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  • DIN EN 62878-1:2018-10

    Device embedded substrate - Generic specification (IEC 91/1509/CD:2018); Text in German and English
    10/1/2018 - PDF - English, German - DIN
    Learn More
    €103.00

  • DIN EN IEC 61249-2-47 VDE 0322-249-2-47:2018-10

    Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-47:2018); German version EN IEC 61249-2-47:2018
    10/1/2018 - Paper - German - VDE
    Learn More
    €74.10

  • DIN EN IEC 61249-2-45 VDE 0322-249-2-45:2018-10

    Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-45:2018); German version EN IEC 61249-2-45:2018
    10/1/2018 - Paper - German - VDE
    Learn More
    €74.10

  • DIN EN IEC 61249-2-46 VDE 0322-249-2-46:2018-10

    Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-46:2018); German version EN IEC 61249-2-46:2018
    10/1/2018 - Paper - German - VDE
    Learn More
    €74.10

  • IEC 62899-202-5 (2018-09)

    IEC 62899-202-5:2018 Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
    9/28/2018 - PDF - English - CEI
    Learn More
    €77.00

  • PR NF C93-711-6-4, PR NF EN 61188-6-4 (07/2018)

    Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design
    7/10/2018 - Paper - French - AFNOR
    Learn More
    €74.76

  • BS IEC 62899-403-1:2018

    Printed electronics. Printability. Requirements for reproducibility. Basic patterns for evaluation of printing machine
    6/27/2018 - Paper - English - BSI
    Learn More
    €193.80

  • IEC 62899-403-1 (2018-06)

    IEC 62899-403-1:2018 Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine
    6/21/2018 - PDF - English - CEI
    Learn More
    €154.00

  • IEC 61189-2-630 (2018-06)

    IEC 61189-2-630:2018 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures – Moisture absorption after pressure vessel conditioning
    6/5/2018 - PDF - English, French - CEI
    Learn More
    €22.00

  • BS IEC 62899-302-2:2018

    Printed electronics. Equipment. Inkjet. Imaging-based measurement of droplet volume
    5/18/2018 - Paper - English - BSI
    Learn More
    €139.08

  • BS IEC 62899-303-1:2018

    Printed electronics. Equipment. Roll-to-roll printing. Mechanical dimensions
    5/18/2018 - Paper - English - BSI
    Learn More
    €116.28

  • PR NF L90-200-70-60, PR NF EN 16602-70-60 (05/2018)

    Space product assurance - Qualification and Procurement of printed circuit boards
    5/2/2018 - Paper - French - AFNOR
    Learn More
    €198.83

  • DIN EN 61191-2:2018-05

    Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017
    5/1/2018 - PDF - German - DIN
    Learn More
    €119.60

  • DIN EN 61191-4:2018-05

    Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017); German version EN 61191-4:2017
    5/1/2018 - PDF - German - DIN
    Learn More
    €103.00

  • PR NF C63-001-7-4, PR NF EN 60947-7-4 (04/2018)

    Low-voltage switchgear and controlgear - Part 7-4: Ancillary equipment - PCB terminal blocks for copper conductors
    4/27/2018 - Paper - French - AFNOR
    Learn More
    €71.80

  • BS EN IEC 61189-5-503:2017

    Test methods for electrical materials, printed board and other interconnection structures and assemblies. General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
    4/13/2018 - Paper - English - BSI
    Learn More
    €193.80

  • APEXPO18

    IPC APEX 2018 Technical Conference Proceedings
    3/19/2018 - Non printable PDF - English - IPC
    Learn More
    €402.50

  • NF L90-200-70-12, NF EN 16602-70-12 (03/2018)

    Space product assurance - Design rules for printed circuit boards
    3/14/2018 - Paper - French - AFNOR
    Learn More
    €243.59

  • PR NF C93-732-630, PR NF EN 61189-2-630 (03/2018)

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for base materials for rigid printed boards - Moisture Absorption after pressure vessel conditioning
    3/9/2018 - Paper - French - AFNOR
    Learn More
    €48.40

  • PR NF C93-430-7/A2, PR NF EN 60603-7/A2 (02/2018)

    Amendment 2: Connectors for electronic equipment - Part 7: Detail specification for 8-way, unshielded, free and fixed connectors
    2/3/2018 - Paper - French - AFNOR
    Learn More
    €94.83

  • DIN EN 61189-5-504:2018-02

    Test methods for electrical materials, interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (IEC 91/1467/CD:2017)
    2/1/2018 - PDF - English, German - DIN
    Learn More
    €108.80

  • IEC 61249-2-45 (2018-01)

