Call +33 (1) 40 02 03 05

31.080.99 : Other semiconductor devices

Items 1 to 200 of 268 total

Set Ascending Direction
per page

List  Grid 

Page:
  1. 1
  2. 2
  • IEC 63150-1 (2019-05)

    IEC 63150-1:2019 Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 1: Arbitrary and random mechanical vibrations
    5/10/2019 - PDF - English, French - CEI
    Learn More
    €203.00

  • IEC 62951-6 (2019-05)

    IEC 62951-6:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
    5/6/2019 - PDF - English, French - CEI
    Learn More
    €142.00

  • IEC 62951-2 (2019-04)

    IEC 62951-2:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 2: Evaluation method for electron mobility, sub-threshold swing and threshold voltage of flexible devices
    4/17/2019 - PDF - English, French - CEI
    Learn More
    €41.00

  • IEC 62047-31 (2019-04)

    IEC 62047-31:2019 Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
    4/5/2019 - PDF - English - CEI
    Learn More
    €71.00

  • IEC 62047-33 (2019-04)

    IEC 62047-33:2019 Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device
    4/5/2019 - PDF - English - CEI
    Learn More
    €142.00

  • IEC 62047-34 (2019-04)

    IEC 62047-34:2019 Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
    4/5/2019 - PDF - English - CEI
    Learn More
    €71.00

  • IEC 62047-36 (2019-04)

    IEC 62047-36:2019 Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
    4/5/2019 - PDF - English - CEI
    Learn More
    €71.00

  • IEC 62830-4 (2019-02)

    IEC 62830-4:2019 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 4: Test and evaluation methods for flexible piezoelectric energy harvesting devices
    2/27/2019 - PDF - English, French - CEI
    Learn More
    €203.00

  • IEC 62951-4 (2019-02)

    IEC 62951-4:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for flexible conductive thin film on the substrate for flexible semiconductor devices
    2/27/2019 - PDF - English, French - CEI
    Learn More
    €71.00

  • IEC 62951-5 (2019-02)

    IEC 62951-5:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
    2/27/2019 - PDF - English, French - CEI
    Learn More
    €102.00

  • IEC 62951-7 (2019-02)

    IEC 62951-7:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
    2/27/2019 - PDF - English, French - CEI
    Learn More
    €71.00

  • IEC 63068-1 (2019-01)

    IEC 63068-1:2019 Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects
    1/30/2019 - PDF - English - CEI
    Learn More
    €142.00

  • IEC 63068-2 (2019-01)

    IEC 63068-2:2019 Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection
    1/30/2019 - PDF - English - CEI
    Learn More
    €142.00

  • IEC 62047-32 (2019-01)

    IEC 62047-32:2019 Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators
    1/24/2019 - PDF - English, French - CEI
    Learn More
    €102.00

  • IEC 60050-523 (2018-12)

    IEC 60050-523:2018 International Electrotechnical Vocabulary (IEV) - Part 523: Micro-electromechanical devices
    12/6/2018 - PDF - English, French - CEI
    Learn More
    €142.00

  • IEC 62951-3 (2018-11)

    IEC 62951-3:2018 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics on flexible substrates under bulging
    11/7/2018 - PDF - English - CEI
    Learn More
    €142.00

  • BS EN IEC 62969-4:2018

    Semiconductor devices. Semiconductor interface for automotive vehicles. Evaluation method of data interface for automotive vehicle sensors
    8/30/2018 - PDF - English - BSI
    Learn More
    €144.90

  • NF C96-069-4, NF EN IEC 62969-4 (08/2018)

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4 : evaluation method of data interface for automotive vehicle sensors
    8/24/2018 - PDF - French - UTE
    Learn More
    €77.83

  • BS EN IEC 62969-3:2018

    Semiconductor devices. Semiconductor interface for automotive vehicles. Shock driven piezoelectric energy harvesting for automotive vehicle sensors
    6/28/2018 - PDF - English - BSI
    Learn More
    €202.40

  • NF C96-069-3, NF EN IEC 62969-3 (06/2018)

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3 : shock driven piezoelectric energy harvesting for automotive vehicle sensors
    6/22/2018 - PDF - French - UTE
    Learn More
    €91.08

  • IEC 62969-4 (2018-06)

    IEC 62969-4:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors
    6/18/2018 - PDF - English, French - CEI
    Learn More
    €102.00

