €125.30

  • UNE-EN 62739-3:2017

    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods (Endorsed by Asociación Española de Normalización in May of 2017.)
    5/1/2017 - PDF - English - AENOR
    Learn More
    €80.00

  • BS EN 62739-3:2017

    Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Selection guidance of erosion test methods
    4/30/2017 - Paper - English - BSI
    Learn More
    €225.72

  • DIN EN 60191-4/A1:2017-04

    Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/882/CD:2016)
    4/1/2017 - PDF - English, German - DIN
    Learn More
    €103.00

  • DIN EN 62610-5:2017-02

    Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Cooling performance evaluation for indoor cabinets (IEC 62610-5:2016); German version EN 62610-5:2016
    2/1/2017 - PDF - German - DIN
    Learn More
    €96.00

  • IEC 62739-3 (2017-01)

    IEC 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
    1/6/2017 - PDF - English - CEI
    Learn More
    €220.00

  • NF C93-742-2, NF EN 62739-2 (12/2016)

    Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2 : erosion test method for metal materials with surface processing
    12/16/2016 - PDF - French - AFNOR
    Learn More
    €73.94

  • NF C93-742-2, NF EN 62739-2 (12/2016)

    Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2 : erosion test method for metal materials with surface processing
    12/16/2016 - PDF - English - AFNOR
    Learn More
    €73.94

  • JIS B 7545/ERRATUM 1:2016

    ERRATUM
    12/8/2016 - PDF - Japanese - JSA
    Learn More
    €0.00

  • JIS B 7545/ERRATUM 1:2016

    ERRATUM
    12/8/2016 - PDF - English - JSA
    Learn More
    €0.00

  • JIS C 6011-1/ERRATUM 1:2016

    ERRATUM
    12/8/2016 - PDF - Japanese - JSA
    Learn More
    €0.00

  • IEC 61587-1 (2016-12)

    IEC 61587-1:2016 Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor condition use and transportation
    12/7/2016 - PDF - English, French - CEI
    Learn More
    €264.00

  • NF C93-627-5, NF EN 62610-5 (11/2016)

    Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5 : cooling performance evaluation for indoor cabinets
    11/26/2016 - PDF - French - AFNOR
    Learn More
    €86.53

  • NF C93-627-5, NF EN 62610-5 (11/2016)

    Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5 : cooling performance evaluation for indoor cabinets
    11/26/2016 - PDF - English - AFNOR
    Learn More
    €86.53

  • UNE-EN 62739-2:2016

    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing (Endorsed by AENOR in November of 2016.)
    11/1/2016 - PDF - English - AENOR
    Learn More
    €68.00

  • BS EN 62739-2:2016

    Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Erosion test method for metal materials with surface processing
    10/31/2016 - Paper - English - BSI
    Learn More
    €139.08

  • DIN EN 60297-3-109 VDE 0687-297-3-109:2016-09

    Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices (IEC 60297-3-109:2015); German version EN 60297-3-109:2016
    9/1/2016 - Paper - German - VDE
    Learn More
    €69.60

  • UNE-EN 62610-5:2016

    Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Cooling performance evaluation for indoor cabinets (Endorsed by AENOR in August of 2016.)
    8/1/2016 - PDF - English - AENOR
    Learn More
    €71.00

  • IEC 62739-2 (2016-07)

    IEC 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
    7/13/2016 - PDF - English, French - CEI
    Learn More
    €77.00

  • BS EN 62610-5:2016

    Mechanical structures for electrical and electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series. Cooling performance evaluation for indoor cabinets
    6/30/2016 - Paper - English - BSI
    Learn More
    €193.80

  • NF C93-464-3-109, NF EN 60297-3-109 (06/2016)

    Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-109 : dimensions of chassis for embedded computing devices
    6/4/2016 - PDF - French - AFNOR
    Learn More
    €86.53

  • IEC 62610-5 (2016-04)

    IEC 62610-5:2016 Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Cooling performance evaluation for indoor cabinets
    4/20/2016 - PDF - English, French - CEI
    Learn More
    €110.00

  • DIN EN 61837-3:2016-04

    Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 3: Metal enclosures (IEC 61837-3:2015); German version EN 61837-3:2015
    4/1/2016 - PDF - German - DIN
    Learn More
    €103.00

  • BS EN 60297-3-109:2016

    Mechanical structures for electrical and electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Dimensions of chassis for embedded computing devices
    3/31/2016 - Paper - English - BSI
    Learn More
    €193.80

