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31.190 : Electronic component assemblies

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  • DIN EN 62878-1:2018-10

    Device embedded substrate - Generic specification (IEC 91/1509/CD:2018); Text in German and English
    10/1/2018 - PDF - English, German - DIN
    Learn More
    €103.00

  • IEC 61191-1 (2018-09)

    IEC 61191-1:2018 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    9/14/2018 - PDF - English, French - CEI
    Learn More
    €264.00

  • IEC 61191-1 Redline version (2018-09)

    IEC 61191-1:2018 RLV Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    9/14/2018 - PDF - English - CEI
    Learn More
    €343.00

  • PR NF C20-700-2-69/A1, PR NF EN 60068-2-69/A1 (09/2018)

    Environmental testing - Part 2-69 : tests - Test Te/Tc : solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    9/11/2018 - Paper - French - AFNOR
    Learn More
    €32.19

  • DIN EN IEC 61190-1-3:2018-09

    Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018
    9/1/2018 - PDF - German - DIN
    Learn More
    €136.80

  • PR NF C93-711-6-4, PR NF EN 61188-6-4 (07/2018)

    Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design
    7/10/2018 - Paper - French - AFNOR
    Learn More
    €74.76

  • DIN EN 60068-2-69/A1 VDE 0468-2-69/A1:2018-06

    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 91/1499/CD:2018); Text in German und English
    6/1/2018 - Paper - German - VDE
    Learn More
    €16.21

  • BS EN 60068-2-69:2017

    Environmental testing. Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    5/9/2018 - Paper - English - BSI
    Learn More
    €271.32

  • SAE ARP 5890B:2018-05-07

    Guidelines for Preparing Reliability Assessment Plans for Electronic Engine Controls
    5/7/2018 - PDF - English - SAE
    Learn More
    €66.30

  • NF C90-710-4/A1, NF EN 61760-4/A1 (05/2018)

    Surface mounting technology - Part 4 : classification, packaging, labelling and handling of moisture sensitive devices
    5/4/2018 - PDF - French - UTE
    Learn More
    €45.98

  • DIN EN 61191-2:2018-05

    Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017
    5/1/2018 - PDF - German - DIN
    Learn More
    €119.60

  • DIN EN 60068-2-69 Berichtigung 1 VDE 0468-2-69 Berichtigung 1:2018-05

    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017/COR1:2018); German version EN 60068-2-69:2017/AC:2018-03
    5/1/2018 - Paper - German - VDE
    Learn More
    €0.00

  • IPC J-STD-001GS:2018

    Requirements for Soldered Electrical and Electronic Assemblies; Addendum: Space and Military Applications Electronic Hardware
    4/4/2018 - Paper - English - IPC
    Learn More
    €132.50

  • IPC J-STD-001GS:2018

    Requirements for Soldered Electrical and Electronic Assemblies; Addendum: Space and Military Applications Electronic Hardware
    4/4/2018 - Paper - French - IPC
    Learn More
    €248.04

  • UNE-EN IEC 61190-1-3:2018

    Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Española de Normalización in April of 2018.)
    4/1/2018 - PDF - English - AENOR
    Learn More
    €89.00

  • IEC 61760-4 Edition 1.1 (2018-03)

    IEC 61760-4:2015+AMD1:2018 consolidated version Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
    3/13/2018 - PDF - English, French - CEI
    Learn More
    €303.00

  • IEC 61760-4 AMD 1 (2018-03)

    IEC 61760-4:2015/AMD1:2018 Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
    3/13/2018 - PDF - English, French - CEI
    Learn More
    €11.00

  • PR NF C90-703, PR NF EN 61191-1 (03/2018)

    Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    3/9/2018 - Paper - French - AFNOR
    Learn More
    €78.69

  • NF C90-700-1-3, NF EN IEC 61190-1-3 (03/2018)

    Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
    3/9/2018 - PDF - French - UTE
    Learn More
    €106.80

  • NF C90-700-1-3, NF EN IEC 61190-1-3 (03/2018)

    Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
    3/9/2018 - PDF - English - UTE
    Learn More
    €106.80

  • DIN EN 60068-2-69 VDE 0468-2-69:2018-01

    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017); German version EN 60068-2-69:2017
    1/1/2018 - Paper - German - VDE
    Learn More
    €121.28

  • IEC 60194-2 (2017-12)

    IEC 60194-2:2017 Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
    12/13/2017 - PDF - English - CEI
    Learn More
    €264.00

  • IEC 61190-1-3 (2017-12)

    IEC 61190-1-3:2017 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
    12/13/2017 - PDF - English, French - CEI
    Learn More
    €264.00

  • DIN EN 61188-7:2017-12

    Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017
    12/1/2017 - PDF - German - DIN
    Learn More
    €103.00