  • IEC 62969-3 (2018-05)

    IEC 62969-3:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
    5/7/2018 - PDF - English, French - CEI
    Learn More
    €142.00

  • BS IEC 62951-1:2017

    Semiconductor devices. Flexible and stretchable semiconductor devices. Bending test method for conductive thin films on flexible substrates
    5/4/2018 - PDF - English - BSI
    Learn More
    €144.90

  • BS EN IEC 62969-2:2018

    Semiconductor devices. Semiconductor interface for automotive vehicles. Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
    5/2/2018 - PDF - English - BSI
    Learn More
    €121.90

  • NF C96-069-2, NF EN IEC 62969-2 (04/2018)

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2 : efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
    4/27/2018 - PDF - French - UTE
    Learn More
    €63.42

  • NF C96-069-2, NF EN IEC 62969-2 (04/2018)

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2 : efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
    4/27/2018 - PDF - English - UTE
    Learn More
    €63.42

  • DIN EN 60747-16-4:2018-04

    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017); German version EN 60747-16-4:2004 + A1:2011 + A2:2017
    4/1/2018 - PDF - German - DIN
    Learn More
    €114.10

  • DIN EN 60747-16-3:2018-04

    Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002 + A1:2009 + A2:2017); German version EN 60747-16-3:2002 + A1:2009 + A2:2017
    4/1/2018 - PDF - German - DIN
    Learn More
    €141.90

  • BS IEC 62047-29:2017

    Semiconductor devices. Micro-electromechanical devices. Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
    3/15/2018 - PDF - English - BSI
    Learn More
    €121.90

  • IEC 62031 (2018-03)

    IEC 62031:2018 LED modules for general lighting - Safety specifications
    3/8/2018 - PDF - English, French - CEI
    Learn More
    €142.00

  • IEC 62031 Redline version (2018-03)

    IEC 62031:2018 RLV LED modules for general lighting - Safety specifications
    3/8/2018 - PDF - English - CEI
    Learn More
    €185.00

  • IEC 62969-2 (2018-03)

    IEC 62969-2:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
    3/8/2018 - PDF - English, French - CEI
    Learn More
    €41.00

  • UNE-EN IEC 62969-1:2018

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors (Endorsed by Asociación Española de Normalización in March of 2018.)
    3/1/2018 - PDF - English - AENOR
    Learn More
    €68.00

  • BS EN IEC 62969-1:2018

    Semiconductor devices. Semiconductor interface for automotive vehicles. General requirements of power interface for automotive vehicle sensors
    2/22/2018 - PDF - English - BSI
    Learn More
    €144.90

  • NF C96-069-1, NF EN IEC 62969-1 (02/2018)

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1 : general requirements of power interface for automotive vehicle sensors
    2/16/2018 - PDF - French - UTE
    Learn More
    €91.08

  • NF C96-069-1, NF EN IEC 62969-1 (02/2018)

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1 : general requirements of power interface for automotive vehicle sensors
    2/16/2018 - PDF - English - UTE
    Learn More
    €91.08

  • UNE-EN 60747-16-3:2002/A2:2017

    Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (Endorsed by Asociación Española de Normalización in January of 2018.)
    1/1/2018 - PDF - English - AENOR
    Learn More
    €40.00

  • IEC 62969-1 (2017-12)

    IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
    12/13/2017 - PDF - English, French - CEI
    Learn More
    €71.00

  • IEC 62969-1 (2017-12)

    IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
    12/13/2017 - PDF - English - CEI
    Learn More
    €71.00

  • UNE-EN 60747-16-4:2004/A2:2017

    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (Endorsed by Asociación Española de Normalización in December of 2017.)
    12/1/2017 - PDF - English - AENOR
    Learn More
    €40.00

  • IEC 62047-29 (2017-11)

    IEC 62047-29:2017 Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
    11/22/2017 - PDF - English - CEI
    Learn More
    €71.00

  • BS IEC 62047-30:2017

    Semiconductor devices. Micro-electromechanical devices. Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
    10/9/2017 - PDF - English - BSI
    Learn More
    €144.90

  • DIN EN 60747-16-1:2017-10

    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 60747-16-1:2001 - A1:2007 - A2:2017); German version EN 60747-16-1:2002 + A1:2007 + A2:2017
    10/1/2017 - PDF - German - DIN
    Learn More
    €163.80