  • DIN EN 60297-3-110 VDE 0687-297-3-110:2016-03

    Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) Series - Part 110: Residential racks and cabinets for intelligent houses (IEC 48D/593/CD:2015)
    3/1/2016 - Paper - German - VDE
    Learn More
    €20.45

  • UNE-EN 60297-3-109:2016

    Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices (Endorsed by AENOR in March of 2016.)
    3/1/2016 - PDF - English - AENOR
    Learn More
    €73.00

  • DIN EN 61837-4:2016-02

    Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 4: Hybrid enclosure outlines (IEC 61837-4:2015); German version EN 61837-4:2015
    2/1/2016 - PDF - German - DIN
    Learn More
    €89.00

  • IEC 60297-3-109 (2015-11)

    IEC 60297-3-109:2015 Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices
    11/23/2015 - PDF - English, French - CEI
    Learn More
    €154.00

  • JIS C 6011-1:2015

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor conditions
    11/20/2015 - PDF - Japanese - JSA
    Learn More
    €25.00

  • JIS C 6011-2:2015

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 2: Seismic tests for cabinets and racks
    11/20/2015 - PDF - Japanese - JSA
    Learn More
    €25.00

  • JIS C 6011-3:2015

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets and subracks
    11/20/2015 - PDF - Japanese - JSA
    Learn More
    €25.00

  • JIS C 6012-3-100:2015

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482.6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets
    11/20/2015 - PDF - Japanese - JSA
    Learn More
    €25.00

  • TS C 62610-2:2015

    Mechanical structures for electronic equipment - Thermal management for cabinets with IEC 60297 (all parts) and JIS C 6010 (all parts) - Design guide: Method for the determination of forced air-cooling structure
    11/20/2015 - PDF - Japanese - JSA
    Learn More
    €25.00

  • DIN EN 62966-1:2015-08

    Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 1: Dimensions and mechanical requirements (IEC 48D/585A/CD:2015)
    8/1/2015 - PDF - English, German - DIN
    Learn More
    €89.00

  • UNE-EN 60286-2:2015

    Packaging of components for automatic handling - Part 2: Packaging of components with unidirectional leads on continuous tapes (Endorsed by AENOR in July of 2015.)
    7/1/2015 - PDF - English - AENOR
    Learn More
    €84.00

  • BS EN 60286-2:2015

    Packaging of components for automatic handling. Packaging of components with unidirectional leads on continuous tapes
    6/30/2015 - Paper - English - BSI
    Learn More
    €225.72

  • DIN EN 60297-3-108 VDE 0687-297-3-108:2015-06

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-108: Dimensions of R-type subracks and plug-in units (IEC 60297-3-108:2014); German version EN 60297-3-108:2015
    6/1/2015 - Paper - German - VDE
    Learn More
    €77.84

  • IEC 60286-2 (2015-04)

    IEC 60286-2:2015 Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes
    4/22/2015 - PDF - English, French - CEI
    Learn More
    €220.00

  • NF C93-464-3-108, NF EN 60297-3-108 (04/2015)

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-108 : dimensions of R-type subracks and plug-in units
    4/11/2015 - PDF - French - AFNOR
    Learn More
    €97.45

  • NF C93-013-3, NF EN 60286-3 (02/2015)

    Packaging of components for automatic handling - Part 3 : packaging of surface mount components on continuous tapes
    2/7/2015 - PDF - French - AFNOR
    Learn More
    €106.80

  • UNE-EN 60297-3-108:2015

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-108: Dimensions of R-type subracks and plug-in units (Endorsed by AENOR in February of 2015.)
    2/1/2015 - PDF - English - AENOR
    Learn More
    €77.00

  • BS EN 60297-3-108:2015

    Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Dimensions of R-type subracks and plug-in units
    1/31/2015 - Paper - English - BSI
    Learn More
    €193.80

  • NF C93-013-3-1, NF EN 60286-3-1 (01/2015)

    Packaging of components for automatic handling - Part 3-1 : Packaging of surface mount components on continuous tapes - Type V : pressed carrier tapes
    1/24/2015 - PDF - French - AFNOR
    Learn More
    €73.94

  • NF C93-013-3-2, NF EN 60286-3-2 (01/2015)

    Packaging of components for automatic handling - Part 3-2 : packaging of surface mount components on continuous tapes - Type VI - Blister carrier tapes 4 mm width
    1/24/2015 - PDF - French - AFNOR
    Learn More
    €60.25