  • DIN EN 61188-6-4:2017-12

    Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design (IEC 91/1452/CD:2017)
    12/1/2017 - PDF - English, German - DIN
    Learn More
    €147.20

  • DIN EN 62090:2017-12

    Product package labels for electronic components using bar code and two- dimensional symbologies (IEC 62090:2017); German version EN 62090:2017
    12/1/2017 - PDF - German - DIN
    Learn More
    €119.60

  • UNE-EN 61191-2:2017

    Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.)
    11/1/2017 - PDF - English - AENOR
    Learn More
    €84.00

  • IPC J-STD-001G:2017

    Requirements for Soldered Electrical and Electronic Assemblies
    10/31/2017 - Paper - English - IPC
    Learn More
    €169.60

  • IPC A-610G:2017

    Acceptability of Electronic Assemblies
    10/31/2017 - Paper - English - IPC
    Learn More
    €201.40

  • IPC J-STD-001G:2017

    Requirements for Soldered Electrical and Electronic Assemblies
    10/31/2017 - Paper - French - IPC
    Learn More
    €248.04

  • BS EN 61191-2:2017

    Printed board assemblies. Sectional specification. Requirements for surface mount soldered assemblies
    10/26/2017 - Paper - English - BSI
    Learn More
    €225.72

  • IPC-A-47-G

    Composite Test Pattern Ten-Layer Phototool - D-350 Format
    9/16/2017 - CD-Rom - English - IPC
    Learn More
    €347.68

  • NF C20-700-2-69, NF EN 60068-2-69 (08/2017)

    Environmental testing - Part 2-69 : tests - Test Te/Tc : solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    8/5/2017 - PDF - French - UTE
    Learn More
    €128.70

  • NF C20-700-2-69, NF EN 60068-2-69 (08/2017)

    Environmental testing - Part 2-69 : tests - Test Te/Tc : solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    8/5/2017 - PDF - English - UTE
    Learn More
    €128.70

  • UNE-EN 62090:2017

    Product package labels for electronic components using bar code and two- dimensional symbologies (Endorsed by Asociación Española de Normalización in August of 2017.)
    8/1/2017 - PDF - English - AENOR
    Learn More
    €80.00

  • BS EN 62090:2017

    Product package labels for electronic components using bar code and two- dimensional symbologies
    7/31/2017 - Paper - English - BSI
    Learn More
    €225.72

  • IEC 60068-2-58 AMD 1 (2017-07)

    IEC 60068-2-58:2015/AMD1:2017 Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    7/28/2017 - PDF - English - CEI
    Learn More
    €22.00

  • IEC 60068-2-58 Edition 4.1 (2017-07)

    IEC 60068-2-58:2015+AMD1:2017 consolidated version Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    7/28/2017 - PDF - English - CEI
    Learn More
    €330.00

  • UNE-EN 60068-2-69:2017

    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Española de Normalización in July of 2017.)
    7/1/2017 - PDF - English - AENOR
    Learn More
    €99.00

  • IEC 61191-2 (2017-05)

    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    5/23/2017 - PDF - English - CEI
    Learn More
    €220.00

  • UNE-EN 62739-3:2017

    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods (Endorsed by Asociación Española de Normalización in May of 2017.)
    5/1/2017 - PDF - English - AENOR
    Learn More
    €80.00

  • BS EN 62739-3:2017

    Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Selection guidance of erosion test methods
    4/30/2017 - Paper - English - BSI
    Learn More
    €225.72

  • IEC 62090 (2017-04)

    IEC 62090:2017 Product package labels for electronic components using bar code and two-dimensional symbologies
    4/11/2017 - PDF - English - CEI
    Learn More
    €220.00

  • IEC 60068-2-69 (2017-03)

    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    3/7/2017 - PDF - English, French - CEI
    Learn More
    €297.00

  • IEC 62739-3 (2017-01)

    IEC 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
    1/6/2017 - PDF - English - CEI
    Learn More
    €220.00

  • IPC 7711/21C:2017

    Rework, Modification and Repair of Electronic Assemblies
    1/1/2017 - Paper - English - IPC
    Learn More
    €349.80

  • JIS C 60068-2-58:2016

    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    12/20/2016 - PDF - Japanese - JSA
    Learn More
    €46.02

  • NF C93-742-2, NF EN 62739-2 (12/2016)

    Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2 : erosion test method for metal materials with surface processing
    12/16/2016 - PDF - French - UTE
    Learn More
    €73.94

  • NF C93-742-2, NF EN 62739-2 (12/2016)

    Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2 : erosion test method for metal materials with surface processing
    12/16/2016 - PDF - English - UTE
    Learn More
    €73.94

  • UNE-EN 62739-2:2016

    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing (Endorsed by AENOR in November of 2016.)
    11/1/2016 - PDF - English - AENOR
    Learn More
    €68.00