    IEC 61249-2-45:2018 Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    1/10/2018 - PDF - English - CEI
    Learn More
    €154.00

  • IEC 61249-2-46 (2018-01)

    IEC 61249-2-46:2018 Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    1/10/2018 - PDF - English - CEI
    Learn More
    €154.00

  • IEC 61249-2-47 (2018-01)

    IEC 61249-2-47:2018 Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    1/10/2018 - PDF - English - CEI
    Learn More
    €154.00

  • DIN EN 16602-70-60:2018-01

    Space product assurance - Qualification and Procurement of printed circuit boards; English version prEN 16602-70-60:2017
    1/1/2018 - PDF - English - DIN
    Learn More
    €414.10

  • DIN EN 61189-5-503:2018-01

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017); German version EN 61189-5-503:2017
    1/1/2018 - PDF - German - DIN
    Learn More
    €108.80

  • DRM-PTH-G

    Through-Hole Solder Joint Evaluation Training & Reference Guide - English
    1/1/2018 - Paper - English - IPC
    Learn More
    €49.82

  • IEC 60194-2 (2017-12)

    IEC 60194-2:2017 Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
    12/13/2017 - PDF - English - CEI
    Learn More
    €264.00

  • DIN EN 61188-7:2017-12

    Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017
    12/1/2017 - PDF - German - DIN
    Learn More
    €103.00

  • DIN EN 61188-6-4:2017-12

    Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design (IEC 91/1452/CD:2017)
    12/1/2017 - PDF - English, German - DIN
    Learn More
    €147.20

  • UNE-EN 61191-4:2017

    Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2017.)
    12/1/2017 - PDF - English - AENOR
    Learn More
    €70.00

  • IPC-DRM-SMT-G - Hard copy

    Surface Mount Solder Joint Evaluation Training & Reference Guide -English
    12/1/2017 - Paper - English - IPC
    Learn More
    €49.82

  • IPC-DRM-SMT-G

    Surface Mount Solder Joint Evaluation Training & Reference Guide -English
    12/1/2017 - Paper - English - IPC
    Learn More
    €49.82

  • BS EN 61191-4:2017

    Printed board assemblies. Sectional specification. Requirements for terminal soldered assemblies
    11/20/2017 - Paper - English - BSI
    Learn More
    €193.80

  • BS IEC 62899-301-2:2017

    Printed electronics. Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
    11/16/2017 - Paper - English - BSI
    Learn More
    €193.80

  • ASTM F3290-17

    Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure
    11/1/2017 - PDF - English - ASTM
    Learn More
    €36.00

  • UNE-EN 62496-2:2017

    Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards (Endorsed by Asociación Española de Normalización in November of 2017.)
    11/1/2017 - PDF - English - AENOR
    Learn More
    €84.00

  • DIN EN 61189-2-630:2017-11

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for base materials for rigid printed boards - Moisture Absorption after pressure vessel conditioning (IEC 91/1453/CD:2017)
    11/1/2017 - PDF - English, German - DIN
    Learn More
    €47.60

  • UNE-EN 61191-2:2017

    Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.)
    11/1/2017 - PDF - English - AENOR
    Learn More
    €84.00

  • IPC 4103B:2017

    Specification for Base Materials for High Speed/High Frequency Applications
    11/1/2017 - Paper - English - IPC
    Learn More
    €137.80

  • IPC 2226A:2017

    Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
    10/12/2017 - Paper - English - IPC
    Learn More
    €169.60

  • IPC J-STD-003C + AMD 1 + AMD 2:2017

    Solderability Tests for Printed Boards; with Amendments 1 & 2
    10/2/2017 - Paper - English - IPC
    Learn More
    €169.60

  • UNE-EN 61191-3:2017

    Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)
    10/1/2017 - PDF - English - AENOR
    Learn More
    €71.00

  • BS EN 61188-7:2017

    Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction
    9/28/2017 - Paper - English - BSI
    Learn More
    €193.80

  • BS EN 61191-3:2017

    Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies
    9/25/2017 - Paper - English - BSI
    Learn More
    €193.80

  • UNE-EN 61189-5-503:2017

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (Endorsed by Asociación Española de Normalización in September of 2017.)
    9/1/2017 - PDF - English - AENOR
    Learn More
    €74.00

  • IPC 6013D:2017

    Qualification and Performance Specification for Flexible Printed Boards
    9/1/2017 - Paper - English - IPC
    Learn More
    €184.00

  • IPC 4552A:2017

    Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
    8/1/2017 - Paper - English - IPC
    Learn More
    €169.60