  • DIN EN 61587-5 VDE 0687-587-5:2014-12

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5: Seismic tests for chassis, subracks and plug-in units (IEC 61587-5:2013); German version EN 61587-5:2014
    12/1/2014 - Paper - German - VDE
    Learn More
    €77.84

  • NF C93-471-2, NF EN 61587-2 (11/2014)

    Mechanical structures for electronic equipment - Tests for CEI 60917 and CEI 60297 - Part 2 : seismic tests for cabinets and racks
    11/15/2014 - PDF - French - AFNOR
    Learn More
    €73.94

  • DIN EN 60191-4:2014-10

    Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013); German version EN 60191-4:2014
    10/1/2014 - PDF - German - DIN
    Learn More
    €103.00

  • DIN EN 61837-2:2014-10

    Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011 + A1:2014); German version EN 61837-2:2011 + A1:2014
    10/1/2014 - PDF - German - DIN
    Learn More
    €224.20

  • IEC 60297-3-108 (2014-09)

    IEC 60297-3-108:2014 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-108: Dimensions of R-type subracks and plug-in units
    9/9/2014 - PDF - English, French - CEI
    Learn More
    €187.00

  • NF C93-471-5, NF EN 61587-5 (06/2014)

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5 : seismic tests for chassis, subracks, and plug-in units
    6/14/2014 - PDF - French - AFNOR
    Learn More
    €86.53

  • IPC HDBK-630:2014

    Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures
    6/1/2014 - Paper - English - IPC
    Learn More
    €156.88

  • UNE-EN 61587-5:2014

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5: Seismic tests for chassis, subracks and plug-in units (Endorsed by AENOR in May of 2014.)
    5/1/2014 - PDF - English - AENOR
    Learn More
    €75.00

  • BS EN 61587-5:2014

    Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297. Seismic tests for chassis, subracks and plug-in units
    4/30/2014 - Paper - English - BSI
    Learn More
    €193.80

  • NF C93-742-1, NF EN 62739-1 (04/2014)

    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1 : erosion test method for metal materials without surface processing
    4/26/2014 - PDF - French - AFNOR
    Learn More
    €73.94

  • DIN EN 62610-4:2014-04

    Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets (IEC 62610-4:2013); German version EN 62610-4:2013
    4/1/2014 - PDF - German - DIN
    Learn More
    €96.00

  • NF C93-627-4, NF EN 62610-4 (03/2014)

    Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4 : cooling performance tests for water supplied heat exchangers in electronic cabinets
    3/19/2014 - PDF - French - AFNOR
    Learn More
    €86.53

  • DIN EN 60679-3:2014-01

    Quartz crystal controlled oscillators of assessed quality - Part 3: Standard outlines and lead connections (IEC 60679-3:2012); German version EN 60679-3:2013
    1/1/2014 - PDF - German - DIN
    Learn More
    €108.80

  • UNE-EN 60286-4:2013

    Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms (Endorsed by AENOR in January of 2014.)
    1/1/2014 - PDF - English - AENOR
    Learn More
    €68.00

  • UNE-EN 62610-4:2013

    Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets (Endorsed by AENOR in January of 2014.)
    1/1/2014 - PDF - English - AENOR
    Learn More
    €71.00

  • IEC 61587-5 (2013-12)

    IEC 61587-5:2013 Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5: Seismic tests for chassis, subracks and plug-in units
    12/10/2013 - PDF - English, French - CEI
    Learn More
    €154.00

  • BS EN 60286-4:2013

    Packaging of components for automatic handling. Stick magazines for electronic components encapsulated in packages of different forms
    11/30/2013 - Paper - English - BSI
    Learn More
    €139.08

  • BS EN 62610-4:2013

    Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series. Cooling performance tests for water supplied heat exchangers in electronic cabinets
    11/30/2013 - Paper - English - BSI
    Learn More
    €193.80

  • NF C93-441-2-3, NF EN 60917-2-3 (11/2013)

    Modular order for the development of mechanical structures for electronic equipment practices - Part 2-3 : sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units
    11/16/2013 - PDF - French - AFNOR
    Learn More
    €106.80

  • DIN EN 61587-3 VDE 0687-587-3:2013-11

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets and subracks (IEC 61587-3:2013); German version EN 61587-3:2013
    11/1/2013 - Paper - German - VDE
    Learn More
    €53.63

  • UNE-EN 61191-2:2013

    Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by AENOR in November of 2013.)
    11/1/2013 - PDF - English - AENOR
    Learn More
    €77.00

  • IPC A-630:2013

    Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
    10/4/2013 - Paper - English - IPC
    Learn More
    €156.88