  • DIN EN 62477-1 VDE 0558-477-1:2017-10

    Safety requirements for power electronic converter systems and equipment - Part 1: General (IEC 62477-1:2012 + A1:2016); German version EN 62477-1:2012 + A11:2014 + A1:2017
    10/1/2017 - Paper - German - VDE
    Learn More
    €268.93

  • IEC 62047-30 (2017-09)

    IEC 62047-30:2017 Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
    9/15/2017 - PDF - English - CEI
    Learn More
    €102.00

  • NF C96-016-1/A2, NF EN 60747-16-1/A2 (08/2017)

    Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
    8/19/2017 - PDF - French - UTE
    Learn More
    €63.42

  • NF C96-016-1/A2, NF EN 60747-16-1/A2 (08/2017)

    Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
    8/19/2017 - PDF - English - UTE
    Learn More
    €63.42

  • IEC 60747-16-3 Edition 1.2 (2017-08)

    IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 consolidated version Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    8/16/2017 - PDF - English - CEI
    Learn More
    €305.00

  • IEC 60747-16-3 AMD 2 (2017-08)

    IEC 60747-16-3:2002/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    8/16/2017 - PDF - English - CEI
    Learn More
    €10.00

  • IEC 60747-16-4 Edition 1.2 (2017-08)

    IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 consolidated version Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    8/16/2017 - PDF - English - CEI
    Learn More
    €254.00

  • IEC 60747-16-4 AMD 2 (2017-08)

    IEC 60747-16-4:2004/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    8/16/2017 - PDF - English - CEI
    Learn More
    €10.00

  • BS IEC 62830-2:2017

    Semiconductor devices. Semiconductor devices for energy harvesting and generation. Thermo power based thermoelectric energy harvesting
    8/10/2017 - PDF - English - BSI
    Learn More
    €144.90

  • DIN EN 60747-16-6:2017-08

    Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 47E/568/CD:2017)
    8/1/2017 - PDF - English, German - DIN
    Learn More
    €114.10

  • UNE-EN 60747-16-1:2002/A2:2017

    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (Endorsed by Asociación Española de Normalización in July of 2017.)
    7/1/2017 - PDF - English - AENOR
    Learn More
    €37.00

  • BS IEC 62830-3:2017

    Semiconductor devices. Semiconductor devices for energy harvesting and generation. Vibration based electromagnetic energy harvesting
    4/30/2017 - PDF - English - BSI
    Learn More
    €202.40

  • IEC 62951-1 (2017-04)

    IEC 62951-1:2017 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
    4/10/2017 - PDF - English - CEI
    Learn More
    €71.00

  • DIN EN 62047-25:2017-04

    Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
    4/1/2017 - PDF - German - DIN
    Learn More
    €103.00

  • IEC 62830-3 (2017-03)

    IEC 62830-3:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
    3/28/2017 - PDF - English, French - CEI
    Learn More
    €142.00

  • JIS C 5630-1:2017

    Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
    3/21/2017 - PDF - Japanese - JSA
    Learn More
    €41.86

  • IEC 62830-1 (2017-03)

    IEC 62830-1:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
    3/3/2017 - PDF - English, French - CEI
    Learn More
    €142.00

  • IEC 60747-16-1 Edition 1.2 (2017-02)

    IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 consolidated version Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    2/15/2017 - PDF - English, French - CEI
    Learn More
    €457.00

  • IEC 60747-16-1 AMD 2 (2017-02)

    IEC 60747-16-1:2001/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    2/15/2017 - PDF - English, French - CEI
    Learn More
    €20.00

  • IEC 62047-27 (2017-01)

    IEC 62047-27:2017 Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
    1/20/2017 - PDF - English - CEI
    Learn More
    €71.00

  • IEC 62047-28 (2017-01)

    IEC 62047-28:2017 Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
    1/20/2017 - PDF - English - CEI
    Learn More
    €102.00

  • IEC 62830-2 (2017-01)

    IEC 62830-2:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
    1/20/2017 - PDF - English, French - CEI
    Learn More
    €71.00

  • DIN VDE V 0884-11 VDE V 0884-11:2017-01

    Semiconductor devices - Part 11: Magnetic and capacitive coupler for basic and reinforced isolation
    1/1/2017 - Paper - German - VDE
    Learn More
    €104.79

