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31.180 : Printed circuits and boards

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  • BS EN 16602-70-60:2019


    7/19/2019 - PDF - English - BSI
    Learn More
    €434.70

  • BS EN IEC 61188-6-4:2019


    7/12/2019 - PDF - English - BSI
    Learn More
    €266.80

  • IEC/TR 61189-5-506 (2019-06)

    IEC TR 61189-5-506:2019 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
    6/26/2019 - PDF - English - CEI
    Learn More
    €142.00

  • BS IEC 62899-204:2019


    6/7/2019 - PDF - English - BSI
    Learn More
    €202.40

  • €121.43

  • IEC 62899-204 (2019-05)

    IEC 62899-204:2019 Printed electronics - Part 204: Materials - Insulator ink - Measurement methods of properties of insulator inks and printed insulating layers
    5/20/2019 - PDF - English - CEI
    Learn More
    €142.00

  • APEXPO19

    IPC APEX 2018 Technical Conference Proceedings
    5/19/2019 - Non printable PDF - English - IPC
    Learn More
    €424.60

  • 19/30357467 DC


    5/13/2019 - PDF - English - BSI
    Learn More
    €23.00

  • IEC 61188-6-4 (2019-05)

    IEC 61188-6-4:2019 Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
    5/2/2019 - PDF - English, French - CEI
    Learn More
    €244.00

  • IEC/TR 62878-2-7 (2019-03)

    IEC TR 62878-2-7:2019 Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
    3/20/2019 - PDF - English - CEI
    Learn More
    €71.00

  • NF EN 60603-7/A2, C93-430-7/A2 (03/2019)

    Connectors for electronic equipment - Part 7 : detail specification for 8-way, unshielded, free and fixed connectors - Amendement 2 : Connecteurs pour équipements électroniques - Partie 7 : Spécification particulière pour les fiches et les embases non écrantées à 8 voies
    3/1/2019 - Paper - French - AFNOR
    Learn More
    €63.42

  • NF EN IEC 60947-7-4, C63-001-7-4 (03/2019)

    Low-voltage switchgear and controlgear - Part 7-4 : ancillary equipment - PCB terminal blocks for copper conductors - Appareillage à basse tension - Partie 7-4 : Matériels accessoires - Blocs de jonction pour cartes de circuits imprimés pour conducteurs en cuivre
    3/1/2019 - Paper - French - AFNOR
    Learn More
    €112.42

  • PR NF EN IEC 62878-1, C93-778-1PR (03/2019)


    3/1/2019 - Paper - French - AFNOR
    Learn More
    €54.48

  • IPC CC-830C:2018

    Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
    1/25/2019 - Paper - English - IPC
    Learn More
    €102.30

  • BS IEC 62899-202-3:2019


    1/23/2019 - PDF - English - BSI
    Learn More
    €144.90

  • IEC 62899-202-3 (2019-01)

    IEC 62899-202-3:2019 Printed electronics - Part 202-3: Materials - Conductive ink - Measurement of sheet resistance of conductive films - Contactless method
    1/16/2019 - PDF - English - CEI
    Learn More
    €71.00

  • BS IEC 62899-201:2016+A1:2018


    1/3/2019 - PDF - English - BSI
    Learn More
    €282.90

  • UNE-EN IEC 61191-1:2018

    Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by Asociación Española de Normalización in December of 2018.)
    12/1/2018 - PDF - English - AENOR
    Learn More
    €84.00

  • IPC-6012DA-WAM1:2018

    Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards
    12/1/2018 - Paper - English - IPC
    Learn More
    €104.50

  • IEC 62899-201 AMD 1 (2018-11)

    IEC 62899-201:2016/AMD1:2018 Amendment 1 - Printed electronics - Part 201: Materials - Substrates
    11/15/2018 - PDF - English - CEI
    Learn More
    €71.00

  • IEC 62899-201 Edition 1.1 (2018-11)

    IEC 62899-201:2016+AMD1:2018 consolidated version Printed electronics - Part 201: Materials - Substrates
    11/15/2018 - PDF - English - CEI
    Learn More
    €406.00

  • BS EN IEC 61191-1:2018


    11/13/2018 - PDF - English - BSI
    Learn More
    €266.80

  • DIN EN 61189-5-601:2018-11

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (IEC 91/1518/CD:2018); Text in German and English
    11/1/2018 - PDF - English, German - DIN
    Learn More
    €141.90

  • UNE-EN IEC 61189-2-630:2018

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (Endorsed by Asociación Española de Normalización in November of 2018.)
    11/1/2018 - PDF - English - AENOR
    Learn More
    €42.00

  • BS EN IEC 61189-2-630:2018

    Test methods for electrical materials, printed board and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning
    10/10/2018 - PDF - English - BSI
    Learn More
    €121.90