  • UNE-EN 61191-1:2013

    Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by AENOR in October of 2013.)
    10/1/2013 - PDF - English - AENOR
    Learn More
    €92.00

  • UNE-EN 62739-1:2013

    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (Endorsed by AENOR in October of 2013.)
    10/1/2013 - PDF - English - AENOR
    Learn More
    €71.00

  • BS EN 62739-1:2013

    Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Erosion test method for metal materials without surface processing
    9/30/2013 - Paper - English - BSI
    Learn More
    €139.08

  • UNE-EN 60286-3:2013

    Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (Endorsed by AENOR in September of 2013.)
    9/1/2013 - PDF - English - AENOR
    Learn More
    €84.00

  • BS EN 60286-3:2013

    Packaging of components for automatic handling. Packaging of surface mount components on continuous tapes
    8/31/2013 - Paper - English - BSI
    Learn More
    €225.72

  • NF C93-471-3, NF EN 61587-3 (08/2013)

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3 : electromagnetic shielding performance tests for cabinets and subracks
    8/17/2013 - PDF - French - AFNOR
    Learn More
    €73.94

  • IEC 62610-4 (2013-08)

    IEC 62610-4:2013 Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets
    8/15/2013 - PDF - English, French - CEI
    Learn More
    €110.00

  • DIN EN 60191-6-22:2013-08

    Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
    8/1/2013 - PDF - German - DIN
    Learn More
    €96.00

  • IEC 60286-4 (2013-07)

    IEC 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
    7/26/2013 - PDF - English, French - CEI
    Learn More
    €77.00

  • IEC 62739-1 (2013-06)

    IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
    6/18/2013 - PDF - English, French - CEI
    Learn More
    €110.00

  • UNE-EN 61587-3:2013

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets and subracks (Endorsed by AENOR in June of 2013.)
    6/1/2013 - PDF - English - AENOR
    Learn More
    €67.00

  • BS EN 61587-3:2013

    Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297. Electromagnetic shielding performance tests for cabinets and subracks
    5/31/2013 - Paper - English - BSI
    Learn More
    €139.08

  • IEC 61191-1 (2013-05)

    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    5/21/2013 - PDF - English, French - CEI
    Learn More
    €264.00

  • IEC 60286-3 (2013-05)

    IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
    5/17/2013 - PDF - English, French - CEI
    Learn More
    €220.00

  • DIN EN 60917-2-5:2013-04

    Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Cabinet interface dimensions for miscellaneous equipment (IEC 60917-2-5:2012); German version EN 60917-2-5:2012
    4/1/2013 - PDF - German - DIN
    Learn More
    €96.00

  • DIN EN 61587-4 VDE 0687-587-4:2013-04

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 4: Combination of performance levels for modular cabinets (IEC 61587-4:2012); German version EN 61587-4:2012
    4/1/2013 - Paper - German - VDE
    Learn More
    €49.48

  • NF C93-471-4, NF EN 61587-4 (02/2013)

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 4 : combination of performance levels for modular cabinets
    2/9/2013 - PDF - French - AFNOR
    Learn More
    €73.94

  • IEC 61587-3 (2013-02)

    IEC 61587-3:2013 Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets and subracks
    2/6/2013 - PDF - English, French - CEI
    Learn More
    €77.00

  • NF C93-441-2-5, NF EN 60917-2-5 (02/2013)

    Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5 : sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Cabinet interface dimensions for miscellaneous equipment
    2/2/2013 - PDF - French - AFNOR
    Learn More
    €86.53

  • IPC 7095C:2013

    Design and Assembly Process Implementation for BGAs
    1/28/2013 - Paper - English - IPC
    Learn More
    €156.88

  • ANSI/VITA 58.1:2013

    Line Replaceable Integrated Electronics Chassis Standard, Liquid Cooled Chassis
    1/1/2013 - PDF sécurisé - English - VITA
    Learn More
    €21.25

  • DIN EN 61837-1:2012-12

    Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines (IEC 61837-1:2012); German version EN 61837-1:2012
    12/1/2012 - PDF - German - DIN
    Learn More
    €103.00

  • BS EN 61587-4:2012

    Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297 series. Combination of performance levels for modular cabinets
    11/30/2012 - Paper - English - BSI
    Learn More
    €139.08

  • UNE-EN 60917-2-5:2012

    Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Cabinet interface dimensions for miscellaneous equipment (Endorsed by AENOR in November of 2012.)
    11/1/2012 - PDF - English - AENOR
    Learn More
    €71.00