  • BS EN 62739-2:2016

    Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Erosion test method for metal materials with surface processing
    10/31/2016 - Paper - English - BSI
    Learn More
    €139.08

  • NF C93-711-5-3, NF EN 61188-5-3 (08/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-3 : attachment (land/joint) considerations - Components with gull-wing leads on two sides
    8/13/2016 - PDF - French - UTE
    Learn More
    €97.45

  • NF C93-711-5-4, NF EN 61188-5-4 (07/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-4 : attachment (land/joint) consideration - Components with J leads on two sides
    7/29/2016 - PDF - French - UTE
    Learn More
    €73.94

  • NF C93-711-5-5, NF EN 61188-5-5 (07/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-5 : Attachment (land/joint) considerations - Components with gull-wing leads on four sides
    7/15/2016 - PDF - French - UTE
    Learn More
    €118.29

  • NF C93-711-5-8, NF EN 61188-5-8 (07/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-8 : Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
    7/15/2016 - PDF - French - UTE
    Learn More
    €97.45

  • IEC 62739-2 (2016-07)

    IEC 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
    7/13/2016 - PDF - English, French - CEI
    Learn More
    €77.00

  • JIS C 62137-4:2016

    Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
    3/22/2016 - PDF - Japanese - JSA
    Learn More
    €46.02

  • DIN EN 61189-2-721:2016-03

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (IEC 61189-2-721:2015); German version EN 61189-2-721:2015
    3/1/2016 - PDF - German - DIN
    Learn More
    €108.80

  • PD IEC/TR 62878-2-2:2015

    Device embedded substrate. Guidelines. Electrical testing
    12/31/2015 - Paper - English - BSI
    Learn More
    €139.08

  • IEC/TR 62878-2-2 (2015-12)

    IEC TR 62878-2-2:2015 Device embedded substrate - Part 2-2: Guidelines - Electrical testing
    12/4/2015 - PDF - English, French - CEI
    Learn More
    €77.00

  • NF C93-778-1-1, NF EN 62878-1-1 (10/2015)

    Device embedded substrate - Part 1-1 : generic specification - Test methods
    10/16/2015 - PDF - French - UTE
    Learn More
    €128.70

  • NF C90-710-4, NF EN 61760-4 (10/2015)

    Surface mounting technology - Part 4 : classification, packaging, labelling and handling of moisture sensitive devices
    10/16/2015 - PDF - French - UTE
    Learn More
    €106.80

  • PD IEC/PAS 62878-2-5:2015

    Device embedded substrate. Guidelines. Data format
    8/31/2015 - Paper - English - BSI
    Learn More
    €225.72

  • IEC/PAS 62878-2-5 (2015-08)

    IEC PAS 62878-2-5:2015 Device embedded substrate - Guidelines - Data format
    8/5/2015 - PDF - English - CEI
    Learn More
    €220.00

  • UNE-EN 62878-1-1:2015

    Device embedded substrate - Part 1-1: Generic specification - Test methods (Endorsed by AENOR in August of 2015.)
    8/1/2015 - PDF - English - AENOR
    Learn More
    €103.00

  • BS EN 61760-4:2015+A1:2018

    Surface mounting technology. Classification, packaging, labelling and handling of moisture sensitive devices
    7/31/2015 - Paper - English - BSI
    Learn More
    €225.72

  • BS EN 62878-1-1:2015

    Device embedded substrate. Generic specification. Test methods
    7/31/2015 - Paper - English - BSI
    Learn More
    €271.32

  • NF C93-704-4, NF EN 62137-4 (07/2015)

    Electronics assembly technology - Part 4 : endurance test methods for solder joint of area array type package surface mount devices
    7/10/2015 - PDF - French - UTE
    Learn More
    €106.80

  • DIN EN 62137-4:2015-07

    Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015
    7/1/2015 - PDF - German - DIN
    Learn More
    €136.80

  • UNE-EN 60068-2-58:2015

    Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by AENOR in June of 2015.)
    6/1/2015 - PDF - English - AENOR
    Learn More
    €83.00

  • BS EN 60068-2-58:2015+A1:2018

    Environmental testing. Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    5/31/2015 - Paper - English - BSI
    Learn More
    €255.36

  • IEC 62878-1-1 (2015-05)

    IEC 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    5/20/2015 - PDF - English, French - CEI
    Learn More
    €297.00

  • IEC 61760-4 (2015-05)

    IEC 61760-4:2015 Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
    5/19/2015 - PDF - English, French - CEI
    Learn More
    €220.00

  • PD IEC/TS 62878-2-1:2015

    Device embedded substrate. Guidelines. General description of technology
    4/30/2015 - Paper - English - BSI
    Learn More
    €225.72