  • BS IEC 62899-202-5:2018

    Printed electronics. Materials. Conductive ink. Mechanical bending test of a printed conductive layer on an insulating substrate
    10/9/2018 - PDF - English - BSI
    Learn More
    €144.90

  • DIN EN 62878-1:2018-10

    Device embedded substrate - Generic specification (IEC 91/1509/CD:2018); Text in German and English
    10/1/2018 - PDF - English, German - DIN
    Learn More
    €103.00

  • DIN EN IEC 61249-2-47 VDE 0322-249-2-47:2018-10

    Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-47:2018); German version EN IEC 61249-2-47:2018
    10/1/2018 - Paper - German - VDE
    Learn More
    €74.10

  • DIN EN IEC 61249-2-45 VDE 0322-249-2-45:2018-10

    Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-45:2018); German version EN IEC 61249-2-45:2018
    10/1/2018 - Paper - German - VDE
    Learn More
    €74.10

  • DIN EN IEC 61249-2-46 VDE 0322-249-2-46:2018-10

    Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-46:2018); German version EN IEC 61249-2-46:2018
    10/1/2018 - Paper - German - VDE
    Learn More
    €74.10

  • NF EN IEC 61189-2-630, C93-732-630 (10/2018)

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630 : test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning - Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-630: Méthodes d'essai pour les matériaux de base des cartes imprimées rigides - Absorption d'humidité après conditionnement dans un récipient sous pression
    10/1/2018 - Paper - French - AFNOR
    Learn More
    €48.40

  • IEC 62899-202-5 (2018-09)

    IEC 62899-202-5:2018 Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
    9/28/2018 - PDF - English - CEI
    Learn More
    €71.00

  • 18/30352619 DC


    8/1/2018 - PDF - English - BSI
    Learn More
    €23.00

  • PR NF EN 61188-6-4, C93-711-6-4PR (07/2018)

    Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design - Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 6-4: Exigences génériques pour les dessins dimensionnels de CMS du point de vue de la conception de la zone de report
    7/1/2018 - Paper - French - AFNOR
    Learn More
    €78.69

  • BS IEC 62899-403-1:2018

    Printed electronics. Printability. Requirements for reproducibility. Basic patterns for evaluation of printing machine
    6/27/2018 - PDF - English - BSI
    Learn More
    €202.40

  • IEC 62899-403-1 (2018-06)

    IEC 62899-403-1:2018 Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine
    6/21/2018 - PDF - English - CEI
    Learn More
    €142.00

  • IEC 61189-2-630 (2018-06)

    IEC 61189-2-630:2018 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures – Moisture absorption after pressure vessel conditioning
    6/5/2018 - PDF - English, French - CEI
    Learn More
    €20.00

  • 18/30352609 DC


    5/29/2018 - PDF - English - BSI
    Learn More
    €23.00

  • BS IEC 62899-302-2:2018

    Printed electronics. Equipment. Inkjet. Imaging-based measurement of droplet volume
    5/18/2018 - PDF - English - BSI
    Learn More
    €144.90

  • BS IEC 62899-303-1:2018

    Printed electronics. Equipment. Roll-to-roll printing. Mechanical dimensions
    5/18/2018 - PDF - English - BSI
    Learn More
    €121.90

  • DIN EN 61191-2:2018-05

    Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017
    5/1/2018 - PDF - German - DIN
    Learn More
    €119.60

  • DIN EN 61191-4:2018-05

    Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017); German version EN 61191-4:2017
    5/1/2018 - PDF - German - DIN
    Learn More
    €103.00

  • PR NF EN 16602-70-60, L90-200-70-60PR (05/2018)

    Space product assurance - Qualification and Procurement of printed circuit boards - Assurance produit des projets spatiaux - Qualification et approvisionnement des circuits imprimés
    5/1/2018 - Paper - French - AFNOR
    Learn More
    €198.83

  • UNE-EN IEC 61249-2-45:2018

    Materials for printed boards and other interconnecting structures – Part 2-45: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    5/1/2018 - PDF - English - AENOR
    Learn More
    €70.00

  • UNE-EN IEC 61249-2-46:2018

    Materials for printed boards and other interconnecting structures – Part 2-46: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    5/1/2018 - PDF - English - AENOR
    Learn More
    €70.00

  • UNE-EN IEC 61249-2-47:2018

    Materials for printed boards and other interconnecting structures – Part 2-47: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    5/1/2018 - PDF - English - AENOR
    Learn More
    €70.00

  • 18/30366168 DC


    4/24/2018 - PDF - English - BSI
    Learn More
    €23.00

  • BS EN IEC 61249-2-47:2018


    4/18/2018 - PDF - English - BSI
    Learn More
    €202.40

  • BS EN IEC 61249-2-46:2018


    4/16/2018 - PDF - English - BSI
    Learn More
    €202.40

  • BS EN IEC 61189-5-503:2017

    Test methods for electrical materials, printed board and other interconnection structures and assemblies. General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards
    4/13/2018 - PDF - English - BSI
    Learn More
    €202.40