  • UNE-EN 61587-4:2012

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 4: Combination of performance levels for modular cabinets (Endorsed by AENOR in November of 2012.)
    11/1/2012 - PDF - English - AENOR
    Learn More
    €64.00

  • BS EN 60917-2-5:2012

    Modular order for the development of mechanical structures for electronic equipment practices. Sectional specification. Interface co-ordination dimensions for the 25 mm equipment practice. Cabinet interface dimensions for miscellaneous equipment
    10/31/2012 - Paper - English - BSI
    Learn More
    €193.80

  • DIN EN 60297-3-107 VDE 0687-297-3-107:2012-10

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small form factor (IEC 60297-3-107:2012); German version EN 60297-3-107:2012
    10/1/2012 - Paper - German - VDE
    Learn More
    €95.02

  • DIN EN 61969-3 VDE 0687-969-3:2012-09

    Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects (IEC 61969-3:2011); German version EN 61969-3:2012
    9/1/2012 - Paper - German - VDE
    Learn More
    €57.53

  • DIN EN 61969-1 VDE 0687-969-1:2012-09

    Mechanical structures for electronic equipment - Outdoor enclosures - Part 1: Design guidelines (IEC 61969-1:2011); German version EN 61969-1:2012
    9/1/2012 - Paper - German - VDE
    Learn More
    €53.63

  • DIN EN 61969-2 VDE 0687-969-2:2012-09

    Mechanical structures for electronic equipment - Outdoor enclosures - Part 2: Coordination dimensions (IEC 61969-2:2011); German version EN 61969-2:2012
    9/1/2012 - Paper - German - VDE
    Learn More
    €38.31

  • NF C93-471-1, NF EN 61587-1 (09/2012)

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1 : environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor conditions
    9/1/2012 - PDF - French - AFNOR
    Learn More
    €86.53

  • NF C93-476-1, NF EN 61969-1 (09/2012)

    Mechanical structures for electronic equipment - Outdoor enclosures - Part 1 : design guidelines
    9/1/2012 - PDF - French - AFNOR
    Learn More
    €73.94

  • NF C93-464-3-107, NF EN 60297-3-107 (09/2012)

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-107 : dimensions of subracks and plug-in units, small form factor
    9/1/2012 - PDF - French - AFNOR
    Learn More
    €106.80

  • IEC 61587-4 (2012-08)

    IEC 61587-4:2012 Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 4: Combination of performance levels for modular cabinets
    8/13/2012 - PDF - English, French - CEI
    Learn More
    €77.00

  • NF C93-476-3, NF EN 61969-3 (08/2012)

    Mechanical structures for electronic equipment - Outdoor enclosures - Part 3 : environmental requirements, tests and safety aspects
    8/1/2012 - PDF - French - AFNOR
    Learn More
    €73.94

  • NF C93-476-2, NF EN 61969-2 (08/2012)

    Mechanical structures for electronic equipment - Outdoor enclosures - Part 2 : coordination dimensions
    8/1/2012 - PDF - French - AFNOR
    Learn More
    €60.25

  • IEC 60917-2-5 (2012-07)

    IEC 60917-2-5:2012 Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Cabinet interface dimensions for miscellaneous equipment
    7/24/2012 - PDF - English, French - CEI
    Learn More
    €110.00

  • DIN EN 61587-2 VDE 0687-587-2:2012-06

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 2: Seismic tests for cabinets and racks (IEC 61587-2:2011); German version EN 61587-2:2011
    6/1/2012 - Paper - German - VDE
    Learn More
    €49.48

  • UNE-EN 61587-1:2012

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 1: Environmental requirements, test set-up and safety aspects for cabinets, racks, subracks and chassis under indoor conditions (Endorsed by AENOR in June of 2012.)
    6/1/2012 - PDF - English - AENOR
    Learn More
    €74.00

  • UNE-EN 60297-3-107:2012

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small form factor (Endorsed by AENOR in June of 2012.)
    6/1/2012 - PDF - English - AENOR
    Learn More
    €81.00

  • BS EN 60297-3-107:2012

    Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Dimensions of subracks and plug-in units, small form factor
    4/30/2012 - Paper - English - BSI
    Learn More
    €225.72

  • UNE-EN 61969-1:2012

    Mechanical structures for electronic equipment - Outdoor enclosures - Part 1: Design guidelines (Endorsed by AENOR in April of 2012.)
    4/1/2012 - PDF - English - AENOR
    Learn More
    €61.00