  • PD IEC/TS 62878-2-4:2015

    Device embedded substrate. Guidelines. Test element groups (TEG)
    4/30/2015 - Paper - English - BSI
    Learn More
    €225.72

  • PD IEC/TS 62878-2-3:2015

    Device embedded substrate. Guidelines. Design guide
    4/30/2015 - Paper - English - BSI
    Learn More
    €193.80

  • IEC 60194 (2015-04)

    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    4/15/2015 - PDF - English, French - CEI
    Learn More
    €385.00

  • IEC/TS 62878-2-1 (2015-03)

    IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
    3/30/2015 - PDF - English, French - CEI
    Learn More
    €187.00

  • IEC/TS 62878-2-3 (2015-03)

    IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
    3/27/2015 - PDF - English, French - CEI
    Learn More
    €154.00

  • IEC/TS 62878-2-4 (2015-03)

    IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
    3/27/2015 - PDF - English, French - CEI
    Learn More
    €220.00

  • IEC 60068-2-58 (2015-03)

    IEC 60068-2-58:2015 Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    3/27/2015 - PDF - English, French - CEI
    Learn More
    €220.00

  • SAE EIA 933B:2015-03-01

    Requirements for a COTS Assembly Management Plan
    3/1/2015 - PDF - English - SAE
    Learn More
    €66.30

  • BS EN 62137-4:2014

    Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices
    2/28/2015 - Paper - English - BSI
    Learn More
    €255.36

  • NF C93-711-7, NF EN 61188-7 (02/2015)

    Printed board and printed board assemblies - Design and use - Part 7 : electronic component zero orientation for CAD library construction
    2/14/2015 - PDF - French - UTE
    Learn More
    €86.53

  • UNE-EN 62137-4:2014

    Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (Endorsed by AENOR in February of 2015.)
    2/1/2015 - PDF - English - AENOR
    Learn More
    €86.00

  • €33.18

  • ANSI/ESD SP 14.5:2015

    ESD Association Standard Practice for Electrostatic Discharge Sensitivity Testing - Near Field Immunity Scanning - Component/Module/PCB Level
    1/1/2015 - PDF sécurisé - English - ESD
    Learn More
    €118.80

  • NF C93-725, NF EN 62421 (11/2014)

    Electronics assembly technology - Electronic modules
    11/29/2014 - PDF - French - UTE
    Learn More
    €73.94

  • DIN EN 61190-1-2:2014-11

    Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014
    11/1/2014 - PDF - German - DIN
    Learn More
    €103.00

  • NF C90-700-1-2, NF EN 61190-1-2 (10/2014)

    Attachment materials for electronic assembly - Part 1-2 : requirements for soldering pastes for high-quality interconnects in electronics assembly
    10/24/2014 - PDF - French - UTE
    Learn More
    €86.53

  • IEC 62137-4 (2014-10)

    IEC 62137-4:2014 Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
    10/9/2014 - PDF - English, French - CEI
    Learn More
    €264.00

  • JIS C 61188-7:2014

    Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
    9/22/2014 - PDF - Japanese - JSA
    Learn More
    €25.00

  • JIS C 62137-3:2014

    Electronics Assembly Technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
    9/22/2014 - PDF - Japanese - JSA
    Learn More
    €46.02

  • IPC A-610F:2014 - include Emendamento 1 - Hard Copy ( Italian Language)

    Acceptability of Electronic Assemblies
    7/1/2014 - Paper - Italian - IPC
    Learn More
    €178.08

  • UNE-EN 61190-1-2:2014

    Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (Endorsed by AENOR in July of 2014.)
    7/1/2014 - PDF - English - AENOR
    Learn More
    €74.00

  • IPC A-610F:2014 - Hard Copy (Dutch Language)

    Acceptability of Electronic Assemblies
    7/1/2014 - Paper - Dutch - IPC
    Learn More
    €236.38

  • BS EN 61190-1-2:2014

    Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
    6/30/2014 - Paper - English - BSI
    Learn More
    €193.80

  • JIS Z 3284-1:2014

    Solder paste - Part 1: Kinds and quality classification
    6/20/2014 - PDF - Japanese - JSA
    Learn More
    €33.33

  • IPC 8701:2014

    Final Acceptance Criteria Standard for PV Modules-Final Module Assembly
    6/1/2014 - Paper - English - IPC
    Learn More
    €156.88

  • NF C93-742-1, NF EN 62739-1 (04/2014)

    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1 : erosion test method for metal materials without surface processing
    4/26/2014 - PDF - French - UTE
    Learn More
    €73.94

  • NF C90-704, NF EN 61191-2 (04/2014)

    Printed board assemblies - Part 2 : sectional specification - Requirements for surface mount soldered assemblies
    4/19/2014 - PDF - French - UTE
    Learn More
    €97.45

  • NF C93-704-1-1, NF EN 62137-1-1 (03/2014)