  • BS EN IEC 61249-2-45:2018


    4/13/2018 - PDF - English - BSI
    Learn More
    €202.40

  • 18/30355486 DC


    4/4/2018 - PDF - English - BSI
    Learn More
    €23.00

  • IPC 9121 AMD 1:2018

    Troubleshooting for PCB Fabrication Processes, Amendment 1
    4/2/2018 - Non printable PDF - English - IPC
    Learn More
    €47.70

  • 18/30357471 DC


    3/27/2018 - PDF - English - BSI
    Learn More
    €23.00

  • NF EN 16602-70-12, L90-200-70-12 (03/2018)

    Space product assurance - Design rules for printed circuit boards - Assurance produit des projets spatiaux - Règles de conception des circuits imprimés
    3/1/2018 - Paper - French - AFNOR
    Learn More
    €256.41

  • DIN EN 61189-5-504:2018-02

    Test methods for electrical materials, interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (IEC 91/1467/CD:2017)
    2/1/2018 - PDF - English, German - DIN
    Learn More
    €108.80

  • IEC 61249-2-45 (2018-01)

    IEC 61249-2-45:2018 Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    1/10/2018 - PDF - English - CEI
    Learn More
    €142.00

  • IEC 61249-2-46 (2018-01)

    IEC 61249-2-46:2018 Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    1/10/2018 - PDF - English - CEI
    Learn More
    €142.00

  • IEC 61249-2-47 (2018-01)

    IEC 61249-2-47:2018 Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
    1/10/2018 - PDF - English - CEI
    Learn More
    €142.00

  • DIN EN 16602-70-60:2018-01

    Space product assurance - Qualification and Procurement of printed circuit boards; English version prEN 16602-70-60:2017
    1/1/2018 - PDF - English - DIN
    Learn More
    €414.10

  • DIN EN 61189-5-503:2018-01

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (IEC 61189-5-503:2017); German version EN 61189-5-503:2017
    1/1/2018 - PDF - German - DIN
    Learn More
    €108.80

  • DRM-PTH-G

    Through-Hole Solder Joint Evaluation Training & Reference Guide - English
    1/1/2018 - Paper - English - IPC
    Learn More
    €51.70

  • IEC 60194-2 (2017-12)

    IEC 60194-2:2017 Printed boards design, manufacture and assembly - Vocabulary - Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
    12/13/2017 - PDF - English - CEI
    Learn More
    €244.00

  • DIN EN 61188-7:2017-12

    Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017
    12/1/2017 - PDF - German - DIN
    Learn More
    €103.00

  • DIN EN 61188-6-4:2017-12

    Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design (IEC 91/1452/CD:2017)
    12/1/2017 - PDF - English, German - DIN
    Learn More
    €147.20

  • UNE-EN 61191-4:2017

    Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2017.)
    12/1/2017 - PDF - English - AENOR
    Learn More
    €64.00

  • IPC-DRM-SMT-G

    Surface Mount Solder Joint Evaluation Training & Reference Guide -English
    12/1/2017 - Paper - English - IPC
    Learn More
    €51.70

  • IPC-DRM-SMT-G - Hard copy

    Surface Mount Solder Joint Evaluation Training & Reference Guide -English
    12/1/2017 - Paper - English - IPC
    Learn More
    €51.70

  • 17/30352670 DC


    11/22/2017 - PDF - English - BSI
    Learn More
    €23.00

  • BS EN 61191-4:2017

    Printed board assemblies. Sectional specification. Requirements for terminal soldered assemblies
    11/20/2017 - PDF - English - BSI
    Learn More
    €202.40

  • BS IEC 62899-301-2:2017

    Printed electronics. Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
    11/16/2017 - PDF - English - BSI
    Learn More
    €202.40

  • UNE-EN 61191-2:2017

    Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.)
    11/1/2017 - PDF - English - AENOR
    Learn More
    €76.00

  • UNE-EN 62496-2:2017

    Optical circuit boards - Basic test and measurement procedures - Part 2: General guidance for definition of measurement conditions for optical characteristics of optical circuit boards (Endorsed by Asociación Española de Normalización in November of 2017.)
    11/1/2017 - PDF - English - AENOR
    Learn More
    €76.00

  • ASTM F3290-17

    Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure
    11/1/2017 - PDF - English - ASTM
    Learn More
    €38.00

  • IPC 4103B:2017

    Specification for Base Materials for High Speed/High Frequency Applications
    11/1/2017 - Paper - English - IPC
    Learn More
    €143.00

  • IPC 2226A:2017

    Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
    10/12/2017 - Paper - English - IPC
    Learn More
    €184.80