  • UNE-EN 61969-2:2012

    Mechanical structures for electronic equipment - Outdoor enclosures - Part 2: Coordination dimensions (Endorsed by AENOR in April of 2012.)
    4/1/2012 - PDF - English - AENOR
    Learn More
    €40.00

  • UNE-EN 61969-3:2012

    Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects (Endorsed by AENOR in April of 2012.)
    4/1/2012 - PDF - English - AENOR
    Learn More
    €62.00

  • BS EN 61969-1:2012

    Mechanical structures for electronic equipment. Outdoor enclosures. Design guidelines
    2/29/2012 - Paper - English - BSI
    Learn More
    €139.08

  • BS EN 61969-2:2012

    Mechanical structures for electronic equipment. Outdoor enclosures. Coordination dimensions
    2/29/2012 - Paper - English - BSI
    Learn More
    €116.28

  • BS EN 61969-3:2012

    Mechanical structures for electronic equipment. Outdoor enclosures. Environmental requirements, tests and safety aspects
    2/29/2012 - Paper - English - BSI
    Learn More
    €139.08

  • IPC J-STD-033C:2012

    Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
    2/3/2012 - Paper - English - IPC
    Learn More
    €83.74

  • ASTM F18-12 + Redline

    Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices
    2/1/2012 - PDF - English - ASTM
    Learn More
    €49.00

  • ASTM F18-12(2017)

    Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices
    2/1/2012 - PDF - English - ASTM
    Learn More
    €39.00

  • UNE-EN 61587-2:2011

    Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 2: Seismic tests for cabinets and racks (Endorsed by AENOR in February of 2012.)
    2/1/2012 - PDF - English - AENOR
    Learn More
    €65.00

  • IEC 60297-3-107 (2012-01)

    IEC 60297-3-107:2012 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small form factor
    1/10/2012 - PDF - English, French - CEI
    Learn More
    €220.00

  • DIN EN 60191-6-12:2011-12

    Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011
    12/1/2011 - PDF - German - DIN
    Learn More
    €96.00

  • BS EN 61587-2:2011

    Mechanical structures for electronic equipment. Tests for IEC 60917 and IEC 60297. Seismic tests for cabinets and racks
    11/30/2011 - Paper - English - BSI
    Learn More
    €139.08

  • IEC 61969-1 (2011-11)

    IEC 61969-1:2011 Mechanical structures for electronic equipment - Outdoor enclosures - Part 1: Design guidelines
    11/17/2011 - PDF - English, French - CEI
    Learn More
    €44.00

  • IEC 61969-2 (2011-11)

    IEC 61969-2:2011 Mechanical structures for electronic equipment - Outdoor enclosures - Part 2: Coordination dimensions
    11/17/2011 - PDF - English, French - CEI
    Learn More
    €22.00

  • IEC 61969-3 (2011-11)

    IEC 61969-3:2011 Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Environmental requirements, tests and safety aspects
    11/17/2011 - PDF - English, French - CEI
    Learn More
    €77.00

  • ASTM E2444-11e1

    Terminology Relating to Measurements Taken on Thin, Reflecting Films
    10/15/2011 - PDF - English - ASTM
    Learn More
    €35.00

  • DIN EN 60191-6-17:2011-09

    Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
    9/1/2011 - PDF - German - DIN
    Learn More
    €114.10

  • DD IEC/TS 62610-2:2011

    Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series. Design guide. Method for the determination of forced air-cooling structure
    8/31/2011 - Paper - English - BSI
    Learn More
    €139.08

  • IEC 61587-2 (2011-08)

    IEC 61587-2:2011 Mechanical structures for electronic equipment - Tests for IEC 60917 and 60297 - Part 2: Seismic tests for cabinets and racks
    8/25/2011 - PDF - English, French - CEI
    Learn More
    €77.00

  • DIN EN 60368-3:2011-08

    Piezoelectric filters of assessed quality - Part 3: Standard outlines and lead connections (IEC 60368-3:2010); German version EN 60368-3:2010
    8/1/2011 - PDF - German - DIN
    Learn More
    €96.00

  • IEC/TS 62610-2 (2011-07)

    IEC TS 62610-2:2011 Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 2: Design guide: Method for determination of forced air-cooling structure
    7/26/2011 - PDF - English, French - CEI
    Learn More
    €110.00

  • DIN EN 60191-6-20:2011-03

    Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
    3/1/2011 - PDF - German - DIN
    Learn More
    €82.60

  • DIN EN 60191-6-21:2011-03

    Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
    3/1/2011 - PDF - German - DIN
    Learn More
    €96.00