  • UNE-EN 61188-7:2017

    Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (Endorsed by Asociación Española de Normalización in August of 2017.)
    8/1/2017 - PDF - English - AENOR
    Learn More
    €71.00

  • IPC-DRM-WHA-C - Hard copy

    Wire Harness Assembly Training & Reference Guide
    6/17/2017 - Paper - English - IPC
    Learn More
    €49.82

  • DRM-WHA-C

    Wire Harness Assembly Training & Reference Guide
    6/17/2017 - Paper - English - IPC
    Learn More
    €49.82

  • IEC 61189-5-503 (2017-05)

    IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
    5/22/2017 - PDF - English - CEI
    Learn More
    €154.00

  • IPC 4921A:2017

    Requirements for Printed Electronics Base Materials (Substrates)
    5/1/2017 - Paper - English - IPC
    Learn More
    €94.34

  • IEC 61188-7 (2017-04)

    IEC 61188-7:2017 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
    4/10/2017 - PDF - English - CEI
    Learn More
    €110.00

  • DIN EN 61189-5-1:2017-04

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016); German version EN 61189-5-1:2016
    4/1/2017 - PDF - German - DIN
    Learn More
    €108.80

  • DIN EN 61189-2-719:2017-04

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-719:2016); German version EN 61189-2-719:2016
    4/1/2017 - PDF - German - DIN
    Learn More
    €96.00

  • BS IEC 62899-402-1:2017

    Printed electronics. Printability. Measurement of qualities. Pattern width
    3/31/2017 - Paper - English - BSI
    Learn More
    €139.08

  • BS IEC 62899-401:2017

    Printed electronics. Printability. Overview
    3/31/2017 - Paper - English - BSI
    Learn More
    €139.08

  • PD IEC/TR 61189-3-914:2017

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
    3/31/2017 - Paper - English - BSI
    Learn More
    €193.80

  • IEC/TR 61189-3-914 (2017-03)

    IEC TR 61189-3-914:2017 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
    3/17/2017 - PDF - English - CEI
    Learn More
    €154.00

  • IEC 62899-401 (2017-03)

    IEC 62899-401:2017 Printed electronics - Part 401: Printability - Overview
    3/3/2017 - PDF - English - CEI
    Learn More
    €44.00

  • IEC 62899-402-1 (2017-03)

    IEC 62899-402-1:2017 Printed electronics - Part 402-1: Printability - Measurement of qualities - Pattern width
    3/3/2017 - PDF - English - CEI
    Learn More
    €77.00

  • DIN EN 61249-2-43 VDE 0322-249-2-43:2017-03

    Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-43:2016); German version EN 61249-2-43:2016
    3/1/2017 - Paper - German - VDE
    Learn More
    €69.60

  • DIN EN 61249-2-44 VDE 0322-249-2-44:2017-03

    Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-44:2016); German version EN 61249-2-44:2016
    3/1/2017 - Paper - German - VDE
    Learn More
    €69.60

  • IPC 4101E:2017

    Specification for Base Materials for Rigid and Multilayer Printed Boards
    3/1/2017 - Paper - English - IPC
    Learn More
    €167.48

  • IPC 1072 AMD 1:2017

    Intellectual Property Protection in Electronic Assembly Manufacturing; Amendment 1
    3/1/2017 - Paper - English - IPC
    Learn More
    €27.56

  • IPC 9204:2017

    Guideline on Flexibility and Stretchability Testing for Printed Electronics
    2/1/2017 - Paper - English - IPC
    Learn More
    €86.92

  • PD IEC/TR 62899-250:2016

    Printed electronics. Material technologies required in printed electronics for wearable smart devices
    1/31/2017 - Paper - English - BSI
    Learn More
    €139.08

  • IPC-6010-SERIES - Hard copy

    IPC-6010 Family of Board Performance Documents The series includes IPC-6011, IPC-6012D, IPC-6013C, IPC-6015, IPC-6017 & IPC-6018B
    1/1/2017 - Paper - English - IPC
    Learn More
    €655.08

  • IEEE 1149.10:2017

    IEEE Standard for High-Speed Test Access Port and On-Chip Distribution Architecture
    1/1/2017 - PDF sécurisé - English - IEEE
    Learn More
    €81.78

  • NF C93-735-1, NF EN 61189-5-1 (12/2016)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1 : general test methods for materials and assemblies - Guidance for printed board assemblies
    12/23/2016 - PDF - French - UTE
    Learn More
    €86.53

  • NF C93-732-719, NF EN 61189-2-719 (12/2016)

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
    12/23/2016 - PDF - French - UTE
    Learn More
    €86.53