  • 17/30366840 DC


    10/5/2017 - PDF - English - BSI
    Learn More
    €73.92

  • UNE-EN 61191-3:2017

    Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)
    10/1/2017 - PDF - English - AENOR
    Learn More
    €65.00

  • BS EN 61188-7:2017

    Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction
    9/28/2017 - PDF - English - BSI
    Learn More
    €202.40

  • BS EN 61191-3:2017

    Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies
    9/25/2017 - PDF - English - BSI
    Learn More
    €202.40

  • UNE-EN 61189-5-503:2017

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (Endorsed by Asociación Española de Normalización in September of 2017.)
    9/1/2017 - PDF - English - AENOR
    Learn More
    €68.00

  • 17/30365805 DC


    9/1/2017 - PDF - English - BSI
    Learn More
    €41.40

  • IPC 6013D:2017

    Qualification and Performance Specification for Flexible Printed Boards
    9/1/2017 - Paper - English - IPC
    Learn More
    €184.80

  • IPC-J-STD-003C-WAM1&2:2017

    Solderability Tests for Printed Boards; with Amendments 1 & 2
    9/1/2017 - Paper - English - IPC
    Learn More
    €184.80

  • UNE-EN 61188-7:2017

    Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (Endorsed by Asociación Española de Normalización in August of 2017.)
    8/1/2017 - PDF - English - AENOR
    Learn More
    €65.00

  • IPC 4552A:2017

    Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
    8/1/2017 - Paper - English - IPC
    Learn More
    €184.80

  • 17/30352677 DC


    7/5/2017 - PDF - English - BSI
    Learn More
    €22.40

  • DRM-WHA-C

    Wire Harness Assembly Training & Reference Guide
    6/17/2017 - Paper - English - IPC
    Learn More
    €51.70

  • IPC-DRM-WHA-C - Hard copy

    Wire Harness Assembly Training & Reference Guide
    6/17/2017 - Paper - English - IPC
    Learn More
    €51.70

  • IEC 61189-5-503 (2017-05)

    IEC 61189-5-503:2017 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
    5/22/2017 - PDF - English - CEI
    Learn More
    €142.00

  • IPC 4921A:2017

    Requirements for Printed Electronics Base Materials (Substrates)
    5/1/2017 - Paper - English - IPC
    Learn More
    €97.90

  • IEC 61188-7 (2017-04)

    IEC 61188-7:2017 Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
    4/10/2017 - PDF - English - CEI
    Learn More
    €102.00

  • DIN EN 61189-5-1:2017-04

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (IEC 61189-5-1:2016); German version EN 61189-5-1:2016
    4/1/2017 - PDF - German - DIN
    Learn More
    €108.80

  • DIN EN 61189-2-719:2017-04

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (IEC 61189-2-719:2016); German version EN 61189-2-719:2016
    4/1/2017 - PDF - German - DIN
    Learn More
    €96.00

  • BS IEC 62899-402-1:2017

    Printed electronics. Printability. Measurement of qualities. Pattern width
    3/31/2017 - PDF - English - BSI
    Learn More
    €144.90

  • BS IEC 62899-401:2017

    Printed electronics. Printability. Overview
    3/31/2017 - PDF - English - BSI
    Learn More
    €144.90

  • PD IEC/TR 61189-3-914:2017

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test method for thermal conductivity of printed circuit boards for high-brightness LEDs. Guidelines
    3/31/2017 - PDF - English - BSI
    Learn More
    €202.40

  • IEC/TR 61189-3-914 (2017-03)

    IEC TR 61189-3-914:2017 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
    3/17/2017 - PDF - English - CEI
    Learn More
    €142.00

  • IEC 62899-401 (2017-03)

    IEC 62899-401:2017 Printed electronics - Part 401: Printability - Overview
    3/3/2017 - PDF - English - CEI
    Learn More
    €41.00

  • IEC 62899-402-1 (2017-03)

    IEC 62899-402-1:2017 Printed electronics - Part 402-1: Printability - Measurement of qualities - Pattern width
    3/3/2017 - PDF - English - CEI
    Learn More
    €71.00

  • DIN EN 61249-2-43 VDE 0322-249-2-43:2017-03

    Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-43:2016); German version EN 61249-2-43:2016
    3/1/2017 - Paper - German - VDE
    Learn More
    €69.60

  • DIN EN 61249-2-44 VDE 0322-249-2-44:2017-03

    Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-44:2016); German version EN 61249-2-44:2016
    3/1/2017 - Paper - German - VDE
    Learn More
    €69.60

  • IPC 4101E:2017

    Specification for Base Materials for Rigid and Multilayer Printed Boards
    3/1/2017 - Paper - English - IPC
    Learn More
    €182.60