  • DIN EN 60297-3-106:2011-01

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1 (IEC 60297-3-106:2010); German version EN 60297-3-106:2010
    1/1/2011 - PDF - German - DIN
    Learn More
    €96.00

  • DIN EN 60917-2-4:2011-01

    Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface coordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in) (IEC 60917-2-4:2010); German version EN 60917-2-4:2010
    1/1/2011 - PDF - German - DIN
    Learn More
    €89.00

  • DIN EN 60191-6-19:2010-10

    Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010
    10/1/2010 - PDF - German - DIN
    Learn More
    €89.00

  • UNE-EN 61760-3:2010

    Surface mounting technology -- Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (Endorsed by AENOR in September of 2010.)
    9/1/2010 - PDF - English - AENOR
    Learn More
    €74.00

  • DIN EN 60191-6-18:2010-08

    Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
    8/1/2010 - PDF - German - DIN
    Learn More
    €103.00

  • PD CLC/TR 50484:2009

    Recommendations for shielded enclosures
    7/31/2010 - Paper - English - BSI
    Learn More
    €139.08

  • NF C93-441-2-4, NF EN 60917-2-4 (07/2010)

    Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4 : sectional specification - Interface coordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in)
    7/1/2010 - PDF - French - AFNOR
    Learn More
    €73.94

  • NF C93-464-3-106, NF EN 60297-3-106 (07/2010)

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106 : adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1
    7/1/2010 - PDF - French - AFNOR
    Learn More
    €73.94

  • UNE-EN 60917-2-4:2010

    Modular order for the development of mechanical structures for electronic equipment practices -- Part 2-4: Sectional specification - Interface coordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in) (Endorsed by AENOR in July of 2010.)
    7/1/2010 - PDF - English - AENOR
    Learn More
    €65.00

  • UNE-EN 60297-3-106:2010

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series -- Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1 (Endorsed by AENOR in July of 2010.)
    7/1/2010 - PDF - English - AENOR
    Learn More
    €67.00

  • DIN EN 60191-6:2010-06

    Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009
    6/1/2010 - PDF - German - DIN
    Learn More
    €136.80

  • BS EN 60297-3-106:2010

    Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1
    5/31/2010 - Paper - English - BSI
    Learn More
    €139.08

  • BS EN 60917-2-4:2010

    Modular order for the development of mechanical structures for electronic equipment practices. Sectional specification. Interface coordination dimensions for the 25 mm equipment practice. Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in)
    5/31/2010 - Paper - English - BSI
    Learn More
    €139.08

  • IEC 60297-3-106 (2010-03)

    IEC 60297-3-106:2010 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1
    3/16/2010 - PDF - English, French - CEI
    Learn More
    €77.00

  • IEC 60917-2-4 (2010-03)

    IEC 60917-2-4:2010 Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in)
    3/16/2010 - PDF - English, French - CEI
    Learn More
    €77.00

  • DD IEC/TS 62610-3:2009

    Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series. Design guide. Evaluation method for thermoelectrical cooling systems (Peltier effect)
    2/28/2010 - Paper - English - BSI
    Learn More
    €225.72

  • DD IEC/TS 62610-1:2009

    Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series. Design guide. Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)
    1/31/2010 - Paper - English - BSI
    Learn More
    €193.80

  • IEC/TS 62610-3 (2009-12)

    IEC TS 62610-3:2009 Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect)
    12/14/2009 - PDF - English - CEI
    Learn More
    €187.00

  • DIN IEC 62610-2:2009-12

    Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 - Part 2: Design guide: Method for determination of forced air-cooling structure (IEC 48D/402/CD:2009)
    12/1/2009 - PDF - English, German - DIN
    Learn More
    €89.00

  • IEC 60917-1 Edition 1.1 (2009-11)

    IEC 60917-1:1998+AMD1:2000 consolidated version Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard
    11/25/2009 - PDF - English, French - CEI
    Learn More
    €165.00

  • IEC/TS 62610-1 (2009-09)

    IEC TS 62610-1:2009 Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)
    9/16/2009 - PDF - English - CEI
    Learn More
    €154.00

  • DIN EN 60297-3-100:2009-09

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets (IEC 60297-3-100:2008); German version EN 60297-3-100:2009
    9/1/2009 - PDF - German - DIN
    Learn More
    €89.00

  • DIN EN 60297-3-105:2009-09

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105: Dimensions and design aspects for 1U high chassis (IEC 60297-3-105:2008); German version EN 60297-3-105:2009
    9/1/2009 - PDF - German - DIN
    Learn More
    €96.00