  • UNE-EN 62047-25:2016

    Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (Endorsed by Asociación Española de Normalización in January of 2017.)
    1/1/2017 - PDF - English - AENOR
    Learn More
    €74.00

  • NF C96-050-25, NF EN 62047-25 (12/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
    12/30/2016 - PDF - French - UTE
    Learn More
    €91.08

  • NF C96-050-25, NF EN 62047-25 (12/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
    12/30/2016 - PDF - English - UTE
    Learn More
    €91.08

  • DIN EN 62477-2 VDE 0558-477-2:2016-12

    Safety requirements for power electronic converter systems and equipment - Part 2: Power electronic converters from 1000 V a.c. or 1500 V d.c. up to 36 kV a.c. or 54 kV d.c. (IEC 22/275/CDV:2016); German version prEN 62477-2:2016
    12/1/2016 - Paper - German - VDE
    Learn More
    €95.02

  • BS EN 62047-25:2016

    Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
    11/30/2016 - PDF - English - BSI
    Learn More
    €202.40

  • NF C96-050-1, NF EN 62047-1 (11/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 1 : terms and definitions
    11/5/2016 - PDF - French - UTE
    Learn More
    €102.58

  • NF C96-050-1, NF EN 62047-1 (11/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 1 : terms and definitions
    11/5/2016 - PDF - English - UTE
    Learn More
    €102.58

  • IEC 62047-25 (2016-08)

    IEC 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
    8/29/2016 - PDF - English, French - CEI
    Learn More
    €142.00

  • NF C96-050-26, NF EN 62047-26 (06/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 26 : description and measurement methods for micro trench and needle structures
    6/25/2016 - PDF - French - UTE
    Learn More
    €102.58

  • UNE-EN 62047-26:2016

    Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (Endorsed by AENOR in June of 2016.)
    6/1/2016 - PDF - English - AENOR
    Learn More
    €78.00

  • BS EN 62047-26:2016

    Semiconductor devices. Micro-electromechanical devices. Description and measurement methods for micro trench and needle structures
    5/31/2016 - PDF - English - BSI
    Learn More
    €236.90

  • UNE-EN 62047-1:2016

    Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (Endorsed by AENOR in May of 2016.)
    5/1/2016 - PDF - English - AENOR
    Learn More
    €81.00

  • BS EN 62047-1:2016

    Semiconductor devices. Micro-electromechanical devices. Terms and definitions
    4/30/2016 - PDF - English - BSI
    Learn More
    €236.90

  • JIS C 6790:2016

    Load test of a bolt-clamped Langevin vibrator using wattmeter method
    3/22/2016 - PDF - Japanese - JSA
    Learn More
    €25.00

  • IEC 60747-5-6 (2016-02)

    IEC 60747-5-6:2016 Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
    2/23/2016 - PDF - English, French - CEI
    Learn More
    €305.00

  • IEC 60747-5-7 (2016-02)

    IEC 60747-5-7:2016 Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors
    2/23/2016 - PDF - English, French - CEI
    Learn More
    €142.00

  • IEC 62047-26 (2016-01)

    IEC 62047-26:2016 Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
    1/7/2016 - PDF - English, French - CEI
    Learn More
    €173.00

  • IEC 62047-1 (2016-01)

    IEC 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
    1/6/2016 - PDF - English, French - CEI
    Learn More
    €203.00

  • AS IEC 62477.1:2016

    Safety requirements for power electronic converter systems and equipment General
    1/1/2016 - PDF sécurisé - English - SA
    Learn More
    €197.62

  • NF C96-050-16, NF EN 62047-16 (11/2015)

    Semiconductor devices - Micro-electromechanical devices - Part 16 : test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
    11/14/2015 - PDF - French - UTE
    Learn More
    €77.83

  • NF C96-050-17, NF EN 62047-17 (11/2015)

    Semiconductor devices - Micro-electromechanical devices - Part 17 : bulge test method for measuring mechanical properties of thin films
    11/14/2015 - PDF - French - UTE
    Learn More
    €102.58

  • PR NF C96-830-3, PR NF EN 62830-3 (08/2015)

    Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3 : vibration based electromagnetic energy harvesting
    8/28/2015 - Paper - French - AFNOR
    Learn More
    €63.76