  • IPC 1072 AMD 1:2017

    Intellectual Property Protection in Electronic Assembly Manufacturing; Amendment 1
    3/1/2017 - Paper - English - IPC
    Learn More
    €29.70

  • IPC 9204:2017

    Guideline on Flexibility and Stretchability Testing for Printed Electronics
    2/1/2017 - Paper - English - IPC
    Learn More
    €94.60

  • PD IEC/TR 62899-250:2016

    Printed electronics. Material technologies required in printed electronics for wearable smart devices
    1/31/2017 - PDF - English - BSI
    Learn More
    €144.90

  • IEEE 1149.10:2017

    IEEE Standard for High-Speed Test Access Port and On-Chip Distribution Architecture
    1/1/2017 - PDF - English - IEEE
    Learn More
    €93.06

  • IPC-6010-SERIES - Hard copy

    IPC-6010 Family of Board Performance Documents The series includes IPC-6011, IPC-6012D, IPC-6013C, IPC-6015, IPC-6017 & IPC-6018B
    1/1/2017 - Paper - English - IPC
    Learn More
    €743.60

  • NF C93-735-1, NF EN 61189-5-1 (12/2016)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1 : general test methods for materials and assemblies - Guidance for printed board assemblies
    12/23/2016 - PDF - English - UTE
    Learn More
    €91.08

  • NF C93-732-719, NF EN 61189-2-719 (12/2016)

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
    12/23/2016 - PDF - English - UTE
    Learn More
    €91.08

  • IEC/TR 62899-250 (2016-12)

    IEC TR 62899-250:2016 Printed electronics - Part 250: Material technologies required in printed electronics for wearable smart devices
    12/14/2016 - PDF - English - CEI
    Learn More
    €71.00

  • NF EN 61189-5-1, C93-735-1 (12/2016)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1 : general test methods for materials and assemblies - Guidance for printed board assemblies - Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 5-1 : Méthodes d'essai générales pour les matériaux et assemblages - Lignes directrices pour les assemblages de cartes à circuit imprimé
    12/1/2016 - Paper - French - AFNOR
    Learn More
    €91.08

  • DIN EN 62326-20:2016-12

    Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (IEC 62326-20:2016); German version EN 62326-20:2016
    12/1/2016 - PDF - German - DIN
    Learn More
    €147.20

  • DIN EN 61189-3-719:2016-12

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016
    12/1/2016 - PDF - German - DIN
    Learn More
    €82.60

  • DIN EN 16602-70-12:2016-12

    Space product assurance - Design rules for printed circuit boards; English version EN 16602-70-12:2016
    12/1/2016 - PDF - English - DIN
    Learn More
    €308.20

  • NF EN 61189-2-719, C93-732-719 (12/2016)

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) - Méthode d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-719 : méthodes d'essai des matériaux pour structures d'interconnexion - Permittivité relative et tangente de perte (500 MHz à 10 GHz).
    12/1/2016 - Paper - French - AFNOR
    Learn More
    €91.08

  • IPC 2581B + AMD 1:2016

    Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology; with Amendment 1
    12/1/2016 - Paper - English - IPC
    Learn More
    €176.00

  • BS IEC 63055:2016

    Format for LSI-Package-Board interoperable design
    11/30/2016 - PDF - English - BSI
    Learn More
    €379.50

  • NBN EN 16602-70-12:2016

    Space product assurance - Design rules for printed circuit boards
    11/23/2016 - PDF - English - NBN
    Learn More
    €155.00

  • NBN EN 16602-70-12:2016

    Space product assurance - Design rules for printed circuit boards
    11/23/2016 - PDF - French - NBN
    Learn More
    €155.00

  • IEC 63055 (2016-11)

    IEC 63055:2016 Format for LSI-Package-Board Interoperable design
    11/8/2016 - PDF - English - CEI
    Learn More
    €355.00

  • NF C93-733-719, NF EN 61189-3-719 (11/2016)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719 : test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
    11/5/2016 - PDF - English - UTE
    Learn More
    €91.08

  • NF EN 61189-3-719, C93-733-719 (11/2016)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719 : test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling - Méthodes d'essai pour les matériaux électriques, les cartes imprimées, et autres structures d'interconnexion et ensembles - Partie 3-719 : méthodes d'essai pour les structures d'interconnexion (cartes imprimées) - Contrôles de la variation de résistance des trous métallisés uniques (PTH) au cours
    11/1/2016 - Paper - French - AFNOR
    Learn More
    €91.08

  • NF EN 16602-70-28, L90-200-70-28 (11/2016)

    Space product assurance - Repair and modification of printed circuit board assemblies for space use - Assurance produit des projets spatiaux - Réparation et modification des ensembles de circuits imprimés pour utilisation spatiale
    11/1/2016 - Paper - French - AFNOR
    Learn More
    €174.63