    Surface-mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1 : pull strength test
    3/19/2014 - PDF - French - UTE
    Learn More
    €73.94

  • NF C93-704-1-2, NF EN 62137-1-2 (03/2014)

    Surface-mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2 : shear strength test
    3/19/2014 - PDF - French - UTE
    Learn More
    €86.53

  • NF C90-703, NF EN 61191-1 (03/2014)

    Printed board assemblies - Part 1 : generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    3/19/2014 - PDF - French - UTE
    Learn More
    €118.29

  • IEC 61190-1-2 (2014-02)

    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    2/19/2014 - PDF - English, French - CEI
    Learn More
    €154.00

  • IPC 9706:2014

    Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
    1/14/2014 - Paper - English - IPC
    Learn More
    €156.88

  • IPC DVD:18C

    Soldering Terminals is a professional quality educational tool to demostrate how to properly solder wires to terminals, in accordance with the latest IPC-A-610E / J-STD-001E acceptance standards.
    1/10/2014 - dvd - English - IPC
    Learn More
    €750.00

  • IPC 9709:2013

    Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
    12/9/2013 - Paper - English - IPC
    Learn More
    €83.74

  • UNE-EN 61191-2:2013

    Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by AENOR in November of 2013.)
    11/1/2013 - PDF - English - AENOR
    Learn More
    €77.00

  • DIN EN 62699:2013-10

    Mapping rules and exchange methods for heterogeneous parts libraries (IEC 91/1078/CDV:2013); German version FprEN 62699:2013
    10/1/2013 - PDF - German - DIN
    Learn More
    €119.60

  • UNE-EN 61191-1:2013

    Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by AENOR in October of 2013.)
    10/1/2013 - PDF - English - AENOR
    Learn More
    €92.00

  • UNE-EN 62739-1:2013

    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (Endorsed by AENOR in October of 2013.)
    10/1/2013 - PDF - English - AENOR
    Learn More
    €71.00

  • BS EN 62739-1:2013

    Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Erosion test method for metal materials without surface processing
    9/30/2013 - Paper - English - BSI
    Learn More
    €139.08

  • NF C20-700-2-21, NF EN 60068-2-21 (09/2013)

    Environmental testing - Part 2-21 : tests - Test U : robustness of terminations and integral mounting devices
    9/14/2013 - PDF - English, French - UTE
    Learn More
    €97.45

  • NF C20-700-2-69, NF EN 60068-2-69 (09/2013)

    Environmental testing - Part 2-69 : tests - Test Te : solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
    9/7/2013 - PDF - French - UTE
    Learn More
    €86.53

  • BS EN 61193-3:2013

    Quality assessment systems. Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
    6/30/2013 - Paper - English - BSI
    Learn More
    €271.32

  • IEC 62739-1 (2013-06)

    IEC 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
    6/18/2013 - PDF - English, French - CEI
    Learn More
    €110.00

  • UNE-EN 61193-3:2013

    Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (Endorsed by AENOR in June of 2013.)
    6/1/2013 - PDF - English - AENOR
    Learn More
    €111.00

  • IPC ROADMAP-13:2013

    2013 IPC International Technology Roadmap for Electronic Interconnections
    2/26/2013 - Paper - English - IPC
    Learn More
    €265.00

  • IEC 61193-3 (2013-01)

    IEC 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
    1/24/2013 - PDF - English, French - CEI
    Learn More
    €330.00

  • DIN EN 62137-3:2012-08

    Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011); German version EN 62137-3:2012
    8/1/2012 - PDF - German - DIN
    Learn More
    €141.90

  • NF C93-704-3, NF EN 62137-3 (07/2012)

    Electronics assembly technology - Part 3 : selection guidance of environmental and endurance test methods for solder joints
    7/1/2012 - PDF - French - UTE
    Learn More
    €118.29

  • UNE-EN 62137-3:2012

    Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (Endorsed by AENOR in April of 2012.)
    4/1/2012 - PDF - English - AENOR
    Learn More
    €86.00

  • BS EN 62137-3:2012

    Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints
    3/31/2012 - Paper - English - BSI
    Learn More
    €255.36

  • JIS Z 3197:2012

    Test methods for soldering fluxes
    3/21/2012 - PDF - Japanese - JSA
    Learn More
    €64.10

  • IPC AJ-820A:2012

    Assembly & Joining Handbook
    2/21/2012 - Paper - English - IPC
    Learn More
    €156.88

  • IPC 9704A:2012

    Printed Circuit Assembly Strain Gage Test Guideline
    2/3/2012 - Paper - English - IPC
    Learn More
    €156.88

  • ITU-T L.1100

    Procedure for recycling rare metals in information and communication technology goods
    2/1/2012 - PDF - English - ITU
    Learn More
    €25.00

  • NF C20-783, NF EN 60068-2-83 (01/2012)