  • NF C93-735-1, NF EN 61189-5-1 (12/2016)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1 : general test methods for materials and assemblies - Guidance for printed board assemblies
    12/23/2016 - PDF - English - UTE
    Learn More
    €86.53

  • NF C93-732-719, NF EN 61189-2-719 (12/2016)

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
    12/23/2016 - PDF - English - UTE
    Learn More
    €86.53

  • IEC/TR 62899-250 (2016-12)

    IEC TR 62899-250:2016 Printed electronics - Part 250: Material technologies required in printed electronics for wearable smart devices
    12/14/2016 - PDF - English - CEI
    Learn More
    €77.00

  • DIN EN 62326-20:2016-12

    Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (IEC 62326-20:2016); German version EN 62326-20:2016
    12/1/2016 - PDF - German - DIN
    Learn More
    €147.20

  • DIN EN 61189-3-719:2016-12

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016
    12/1/2016 - PDF - German - DIN
    Learn More
    €82.60

  • DIN EN 16602-70-12:2016-12

    Space product assurance - Design rules for printed circuit boards; English version EN 16602-70-12:2016
    12/1/2016 - PDF - English - DIN
    Learn More
    €308.20

  • IPC 2581B + AMD 1:2016

    Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology; with Amendment 1
    12/1/2016 - Paper - English - IPC
    Learn More
    €169.60

  • BS IEC 63055:2016

    Format for LSI-Package-Board interoperable design
    11/30/2016 - Paper - English - BSI
    Learn More
    €362.52

  • IEC 63055 (2016-11)

    IEC 63055:2016 Format for LSI-Package-Board Interoperable design
    11/8/2016 - PDF - English - CEI
    Learn More
    €385.00

  • NF C93-733-719, NF EN 61189-3-719 (11/2016)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719 : test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
    11/5/2016 - PDF - French - UTE
    Learn More
    €86.53

  • NF L90-200-70-28, NF EN 16602-70-28 (11/2016)

    Space product assurance - Repair and modification of printed circuit board assemblies for space use
    11/5/2016 - Paper - English, French - AFNOR
    Learn More
    €165.90

  • NF C93-733-719, NF EN 61189-3-719 (11/2016)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719 : test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
    11/5/2016 - PDF - English - UTE
    Learn More
    €86.53

  • UNE-EN 61189-5-1:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (Endorsed by AENOR in November of 2016.)
    11/1/2016 - PDF - English - AENOR
    Learn More
    €77.00

  • UNE-EN 61189-2-719:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (Endorsed by AENOR in November of 2016.)
    11/1/2016 - PDF - English - AENOR
    Learn More
    €73.00

  • UNE-EN 16602-70-12:2016

    Space product assurance - Design rules for printed circuit boards (Endorsed by AENOR in November of 2016.)
    11/1/2016 - PDF - English - AENOR
    Learn More
    €197.00

  • BS EN 61189-5-1:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies
    10/31/2016 - Paper - English - BSI
    Learn More
    €193.80

  • BS EN 61189-2-719:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz)
    10/31/2016 - Paper - English - BSI
    Learn More
    €193.80

  • BS EN 16602-70-12:2016

    Space product assurance. Design rules for printed circuit boards
    10/31/2016 - Paper - English - BSI
    Learn More
    €362.52

  • NF C93-780-2-43, NF EN 61249-2-43 (09/2016)

    Materials for printed boards and other interconnecting structures - Part 2-43 : reinforced base materials clad and unclad - Non halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    9/10/2016 - PDF - French - UTE
    Learn More
    €86.53

  • NF C93-780-2-44, NF EN 61249-2-44 (09/2016)

    Materials for printed boards and other interconnecting structures - Part 2-44 : reinforced base materials clad and unclad - Non halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    9/10/2016 - PDF - French - UTE
    Learn More
    €86.53

  • IPC 9252B:2016

    Requirements for Electrical Testing of Unpopulated Printed Boards
    9/1/2016 - Paper - English - IPC
    Learn More
    €83.74

  • IPC 2223D:2016

    Sectional Design Standard for Flexible Printed Boards
    9/1/2016 - Paper - English - IPC
    Learn More
    €156.88

  • PD IEC/TS 61189-3-301:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB
    8/31/2016 - Paper - English - BSI
    Learn More
    €139.08

  • NF C93-711-5-3, NF EN 61188-5-3 (08/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-3 : attachment (land/joint) considerations - Components with gull-wing leads on two sides
    8/13/2016 - PDF - French - UTE
    Learn More
    €97.45