  • UNE-EN 61189-2-719:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (Endorsed by AENOR in November of 2016.)
    11/1/2016 - PDF - English - AENOR
    Learn More
    €66.00

  • UNE-EN 61189-5-1:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (Endorsed by AENOR in November of 2016.)
    11/1/2016 - PDF - English - AENOR
    Learn More
    €70.00

  • UNE-EN 16602-70-12:2016

    Space product assurance - Design rules for printed circuit boards (Endorsed by AENOR in November of 2016.)
    11/1/2016 - PDF - English - AENOR
    Learn More
    €179.00

  • BS EN 61189-5-1:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies
    10/31/2016 - PDF - English - BSI
    Learn More
    €202.40

  • BS EN 61189-2-719:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz)
    10/31/2016 - PDF - English - BSI
    Learn More
    €202.40

  • BS EN 16602-70-12:2016

    Space product assurance. Design rules for printed circuit boards
    10/31/2016 - PDF - English - BSI
    Learn More
    €379.50

  • NF EN 61249-2-43, C93-780-2-43 (09/2016)

    Materials for printed boards and other interconnecting structures - Part 2-43 : reinforced base materials clad and unclad - Non halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly - Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-43 : matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/papier cellulose époxyde non halogéné, plaquées cuivre, d'inflammabilité définie (essai de
    9/1/2016 - Paper - French - AFNOR
    Learn More
    €91.08

  • NF EN 61249-2-44, C93-780-2-44 (09/2016)

    Materials for printed boards and other interconnecting structures - Part 2-44 : reinforced base materials clad and unclad - Non halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly - Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-44 : matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/non-tissé époxyde non halogéné, plaquées cuivre, d'inflammabilité définie (essai de
    9/1/2016 - Paper - French - AFNOR
    Learn More
    €91.08

  • IPC 9252B:2016

    Requirements for Electrical Testing of Unpopulated Printed Boards
    9/1/2016 - Paper - English - IPC
    Learn More
    €91.30

  • IPC 2223D:2016

    Sectional Design Standard for Flexible Printed Boards
    9/1/2016 - Paper - English - IPC
    Learn More
    €162.80

  • PD IEC/TS 61189-3-301:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB
    8/31/2016 - PDF - English - BSI
    Learn More
    €144.90

  • NF EN 61188-5-3, C93-711-5-3 (08/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-3 : attachment (land/joint) considerations - Components with gull-wing leads on two sides - Cartes imprimées et cartes imprimées équipées - Conception et utilisation - Partie 5-3 : considérations sur les liaisons pistes-soudures - Composants à sortie en aile de mouette sur deux côtés
    8/1/2016 - Paper - French - AFNOR
    Learn More
    €102.58

  • UNE-EN 61249-2-44:2016

    Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)
    8/1/2016 - PDF - English - AENOR
    Learn More
    €66.00

  • UNE-EN 61249-2-43:2016

    Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)
    8/1/2016 - PDF - English - AENOR
    Learn More
    €15.00

  • BS EN 61249-2-43:2016

    Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    7/31/2016 - PDF - English - BSI
    Learn More
    €202.40

  • BS EN 61249-2-44:2016

    Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    7/31/2016 - PDF - English - BSI
    Learn More
    €202.40

  • IEC/TS 61189-3-301 (2016-07)

    IEC TS 61189-3-301:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-301: Test methods for interconnection structures (printed boards) - Appearance inspection method for plated surfaces on PWB
    7/28/2016 - PDF - English - CEI
    Learn More
    €71.00

  • IEC 61189-2-719 (2016-07)

    IEC 61189-2-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
    7/12/2016 - PDF - English, French - CEI
    Learn More
    €102.00

  • IEC 61189-5-1 (2016-07)

    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    7/5/2016 - PDF - English, French - CEI
    Learn More
    €173.00

  • NF EN 61188-5-4, C93-711-5-4 (07/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-4 : attachment (land/joint) consideration - Components with J leads on two sides - Cartes imprimées et cartes imprimées équipées
    7/1/2016 - Paper - French - AFNOR
    Learn More
    €77.83

  • NF EN 61188-5-5, C93-711-5-5 (07/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-5 : Attachment (land/joint) considerations - Components with gull-wing leads on four sides - Cartes imprimées et cartes imprimées équipées
    7/1/2016 - Paper - French - AFNOR
    Learn More
    €124.52

  • NF EN 61188-5-8, C93-711-5-8 (07/2016)

    Printed boards and printed board assemblies - Design and use - Part 5-8 : Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) - Cartes imprimées et cartes imprimées équipées
    7/1/2016 - Paper - French - AFNOR
    Learn More
    €102.58

  • NF EN 62326-20, C93-707-20 (07/2016)