    Environmental testing - Part 2-83 : tests - Test Tf : solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
    1/1/2012 - PDF - French - UTE
    Learn More
    €106.80

  • BS EN 60068-2-83:2011

    Environmental testing. Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
    11/30/2011 - Paper - English - BSI
    Learn More
    €225.72

  • IEC 62137-3 (2011-11)

    IEC 62137-3:2011 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
    11/8/2011 - PDF - English, French - CEI
    Learn More
    €264.00

  • IPC 9707:2011

    Spherical Bend Test Method for Characterization of Board Level Interconnects
    9/13/2011 - Paper - English - IPC
    Learn More
    €169.60

  • IEC 60068-2-83 (2011-09)

    IEC 60068-2-83:2011 Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
    9/7/2011 - PDF - English, French - CEI
    Learn More
    €220.00

  • EIA-933-A:2011

    Standard for Preparing a COTS Assembly Management Plan
    8/1/2011 - PDF sécurisé - English - EIA
    Learn More
    €83.30

  • BS EN 62129-2:2011

    Calibration of wavelength/optical frequency measurement instruments. Michelson interferometer single wavelength meters
    7/31/2011 - Paper - English - BSI
    Learn More
    €271.32

  • IPC 9708:2010

    Test Methods for Characterization of Printed Board Assembly Pad Cratering
    12/14/2010 - Paper - English - IPC
    Learn More
    €156.88

  • NF C90-700-1-3/A1, NF EN 61190-1-3/A1 (12/2010)

    Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
    12/1/2010 - PDF - French - UTE
    Learn More
    €73.94

  • UNE-EN 61190-1-3:2007/A1:2010

    Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (Endorsed by AENOR in November of 2010.)
    11/1/2010 - PDF - English - AENOR
    Learn More
    €46.00

  • NF C90-710-3, NF EN 61760-3 (07/2010)

    Surface mounting technology - Part 3 : standard method for the specification of components for Through Hole Reflow (THR) soldering
    7/1/2010 - PDF - French - UTE
    Learn More
    €97.45

  • BS EN 61760-3:2010

    Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering
    6/30/2010 - Paper - English - BSI
    Learn More
    €193.80

  • IEC 61760-3 (2010-03)

    IEC 61760-3:2010 Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
    3/16/2010 - PDF - English, French - CEI
    Learn More
    €154.00

  • NF C93-704-1-3, NF EN 62137-1-3 (12/2009)

    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3 : cyclic drop test
    12/1/2009 - PDF - French - UTE
    Learn More
    €86.53

  • NF C93-704-1-5, NF EN 62137-1-5 (08/2009)

    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5 : mechanical shear fatigue test
    8/1/2009 - PDF - French - UTE
    Learn More
    €86.53

  • UNE-EN 62137-1-5:2009

    Surface mounting technology - Environmental and endurance test methods for surface mount solder joints -- Part 1-5: Mechanical shear fatigue test (Endorsed by AENOR in August of 2009.)
    8/1/2009 - PDF - English - AENOR
    Learn More
    €73.00

  • BS EN 62137-1-5:2009

    Surface mounting technology. Environmental and endurance test methods for surface mount solder joints. Mechanical shear fatigue test
    7/31/2009 - Paper - English - BSI
    Learn More
    €193.80

  • NF C93-704-1-4, NF EN 62137-1-4 (05/2009)

    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4 : cyclic bending test
    5/1/2009 - PDF - French - UTE
    Learn More
    €73.94

  • UNE-EN 62137-1-3:2009

    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-3: Cyclic drop test (Endorsed by AENOR in May of 2009.)
    5/1/2009 - PDF - English - AENOR
    Learn More
    €74.00

  • UNE-EN 62137-1-4:2009

    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-4: Cyclic bending test (Endorsed by AENOR in May of 2009.)
    5/1/2009 - PDF - English - AENOR
    Learn More
    €64.00

  • BS EN 62137-1-3:2009

    Surface mounting technology. Environmental and endurance test methods for surface mount solder joint. Cyclic drop test
    3/31/2009 - Paper - English - BSI
    Learn More
    €193.80

  • BS EN 62137-1-4:2009

    Surface mounting technology. Environmental and endurance test methods for surface mount solder joint. Cyclic bending test
    3/31/2009 - Paper - English - BSI
    Learn More
    €139.08

  • IPC 9703:2009

    IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
    3/18/2009 - Paper - English - IPC
    Learn More
    €156.88

  • IEC 62137-1-5 (2009-02)

    IEC 62137-1-5:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
    2/11/2009 - PDF - English, French - CEI
    Learn More
    €154.00

  • IEC 62137-1-4 (2009-01)

    IEC 62137-1-4:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
    1/26/2009 - PDF - English, French - CEI
    Learn More
    €77.00