  • UNE-EN 61249-2-44:2016

    Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)
    8/1/2016 - PDF - English - AENOR
    Learn More
    €73.00

  • UNE-EN 61249-2-43:2016

    Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)
    8/1/2016 - PDF - English - AENOR
    Learn More
    €15.00

  • BS EN 61249-2-43:2016

    Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    7/31/2016 - Paper - English - BSI
    Learn More
    €193.80

  • BS EN 61249-2-44:2016

    Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    7/31/2016 - Paper - English - BSI
    Learn More
    €193.80

  • NF C93-711-5-4, NF EN 61188-5-4 (07/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-4 : attachment (land/joint) consideration - Components with J leads on two sides
    7/29/2016 - PDF - French - UTE
    Learn More
    €73.94

  • IEC/TS 61189-3-301 (2016-07)

    IEC TS 61189-3-301:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
    7/28/2016 - PDF - English - CEI
    Learn More
    €77.00

  • NF C93-711-5-5, NF EN 61188-5-5 (07/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-5 : Attachment (land/joint) considerations - Components with gull-wing leads on four sides
    7/15/2016 - PDF - French - UTE
    Learn More
    €118.29

  • NF C93-711-5-8, NF EN 61188-5-8 (07/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-8 : Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
    7/15/2016 - PDF - French - UTE
    Learn More
    €97.45

  • IEC 61189-2-719 (2016-07)

    IEC 61189-2-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
    7/12/2016 - PDF - English, French - CEI
    Learn More
    €110.00

  • NF C93-707-20, NF EN 62326-20 (07/2016)

    Printed boards - Part 20 : printed circuit boards for high-brightness LEDs
    7/8/2016 - PDF - French - UTE
    Learn More
    €128.70

  • IEC 61189-5-1 (2016-07)

    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    7/5/2016 - PDF - English, French - CEI
    Learn More
    €187.00

  • IPC 6018C:2016

    Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
    7/1/2016 - Paper - English - IPC
    Learn More
    €156.88

  • IPC 6018CS:2016

    Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
    7/1/2016 - Paper - English - IPC
    Learn More
    €83.74

  • IPC 1601A:2016

    Printed Board Handling and Storage Guidelines
    6/1/2016 - Paper - English - IPC
    Learn More
    €83.74

  • IPC 9691B:2016

    User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
    6/1/2016 - Paper - English - IPC
    Learn More
    €156.88

  • UNE-EN 62326-20:2016

    Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (Endorsed by AENOR in June of 2016.)
    6/1/2016 - PDF - English - AENOR
    Learn More
    €95.00

  • BS EN 62326-20:2016

    Printed boards. Printed circuit boards for high-brightness LEDs
    5/31/2016 - Paper - English - BSI
    Learn More
    €271.32

  • IEC 61249-2-43 (2016-05)

    IEC 61249-2-43:2016 Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    5/12/2016 - PDF - English, French - CEI
    Learn More
    €154.00

  • IEC 61249-2-44 (2016-05)

    IEC 61249-2-44:2016 Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    5/12/2016 - PDF - English, French - CEI
    Learn More
    €154.00

  • ASTM F1896-16

    Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
    5/1/2016 - PDF - English - ASTM
    Learn More
    €36.00

  • ASTM F1896-16 + Redline

    Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
    5/1/2016 - PDF - English - ASTM
    Learn More
    €43.00

  • IPC A-600J:2016

    Acceptability of Printed Boards
    5/1/2016 - Paper - English - IPC
    Learn More
    €190.80

  • IPC A-600J:2016 - Hard Copy (French Language)

    Acceptability of Printed Boards
    5/1/2016 - Paper - French - IPC
    Learn More
    €286.20

  • UNE-EN 61189-3-719:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (Endorsed by AENOR in May of 2016.)
    5/1/2016 - PDF - English - AENOR
    Learn More
    €61.00

  • BS EN 61189-3-719:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
    4/30/2016 - Paper - English - BSI
    Learn More
    €139.08

  • NF L90-200-70-11, NF EN 16602-70-11 (04/2016)

    Space product assurance - Procurement of printed circuit boards
    4/16/2016 - Paper - English, French - BNAE
    Learn More
    €129.53

  • NF L90-200-70-10, NF EN 16602-70-10 (04/2016)

    Space product assurance - Qualification of printed circuit boards
    4/16/2016 - Paper - English, French - AFNOR
    Learn More
    €172.27

  • IPC 1071B:2016

    Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing
    4/1/2016 - Paper - English - IPC
    Learn More
    €83.74