  • UNE-EN 62047-16:2015

    Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (Endorsed by AENOR in August of 2015.)
    8/1/2015 - PDF - English - AENOR
    Learn More
    €61.00

  • UNE-EN 62047-17:2015

    Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (Endorsed by AENOR in August of 2015.)
    8/1/2015 - PDF - English - AENOR
    Learn More
    €77.00

  • BS EN 62047-15:2015

    Semiconductor devices. Micro-electromechanical devices. Test method of bonding strength between PDMS and glass
    7/31/2015 - PDF - English - BSI
    Learn More
    €144.90

  • BS EN 62047-17:2015

    Semiconductor devices. Micro-electromechanical devices. Bulge test method for measuring mechanical properties of thin films
    7/31/2015 - PDF - English - BSI
    Learn More
    €236.90

  • BS EN 62047-16:2015

    Semiconductor devices. Micro-electromechanical devices. Test methods for determining residual stresses of MEMS films. Wafer curvature and cantilever beam deflection methods
    7/31/2015 - PDF - English - BSI
    Learn More
    €144.90

  • UNE-EN 62031:2009/A2:2015

    LED modules for general lighting - Safety specifications
    5/6/2015 - PDF - Spanish - AENOR
    Learn More
    €29.00

  • UNE-EN 60747-5-5:2011/A1:2015

    Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers (Endorsed by AENOR in May of 2015.)
    5/1/2015 - PDF - English - AENOR
    Learn More
    €37.00

  • IEC 62047-16 (2015-03)

    IEC 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
    3/5/2015 - PDF - English, French - CEI
    Learn More
    €41.00

  • IEC 62047-17 (2015-03)

    IEC 62047-17:2015 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
    3/5/2015 - PDF - English, French - CEI
    Learn More
    €173.00

  • NF C96-050-22, NF EN 62047-22 (12/2014)

    Semiconductor devices - Micro-electromechanical devices - Part 22 : electromechanical tensile test method for conductive thin films on flexible substrates
    12/26/2014 - PDF - French - UTE
    Learn More
    €63.42

  • NF C96-050-21, NF EN 62047-21 (12/2014)

    Semiconductor devices - Micro-electromechanical devices - Part 21 : test method for Poisson's ratio of thin film MEMS materials
    12/26/2014 - PDF - French - UTE
    Learn More
    €77.83

  • NF C96-050-20, NF EN 62047-20 (12/2014)

    Semiconductor devices - Micro-electromechanical devices - Part 20 : gyroscopes
    12/26/2014 - PDF - French - UTE
    Learn More
    €135.47

  • PD CLC/TR 62258-4:2013

    Semiconductor die products. Questionnaire for die users and suppliers
    11/30/2014 - PDF - English - BSI
    Learn More
    €236.90

  • UNE-EN 62047-22:2014

    Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (Endorsed by AENOR in November of 2014.)
    11/1/2014 - PDF - English - AENOR
    Learn More
    €61.00

  • UNE-EN 62047-20:2014

    Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (Endorsed by AENOR in November of 2014.)
    11/1/2014 - PDF - English - AENOR
    Learn More
    €99.00

  • UNE-EN 62047-21:2014

    Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (Endorsed by AENOR in November of 2014.)
    11/1/2014 - PDF - English - AENOR
    Learn More
    €64.00

  • BS EN 62047-20:2014

    Semiconductor devices. Micro-electromechanical devices. Gyroscopes
    10/31/2014 - PDF - English - BSI
    Learn More
    €282.90

  • BS EN 62047-21:2014

    Semiconductor devices. Micro-electromechanical devices. Test method for Poisson's ratio of thin film MEMS materials
    10/31/2014 - PDF - English - BSI
    Learn More
    €144.90

  • BS EN 62047-22:2014

    Semiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates
    10/31/2014 - PDF - English - BSI
    Learn More
    €121.90

  • IEC 62047-20 (2014-06)

    IEC 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
    6/26/2014 - PDF - English, French - CEI
    Learn More
    €274.00

  • IEC 62047-21 (2014-06)

    IEC 62047-21:2014 Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
    6/19/2014 - PDF - English, French - CEI
    Learn More
    €71.00

  • IEC 62047-22 (2014-06)

    IEC 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
    6/19/2014 - PDF - English, French - CEI
    Learn More
    €41.00