  • IEC 62137-1-3 (2008-11)

    IEC 62137-1-3:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
    11/27/2008 - PDF - English, French - CEI
    Learn More
    €154.00

  • DD IEC/PAS 62588:2008

    Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
    10/31/2008 - Paper - English - BSI
    Learn More
    €139.08

  • DIN EN 62421:2008-06

    Electronics assembly technology - Electronic modules (IEC 62421:2007); German version EN 62421:2007
    6/1/2008 - PDF - German - DIN
    Learn More
    €96.00

  • NF C90-700-1-3, NF EN 61190-1-3 (05/2008)

    Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
    5/1/2008 - PDF - French - UTE
    Learn More
    €112.42

  • NF C90-700-1-2, NF EN 61190-1-2 (05/2008)

    Attachment materials for electronic assembly - Part 1-2 : requirements for soldering paste for high-quality interconnects in electronics assembly
    5/1/2008 - PDF - French - UTE
    Learn More
    €86.53

  • NF C90-730-5, NF EN 61192-5 (04/2008)

    Workmanship requirements for soldered electronic assemblies - Part 5 : rework, modification and repair of soldered electronic assemblies
    4/1/2008 - PDF - French - UTE
    Learn More
    €118.29

  • UNE-EN 61193-2:2007

    Quality assessment systems -- Part 2: Selection and use of sampling plans for inspection of electronic components and packages (IEC 61193-2:2007). (Endorsed by AENOR in March of 2008.)
    3/1/2008 - PDF - English - AENOR
    Learn More
    €70.00

  • UNE-EN 62421:2007

    Electronics assembly technology - Electronic modules (IEC 62421:2007). (Endorsed by AENOR in March of 2008.)
    3/1/2008 - PDF - English - AENOR
    Learn More
    €68.00

  • BS EN 61193-2:2007

    Quality assessment systems. Selection and use of sampling plans for inspection of electronic components and packages
    12/31/2007 - Paper - English - BSI
    Learn More
    €139.08

  • BS EN 62421:2007

    Electronics assembly technology. Electronic modules
    12/31/2007 - Paper - English - BSI
    Learn More
    €139.08

  • DIN EN 61192-5:2007-12

    Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies (IEC 61192-5:2007); German version EN 61192-5:2007
    12/1/2007 - PDF - German - DIN
    Learn More
    €119.60

  • UNE-EN 62137-1-1:2007

    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-1: Pull strength test (IEC 62137-1-1:2007). (Endorsed by AENOR in December of 2007.)
    12/1/2007 - PDF - English - AENOR
    Learn More
    €67.00

  • UNE-EN 62137-1-2:2007

    Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-2: Shear strength test (IEC 62137-1-2:2007). (Endorsed by AENOR in December of 2007.)
    12/1/2007 - PDF - English - AENOR
    Learn More
    €68.00

  • UNE-EN 61190-1-3:2007

    Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007). (Endorsed by AENOR in December of 2007.)
    12/1/2007 - PDF - English - AENOR
    Learn More
    €84.00

  • UNE-EN 60068-2-69:2007

    Environmental testing -- Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method .(IEC 60068-2-69:2007).
    11/14/2007 - PDF - Spanish - AENOR
    Learn More
    €57.00

  • UNE-EN 61192-5:2007

    Workmanship requirements for soldered electronic assemblies -- Part 5: Rework, modification and repair of soldered electronic assemblies (IEC 61192-5:2007). (Endorsed by AENOR in November of 2007.)
    11/1/2007 - PDF - English - AENOR
    Learn More
    €84.00

  • BS EN 62137-1-1:2007

    Surface mounting technology. Environmental and endurance test methods for surface mount solder joint. Pull strength test
    10/31/2007 - Paper - English - BSI
    Learn More
    €139.08

  • BS EN 62137-1-2:2007

    Surface mounting technology. Environmental and endurance test methods for surface mount solder joint. Shear strength test
    10/31/2007 - Paper - English - BSI
    Learn More
    €139.08

  • IPC WP/TR-584A:2007

    IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies; correcting the Misunderstandings on 'Halogen-Free'
    9/19/2007 - Paper - English - IPC
    Learn More
    €114.48

  • IPC 9201A:2007

    Surface Insulation Resistance Handbook
    9/19/2007 - Paper - English - IPC
    Learn More
    €156.88

  • IEC 61193-2 (2007-08)

    IEC 61193-2:2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
    8/30/2007 - PDF - English - CEI
    Learn More
    €110.00

  • IEC 62421 (2007-08)

    IEC 62421:2007 Electronics assembly technology - Electronic modules
    8/24/2007 - PDF - English - CEI
    Learn More
    €77.00

  • IEC 62421 (2007-08)