  • IPC 6012DA:2016

    Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards
    4/1/2016 - Paper - English - IPC
    Learn More
    €83.74

  • BS IEC 62899-201:2016

    Printed electronics. Materials. Substrates
    3/31/2016 - Paper - English - BSI
    Learn More
    €255.36

  • BS IEC 62899-202:2016

    Printed electronics. Materials. Conductive ink
    3/31/2016 - Paper - English - BSI
    Learn More
    €225.72

  • DIN EN 62878-1-1:2016-03

    Device embedded substrate - Part 1-1: Generic specification - Test methods (IEC 62878-1-1:2015); German version EN 62878-1-1:2015
    3/1/2016 - PDF - German - DIN
    Learn More
    €158.30

  • IEC 62899-201 (2016-02)

    IEC 62899-201:2016 Printed electronics - Part 201: Materials - Substrates
    2/25/2016 - PDF - English - CEI
    Learn More
    €264.00

  • IEC 62899-202 (2016-02)

    IEC 62899-202:2016 Printed electronics - Part 202: Materials - Conductive ink
    2/25/2016 - PDF - English - CEI
    Learn More
    €220.00

  • IEC 62326-20 (2016-02)

    IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
    2/3/2016 - PDF - English, French - CEI
    Learn More
    €264.00

  • IPC 9121:2016

    Troubleshooting for Printed Board Fabrication Processes
    2/1/2016 - Paper - English - IPC
    Learn More
    €344.50

  • PD IEC/TR 63017:2015

    Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
    1/31/2016 - Paper - English - BSI
    Learn More
    €139.08

  • PD IEC/TR 63018:2015

    Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
    1/31/2016 - Paper - English - BSI
    Learn More
    €139.08

  • IEC 61189-3-719 (2016-01)

    IEC 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
    1/5/2016 - PDF - English, French - CEI
    Learn More
    €44.00

  • IEC 61189-3-913 (2016-01)

    IEC 61189-3-913:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
    1/5/2016 - PDF - English, French - CEI
    Learn More
    €187.00

  • IPC 4556 AMD 1:2016

    Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
    1/1/2016 - Paper - English - IPC
    Learn More
    €47.70

  • IPC 4562A + AMD 1:2016

    Metal Foil for Printed Board Applications; with Amendment 1
    1/1/2016 - Paper - English - IPC
    Learn More
    €125.08

  • PD IEC/TR 62878-2-2:2015

    Device embedded substrate. Guidelines. Electrical testing
    12/31/2015 - Paper - English - BSI
    Learn More
    €139.08

  • IEC/TR 63017 (2015-12)

    IEC TR 63017:2015 Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations
    12/16/2015 - PDF - English - CEI
    Learn More
    €77.00

  • IEC/TR 63018 (2015-12)

    IEC TR 63018:2015 Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials
    12/16/2015 - PDF - English - CEI
    Learn More
    €77.00

  • IEC/TR 62878-2-2 (2015-12)

    IEC TR 62878-2-2:2015 Device embedded substrate - Part 2-2: Guidelines - Electrical testing
    12/4/2015 - PDF - English, French - CEI
    Learn More
    €77.00

  • IPC 1072:2015

    Intellectual Property Protection in Electronic Assembly Manufacturing
    12/1/2015 - Paper - English - IPC
    Learn More
    €83.74

  • JIS C 61191-1:2015

    Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    11/20/2015 - PDF - Japanese - JSA
    Learn More
    €50.18

  • JIS C 61191-2:2015

    Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    11/20/2015 - PDF - Japanese - JSA
    Learn More
    €41.86

  • DIN EN 61189-5-4:2015-11

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015); German version EN 61189-5-4:2015
    11/1/2015 - PDF - German - DIN
    Learn More
    €108.80

  • DIN EN 61189-5-2:2015-11

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015); German version EN 61189-5-2:2015
    11/1/2015 - PDF - German - DIN
    Learn More
    €136.80

  • DIN EN 61189-5-3:2015-11

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version EN 61189-5-3:2015
    11/1/2015 - PDF - German - DIN
    Learn More
    €141.90

  • IPC HDBK-4691:2015

    Handbook on Adhesive Bonding in Electronic Assembly Operations
    11/1/2015 - Paper - English - IPC
    Learn More
    €156.88

  • NF C93-778-1-1, NF EN 62878-1-1 (10/2015)

    Device embedded substrate - Part 1-1 : generic specification - Test methods
    10/16/2015 - PDF - French - UTE
    Learn More
    €128.70

  • NF C93-732-721, NF EN 61189-2-721 (10/2015)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721 : test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
    10/9/2015 - PDF - French - UTE
    Learn More
    €86.53