    Printed boards - Part 20 : printed circuit boards for high-brightness LEDs - Cartes imprimées - Partie 20 : cartes de circuits imprimés destinées aux LED à haute luminosité
    7/1/2016 - Paper - French - AFNOR
    Learn More
    €135.47

  • IPC 6018C:2016

    Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
    7/1/2016 - Paper - English - IPC
    Learn More
    €170.50

  • IPC 6018CS:2016

    Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
    7/1/2016 - Paper - English - IPC
    Learn More
    €94.60

  • UNE-EN 62326-20:2016

    Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (Endorsed by AENOR in June of 2016.)
    6/1/2016 - PDF - English - AENOR
    Learn More
    €87.00

  • IPC 1601A:2016

    Printed Board Handling and Storage Guidelines
    6/1/2016 - Paper - English - IPC
    Learn More
    €91.30

  • IPC 9691B:2016

    User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
    6/1/2016 - Paper - English - IPC
    Learn More
    €162.80

  • BS EN 62326-20:2016

    Printed boards. Printed circuit boards for high-brightness LEDs
    5/31/2016 - PDF - English - BSI
    Learn More
    €282.90

  • IEC 61249-2-43 (2016-05)

    IEC 61249-2-43:2016 Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    5/12/2016 - PDF - English, French - CEI
    Learn More
    €142.00

  • IEC 61249-2-44 (2016-05)

    IEC 61249-2-44:2016 Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    5/12/2016 - PDF - English, French - CEI
    Learn More
    €142.00

  • UNE-EN 61189-3-719:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (Endorsed by AENOR in May of 2016.)
    5/1/2016 - PDF - English - AENOR
    Learn More
    €57.00

  • ASTM F1896-16

    Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
    5/1/2016 - PDF - English - ASTM
    Learn More
    €38.00

  • ASTM F1896-16 + Redline

    Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
    5/1/2016 - PDF - English - ASTM
    Learn More
    €45.00

  • IPC A-600J:2016

    Acceptability of Printed Boards
    5/1/2016 - Paper - French - IPC
    Learn More
    €312.40

  • IPC A-600J:2016

    Acceptability of Printed Boards
    5/1/2016 - Paper - English - IPC
    Learn More
    €220.00

  • BS EN 61189-3-719:2016

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
    4/30/2016 - PDF - English - BSI
    Learn More
    €144.90

  • NF EN 16602-70-11, L90-200-70-11 (04/2016)

    Space product assurance - Procurement of printed circuit boards - Assurance produit des projets spatiaux - Approvisionnement des circuits imprimés
    4/1/2016 - Paper - French - AFNOR
    Learn More
    €136.35

  • NF EN 16602-70-10, L90-200-70-10 (04/2016)

    Space product assurance - Qualification of printed circuit boards - Assurance produit des projets spatiaux - Qualification des circuits imprimés
    4/1/2016 - Paper - French - AFNOR
    Learn More
    €181.34

  • IPC 1071B:2016

    Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing
    4/1/2016 - Paper - English - IPC
    Learn More
    €91.30

  • BS IEC 62899-202:2016

    Printed electronics. Materials. Conductive ink
    3/31/2016 - PDF - English - BSI
    Learn More
    €236.90

  • DIN EN 62878-1-1:2016-03

    Device embedded substrate - Part 1-1: Generic specification - Test methods (IEC 62878-1-1:2015); German version EN 62878-1-1:2015
    3/1/2016 - PDF - German - DIN
    Learn More
    €158.30

  • IEC 62899-201 (2016-02)

    IEC 62899-201:2016 Printed electronics - Part 201: Materials - Substrates
    2/25/2016 - PDF - English - CEI
    Learn More
    €244.00

  • IEC 62899-202 (2016-02)

    IEC 62899-202:2016 Printed electronics - Part 202: Materials - Conductive ink
    2/25/2016 - PDF - English - CEI
    Learn More
    €203.00

  • IEC 62326-20 (2016-02)

    IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
    2/3/2016 - PDF - English, French - CEI
    Learn More
    €244.00

  • IPC 9121:2016

    Troubleshooting for Printed Board Fabrication Processes
    2/1/2016 - Paper - English - IPC
    Learn More
    €357.50

  • IEC 61189-3-719 (2016-01)

    IEC 61189-3-719:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
    1/5/2016 - PDF - English, French - CEI
    Learn More
    €41.00

  • IEC 61189-3-913 (2016-01)

    IEC 61189-3-913:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
    1/5/2016 - PDF - English, French - CEI
    Learn More
    €173.00

  • IPC 4562A + AMD 1:2016

    Metal Foil for Printed Board Applications; with Amendment 1
    1/1/2016 - Paper - English - IPC
    Learn More
    €144.10

  • IPC 4556 AMD 1:2016

    Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
    1/1/2016 - Paper - English - IPC
    Learn More
    €49.50