    IEC 62421:2007 Electronics assembly technology - Electronic modules
    8/24/2007 - PDF - English, French - CEI
    Learn More
    €77.00

  • BS EN 61192-5:2007

    Workmanship requirements for soldered electric assemblies. Rework, modification and repair of soldered electronic assemblies
    7/31/2007 - Paper - English - BSI
    Learn More
    €225.72

  • BS EN 60068-2-82:2007

    Environmental testing. Tests. Test Tx. Whisker test methods for electronic and electric components
    7/31/2007 - Paper - English - BSI
    Learn More
    €225.72

  • IEC 62137-1-2 (2007-07)

    IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
    7/25/2007 - PDF - English - CEI
    Learn More
    €110.00

  • IEC 62137-1-2 (2007-07)

    IEC 62137-1-2:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
    7/25/2007 - PDF - English, French - CEI
    Learn More
    €110.00

  • IEC 62137-1-1 (2007-07)

    IEC 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
    7/11/2007 - PDF - English - CEI
    Learn More
    €77.00

  • IEC 62137-1-1 (2007-07)

    IEC 62137-1-1:2007 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
    7/11/2007 - PDF - English, French - CEI
    Learn More
    €77.00

  • IEC 61192-5 (2007-05)

    IEC 61192-5:2007 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
    5/23/2007 - PDF - English - CEI
    Learn More
    €220.00

  • IEC 61192-5 (2007-05)

    IEC 61192-5:2007 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
    5/23/2007 - PDF - English, French - CEI
    Learn More
    €220.00

  • BS EN 60068-2-21:2006

    Environmental testing. Tests. Test U: Robustness of terminations and integral mounting devices
    10/31/2006 - Paper - English - BSI
    Learn More
    €193.80

  • NF C93-730, NF EN 60194 (10/2006)

    Printed board design, manufacture and assembly - Terms and definitions
    10/1/2006 - PDF - English, French - UTE
    Learn More
    €183.45

  • BS EN 61189-6:2006

    Test methods for electrical materials, interconnection structures and assemblies. Test methods for materials used in manufacturing electronic assemblies
    9/29/2006 - Paper - English - BSI
    Learn More
    €225.72

  • BS EN 60194:2006

    Printed board design, manufacture and assembly. Terms and definitions
    9/29/2006 - Paper - English - BSI
    Learn More
    €335.16

  • IEC 60068-2-21 (2006-06)

    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    6/22/2006 - PDF - English - CEI
    Learn More
    €187.00

  • IEC 60068-2-21 (2006-06)

    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    6/22/2006 - PDF - English, French - CEI
    Learn More
    €187.00

  • JIS C 0807:2005

    Product package labels for electronic components using bar code and two-dimensional symbologies
    12/20/2005 - PDF - Japanese - JSA
    Learn More
    €41.86

  • UNE-EN 60939-2-1:2004

    Complete filter units for radio interference suppression -- Part 2-1: Blank detail specification - Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required (assessment level D/DZ) (Endorsed by AENOR in April of 2005.)
    4/1/2005 - PDF - English - AENOR
    Learn More
    €68.00

  • BS EN 60939-2-1:2004

    Complete filter units for radio interference suppression. Blank detail specification. Passive filter units for electromagnetic interference suppression. Filters for which safety tests are required (Assessment level D/DZ)
    2/9/2005 - Paper - English - BSI
    Learn More
    €139.08

  • BS EN 60939-2-2:2004

    Complete filter units for radio interference suppression. Blank detail specification. Passive filter units for electromagnetic interference suppression. Filters for which safety tests are required (safety tests only)
    2/8/2005 - Paper - English - BSI
    Learn More
    €139.08

  • IPC 9194:2004

    Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline
    10/27/2004 - Paper - English - IPC
    Learn More
    €132.50

  • BS EN 61386-23:2004+A11:2010

    Conduit systems for cable management. Particular requirements. Flexible conduit systems
    5/26/2004 - Paper - English - BSI
    Learn More
    €139.08

  • NF C93-711-5-2, NF EN 61188-5-2 (04/2004)

    Printed boards and printed board assemblies - Design and use - Part 5-2 : attachment (land/joint) considerations - Discrete components
    4/1/2004 - PDF - French - UTE
    Learn More
    €128.70

  • IPC CM-770E:2004

    Component Mounting Guidelines for Printed Boards
    2/6/2004 - Paper - English - IPC
    Learn More
    €156.88

  • IPC D-326A:2004

    Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies
    1/29/2004 - Paper - English - IPC
    Learn More
    €83.74

  • UNE-EN 61188-5-2:2003

    Printed boards and printed board assemblies - Design and use -- Part 5-2: Attachment (land/joint) considerations - Discrete components (Endorsed by AENOR in January of 2004.)
    1/1/2004 - PDF - English - AENOR
    Learn More
    €98.00

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