  • DIN EN 61191-1:2015-10

    Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 91/1276/CD:2015)
    10/1/2015 - PDF - English, German - DIN
    Learn More
    €147.20

  • IPC 6012D:2015

    Qualification and Performance Specification for Rigid Printed Boards
    9/1/2015 - Paper - English - IPC
    Learn More
    €156.88

  • IPC 6012D:2015 - Hard Copy

    Qualification and Performance Specification for Rigid Printed Boards
    9/1/2015 - Paper - French - IPC
    Learn More
    €236.38

  • IPC 6012DS:2015

    Space and Military Avionics Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards
    9/1/2015 - Paper - English - IPC
    Learn More
    €83.74

  • IPC 6012DS:2015 - Hard Copy

    Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards
    9/1/2015 - Paper - French - IPC
    Learn More
    €125.08

  • PD IEC/PAS 62878-2-5:2015

    Device embedded substrate. Guidelines. Data format
    8/31/2015 - Paper - English - BSI
    Learn More
    €225.72

  • IEC/PAS 62878-2-5 (2015-08)

    IEC PAS 62878-2-5:2015 Device embedded substrate - Guidelines - Data format
    8/5/2015 - PDF - English - CEI
    Learn More
    €220.00

  • UNE-EN 61189-2-721:2015

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (Endorsed by AENOR in August of 2015.)
    8/1/2015 - PDF - English - AENOR
    Learn More
    €75.00

  • UNE-EN 62878-1-1:2015

    Device embedded substrate - Part 1-1: Generic specification - Test methods (Endorsed by AENOR in August of 2015.)
    8/1/2015 - PDF - English - AENOR
    Learn More
    €103.00

  • BS EN 62878-1-1:2015

    Device embedded substrate. Generic specification. Test methods
    7/31/2015 - Paper - English - BSI
    Learn More
    €271.32

  • IPC JPCA 6901:2015

    Application Categories for Printed Electronics
    7/1/2015 - Paper - English - IPC
    Learn More
    €83.74

  • BS EN 61189-2-721:2015

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
    6/30/2015 - Paper - English - BSI
    Learn More
    €193.80

  • NF C93-735-4, NF EN 61189-5-4 (06/2015)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4 : general test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for wire for printed board assembies
    6/27/2015 - PDF - French - UTE
    Learn More
    €86.53

  • NF C93-735-3, NF EN 61189-5-3 (06/2015)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3 : general test methods for materials and assemblies - Soldering paste for printed board assemblies
    6/13/2015 - PDF - French - UTE
    Learn More
    €118.29

  • NF C93-735-2, NF EN 61189-5-2 (06/2015)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2 : general test methods for materials and assemblies - Soldering Flux for printed board assemblies
    6/13/2015 - PDF - French - UTE
    Learn More
    €118.29

  • IEC 62878-1-1 (2015-05)

    IEC 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    5/20/2015 - PDF - English, French - CEI
    Learn More
    €297.00

  • DVD-PTH-F-K

    Through Hole Solder Joint Quality Standards
    5/5/2015 - dvd - English - IPC
    Learn More
    €662.50

  • DIN EN 16602-70-10:2015-05

    Space product assurance - Qualification of printed circuit boards; English version EN 16602-70-10:2015
    5/1/2015 - PDF - English - DIN
    Learn More
    €191.40

  • DIN EN 16602-70-11:2015-05

    Space product assurance - Procurement of printed circuit boards; English version EN 16602-70-11:2015
    5/1/2015 - PDF - English - DIN
    Learn More
    €125.30

  • IPC T-50M:2015

    Terms and Definitions for Interconnecting and Packaging Electronic Circuits
    5/1/2015 - Paper - English - IPC
    Learn More
    €156.88

  • IPC T-50M:2015 - Hard Copy

    Terms and Definitions for Interconnecting and Packaging Electronic Circuits
    5/1/2015 - Paper - French - IPC
    Learn More
    €236.38

  • PD IEC/TS 62878-2-1:2015

    Device embedded substrate. Guidelines. General description of technology
    4/30/2015 - Paper - English - BSI
    Learn More
    €225.72

  • PD IEC/TS 62878-2-4:2015

    Device embedded substrate. Guidelines. Test element groups (TEG)
    4/30/2015 - Paper - English - BSI
    Learn More
    €225.72

  • PD IEC/TS 62878-2-3:2015

    Device embedded substrate. Guidelines. Design guide
    4/30/2015 - Paper - English - BSI
    Learn More
    €193.80