  • UNE-EN 60286-2:2009

    Packaging of components for automatic handling - Part 2: Packaging of components with unidirectional leads on continuous tapes (Endorsed by AENOR in March of 2009.)
    3/1/2009 - PDF - English - AENOR
    Learn More
    €81.00

  • UNE-EN 60297-3-100:2009

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series -- Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets (Endorsed by AENOR in March of 2009.)
    3/1/2009 - PDF - English - AENOR
    Learn More
    €67.00

  • UNE-EN 60297-3-105:2009

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series -- Part 3-105: Dimensions and design aspects for 1U high chassis (Endorsed by AENOR in March of 2009.)
    3/1/2009 - PDF - English - AENOR
    Learn More
    €67.00

  • BS EN 60297-3-105:2009

    Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Dimensions and design aspects for 1U high chassis
    2/28/2009 - Paper - English - BSI
    Learn More
    €139.08

  • BS EN 60297-3-100:2009

    Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Basic dimensions of front panels, subracks, chassis, racks and cabinets
    2/28/2009 - Paper - English - BSI
    Learn More
    €139.08

  • NF C93-464-3-105, NF EN 60297-3-105 (02/2009)

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105 : dimensions and design aspects for 1U high chassis
    2/1/2009 - PDF - French - AFNOR
    Learn More
    €73.94

  • NF C93-464-3-100, NF EN 60297-3-100 (02/2009)

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-100 : basic dimensions of front panels, subracks, chassis, racks and cabinets
    2/1/2009 - PDF - French - AFNOR
    Learn More
    €73.94

  • ANSI/VITA 58.0:2009

    Line Replaceable Integrated Electronics Chassis Standard
    1/1/2009 - PDF sécurisé - English - VITA
    Learn More
    €21.25

  • IEC 60297-3-100 (2008-11)

    IEC 60297-3-100:2008 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets
    11/26/2008 - PDF - English, French - CEI
    Learn More
    €77.00

  • IEC 60297-3-105 (2008-11)

    IEC 60297-3-105:2008 Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105: Dimensions and design aspects for 1U high chassis
    11/26/2008 - PDF - English, French - CEI
    Learn More
    €110.00

  • DD IEC/TS 62454:2007

    Mechanical structures for electronic equipment. Design guide. Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series
    11/30/2007 - Paper - English - BSI
    Learn More
    €139.08

  • DIN EN 60191-6-16:2007-11

    Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007
    11/1/2007 - PDF - German - DIN
    Learn More
    €75.40

  • DIN EN 60191-1:2007-11

    Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2007); German version EN 60191-1:2007
    11/1/2007 - PDF - German - DIN
    Learn More
    €114.10

  • IEC/TS 62454 (2007-10)

    IEC TS 62454:2007 Mechanical structures for electronic equipment - Design guide: Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series
    10/10/2007 - PDF - English, French - CEI
    Learn More
    €154.00

  • BS EN 60684-3-248:2007

    Flexible insulating sleeving. Specifications for individual types of sleeving. General purpose, heat-shrinkable, dual wall polyolefin sleeving, flame retarded, shrink ratios 2:1, 3:1, 4:1
    6/29/2007 - Paper - English - BSI
    Learn More
    €139.08

  • BS EN 60297-3-104:2006

    Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6mm(19 in) series. Connector dependent interface dimensions of subracks and plug-in units
    4/30/2007 - Paper - English - BSI
    Learn More
    €139.08

  • IEC 61760-2 (2007-04)

    IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
    4/24/2007 - PDF - English - CEI
    Learn More
    €44.00

  • IEC 61760-2 (2007-04)

    IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
    4/24/2007 - PDF - English, French - CEI
    Learn More
    €44.00

  • DIN EN 60297-3-104:2007-03

    Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-104: Connector dependent interface dimensions of subracks and plug-in units (IEC 60297-3-104:2006); German version EN 60297-3-104:2006
    3/1/2007 - PDF - German - DIN
    Learn More
    €82.60

  • DIN EN 60917-2-3:2007-02

    Modular order for the development of mechanical structures for electronic equipment practices - Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units (IEC 60917-2-3:2006); German version EN 60917-2-3:2006
    2/1/2007 - PDF - German - DIN
    Learn More
    €114.10

  • DIN EN 60749-39:2007-01

    Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006
    1/1/2007 - PDF - German - DIN
    Learn More
    €54.80

  • BS EN 61760-1:2006

    Surface mounting technology. Standard method for the specification of surface mounting components (SMDs)
    9/29/2006 - Paper - English - BSI
    Learn More
    €225.72

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