  • PD IEC/TR 62878-2-2:2015

    Device embedded substrate. Guidelines. Electrical testing
    12/31/2015 - PDF - English - BSI
    Learn More
    €144.90

  • PD IEC/TR 63017:2015

    Flexible printed circuit boards (FPCBs). Method of compensation of impedance variations
    12/16/2015 - PDF - English - BSI
    Learn More
    €144.90

  • PD IEC/TR 63018:2015

    Flexible printed circuit boards (FPCBs). Method to decrease signal loss by using noise suppression materials
    12/16/2015 - PDF - English - BSI
    Learn More
    €144.90

  • IEC/TR 63018 (2015-12)

    IEC TR 63018:2015 Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials
    12/16/2015 - PDF - English - CEI
    Learn More
    €71.00

  • IEC/TR 63017 (2015-12)

    IEC TR 63017:2015 Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations
    12/16/2015 - PDF - English - CEI
    Learn More
    €71.00

  • IEC/TR 62878-2-2 (2015-12)

    IEC TR 62878-2-2:2015 Device embedded substrate - Part 2-2: Guidelines - Electrical testing
    12/4/2015 - PDF - English, French - CEI
    Learn More
    €71.00

  • JIS C 61191-1:2015

    Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    11/20/2015 - PDF - Japanese - JSA
    Learn More
    €50.18

  • JIS C 61191-2:2015

    Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    11/20/2015 - PDF - Japanese - JSA
    Learn More
    €41.86

  • DIN EN 61189-5-4:2015-11

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015); German version EN 61189-5-4:2015
    11/1/2015 - PDF - German - DIN
    Learn More
    €108.80

  • DIN EN 61189-5-2:2015-11

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015); German version EN 61189-5-2:2015
    11/1/2015 - PDF - German - DIN
    Learn More
    €136.80

  • DIN EN 61189-5-3:2015-11

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version EN 61189-5-3:2015
    11/1/2015 - PDF - German - DIN
    Learn More
    €141.90

  • IPC HDBK-4691:2015

    Handbook on Adhesive Bonding in Electronic Assembly Operations
    11/1/2015 - Paper - English - IPC
    Learn More
    €162.80

  • DIN EN 61191-1:2015-10

    Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 91/1276/CD:2015)
    10/1/2015 - PDF - English, German - DIN
    Learn More
    €147.20

  • NF EN 61189-2-721, C93-732-721 (10/2015)

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721 : test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator - Méthodes d'essais pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-721 : méthodes d'essai des matériaux pour structures d'interconnexion - Mesure de la permittivité relative et de la tangente de perte pour les
    10/1/2015 - Paper - French - AFNOR
    Learn More
    €91.08

  • NF EN 62878-1-1, C93-778-1-1 (10/2015)

    Device embedded substrate - Part 1-1 : generic specification - Test methods - Substrat intégré à l'appareil
    10/1/2015 - Paper - French - AFNOR
    Learn More
    €135.47

  • IPC 6012D:2015

    Qualification and Performance Specification for Rigid Printed Boards
    9/22/2015 - Paper - English - IPC
    Learn More
    €170.50

  • IPC 6012DS:2015

    Space and Military Avionics Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards
    9/22/2015 - Paper - English - IPC
    Learn More
    €91.30

  • IPC 6012D:2015

    Qualification and Performance Specification for Rigid Printed Boards
    9/1/2015 - Paper - French - IPC
    Learn More
    €257.40

  • IPC 6012DS:2015

    Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards
    9/1/2015 - Paper - French - IPC
    Learn More
    €136.40

  • PD IEC/PAS 62878-2-5:2015

    Device embedded substrate. Guidelines. Data format
    8/31/2015 - PDF - English - BSI
    Learn More
    €236.90

  • IEC/PAS 62878-2-5 (2015-08)

    IEC PAS 62878-2-5:2015 Device embedded substrate - Guidelines - Data format
    8/5/2015 - PDF - English - CEI
    Learn More
    €203.00

  • UNE-EN 61189-2-721:2015

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (Endorsed by AENOR in August of 2015.)
    8/1/2015 - PDF - English - AENOR
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    €69.00

  • UNE-EN 62878-1-1:2015

    Device embedded substrate - Part 1-1: Generic specification - Test methods (Endorsed by AENOR in August of 2015.)
    8/1/2015 - PDF - English - AENOR
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    €94.00

  • BS EN 62878-1-1:2015

    Device embedded substrate. Generic specification. Test methods
    7/31/2015 - PDF - English - BSI
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    €282.90

  • IPC JPCA 6901:2015

    Application Categories for Printed Electronics
    7/1/2015 - Paper - English - IPC
    Learn More
    €94.60

  • BS EN 61189-2-721:2015

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
    6/30/2015 - PDF - English - BSI
    Learn More
    €202.40

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