  • IEC 61189-2-721 (2015-04)

    IEC 61189-2-721:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
    4/29/2015 - PDF - English, French - CEI
    Learn More
    €154.00

  • IEC 60194 (2015-04)

    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    4/15/2015 - PDF - English, French - CEI
    Learn More
    €385.00

  • UNE-EN 61189-5-4:2015

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (Endorsed by AENOR in April of 2015.)
    4/1/2015 - PDF - English - AENOR
    Learn More
    €77.00

  • UNE-EN 61189-5-3:2015

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (Endorsed by AENOR in April of 2015.)
    4/1/2015 - PDF - English - AENOR
    Learn More
    €86.00

  • UNE-EN 61189-5-2:2015

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (Endorsed by AENOR in April of 2015.)
    4/1/2015 - PDF - English - AENOR
    Learn More
    €87.00

  • IEC/TS 62878-2-1 (2015-03)

    IEC TS 62878-2-1:2015 Device embedded substrate - Part 2-1: Guidelines - General description of technology
    3/30/2015 - PDF - English, French - CEI
    Learn More
    €187.00

  • IEC/TS 62878-2-3 (2015-03)

    IEC TS 62878-2-3:2015 Device embedded substrate - Part 2-3: Guidelines - Design guide
    3/27/2015 - PDF - English, French - CEI
    Learn More
    €154.00

  • IEC/TS 62878-2-4 (2015-03)

    IEC TS 62878-2-4:2015 Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
    3/27/2015 - PDF - English, French - CEI
    Learn More
    €220.00

  • UNE-EN 16602-70-10:2015

    Space product assurance - Qualification of printed circuit boards (Endorsed by AENOR in March of 2015.)
    3/1/2015 - PDF - English - AENOR
    Learn More
    €137.00

  • UNE-EN 16602-70-11:2015

    Space product assurance - Procurement of printed circuit boards (Endorsed by AENOR in March of 2015.)
    3/1/2015 - PDF - English - AENOR
    Learn More
    €89.00

  • BS EN 16602-70-10:2015

    Space product assurance. Qualification of printed circuit boards
    2/28/2015 - Paper - English - BSI
    Learn More
    €289.56

  • BS EN 16602-70-11:2015

    Space product assurance. Procurement of printed circuit boards
    2/28/2015 - Paper - English - BSI
    Learn More
    €255.36

  • IEC 60050-541 AMD 1 (2015-02)

    IEC 60050-541:1990/AMD1:2015 Amendment 1 - International Electrotechnical Vocabulary - Part 541: Printed circuits
    2/25/2015 - PDF - English, French - CEI
    Learn More
    €11.00

  • NF C93-711-7, NF EN 61188-7 (02/2015)

    Printed board and printed board assemblies - Design and use - Part 7 : electronic component zero orientation for CAD library construction
    2/14/2015 - PDF - French - UTE
    Learn More
    €86.53

  • IPC 7092:2015

    Design and Assembly Process Implementation for Embedded Components
    2/1/2015 - Paper - English - IPC
    Learn More
    €156.88

  • BS EN 61189-5-2:2015

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies
    1/31/2015 - Paper - English - BSI
    Learn More
    €255.36

  • BS EN 61189-5-3:2015

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies
    1/31/2015 - Paper - English - BSI
    Learn More
    €255.36

  • BS EN 61189-5-4:2015

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
    1/31/2015 - Paper - English - BSI
    Learn More
    €193.80

  • IEC 61189-5-2 (2015-01)

    IEC 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
    1/8/2015 - PDF - English, French - CEI
    Learn More
    €264.00

  • IEC 61189-5-3 (2015-01)

    IEC 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
    1/8/2015 - PDF - English, French - CEI
    Learn More
    €220.00

  • IEC 61189-5-4 (2015-01)

    IEC 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
    1/8/2015 - PDF - English, French - CEI
    Learn More
    €154.00

  • IPC-DRM-53 - Hard copy

    Introduction to Electronics Assembly Training & Reference Guide
    1/5/2015 - Paper - English - IPC
    Learn More
    €49.82

  • NBN EN 16602-70-10

    Space product assurance - Qualification of printed circuit boards
    1/2/2015 - PDF - French - NBN
    Learn More
    €135.00

  • NBN EN 16602-70-11

    Space product assurance - Procurement of printed circuit boards
    1/2/2015 - PDF - French - NBN
    Learn More
    €77.00

  • NBN EN 16602-70-11

    Space product assurance - Procurement of printed circuit boards
    1/2/2015 - PDF - English - NBN
    Learn More
    €77.00

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