  • DIN EN 60747-16-5:2014-04

    Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013); German version EN 60747-16-5:2013
    4/1/2014 - PDF - German - DIN
    Learn More
    €136.80

  • NF C96-050-19, NF EN 62047-19 (03/2014)

    Semiconductor devices - Micro-electromechanical devices - Part 19 : electronic compasses
    3/19/2014 - PDF - French - UTE
    Learn More
    €102.58

  • NF C96-050-11, NF EN 62047-11 (03/2014)

    Semiconductor devices - Micro-electromechanical devices - Part 11 : test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
    3/12/2014 - PDF - French - UTE
    Learn More
    €91.08

  • NF C96-050-18, NF EN 62047-18 (02/2014)

    Semiconductor devices - Micro-electromechanical devices - Part 18 : bend testing methods of thin film materials
    2/28/2014 - PDF - French - UTE
    Learn More
    €77.83

  • NF C96-016-5, NF EN 60747-16-5 (02/2014)

    Semiconductor devices - Part 16-5 : microwave integrated circuits - Oscillators
    2/22/2014 - PDF - French - UTE
    Learn More
    €112.42

  • UNE-EN 62031:2009/A1:2013

    LED modules for general lighting - Safety specifications
    12/4/2013 - PDF - Spanish - AENOR
    Learn More
    €44.00

  • UNE-EN 62047-19:2013

    Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (Endorsed by AENOR in November of 2013.)
    11/1/2013 - PDF - English - AENOR
    Learn More
    €80.00

  • UNE-EN 62047-18:2013

    Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)
    11/1/2013 - PDF - English - AENOR
    Learn More
    €64.00

  • UNE-EN 62047-11:2013

    Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (Endorsed by AENOR in November of 2013.)
    11/1/2013 - PDF - English - AENOR
    Learn More
    €71.00

  • BS EN 62047-11:2013

    Semiconductor devices. Micro-electromechanical devices. Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
    10/31/2013 - PDF - English - BSI
    Learn More
    €202.40

  • BS EN 62047-18:2013

    Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials
    10/31/2013 - PDF - English - BSI
    Learn More
    €144.90

  • BS EN 62047-19:2013

    Semiconductor devices. Micro-electromechanical devices. Electronic compasses
    10/31/2013 - PDF - English - BSI
    Learn More
    €236.90

  • UNE-EN 60747-16-5:2013

    Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (Endorsed by AENOR in October of 2013.)
    10/1/2013 - PDF - English - AENOR
    Learn More
    €86.00

  • BS EN 60747-16-5:2013

    Semiconductor devices. Microwave integrated circuits. Oscillators
    9/30/2013 - PDF - English - BSI
    Learn More
    €236.90

  • IEC 62047-11 (2013-07)

    IEC 62047-11:2013 Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
    7/17/2013 - PDF - English, French - CEI
    Learn More
    €102.00

  • IEC 62047-18 (2013-07)

    IEC 62047-18:2013 Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
    7/17/2013 - PDF - English, French - CEI
    Learn More
    €71.00

  • IEC 62047-19 (2013-07)

    IEC 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
    7/17/2013 - PDF - English, French - CEI
    Learn More
    €173.00

  • IEC 60747-16-5 (2013-06)

    IEC 60747-16-5:2013 Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
    6/19/2013 - PDF - English, French - CEI
    Learn More
    €244.00

  • NF C96-016-1/A1, NF EN 60747-16-1/A1 (05/2013)

    Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
    5/17/2013 - PDF - French - UTE
    Learn More
    €91.08

  • NF C96-016-3/A1, NF EN 60747-16-3/A1 (02/2013)

    Semiconductor devices - Part 16-3 : microwave integrated circuits - Frequency converters
    2/28/2013 - PDF - French - UTE
    Learn More
    €63.42

  • BS EN 62047-9:2011

    Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS
    1/31/2013 - PDF - English - BSI
    Learn More
    €202.40

  • NF C96-050-14, NF EN 62047-14 (12/2012)

    Semiconductor devices - Micro-electromechanical devices - Part 14 : forming limit measuring method of metallic film materials
    12/1/2012 - PDF - French - UTE
    Learn More
    €77.83

  • NF C96-050-13, NF EN 62047-13 (12/2012)

    Semiconductor devices - Micro-electromechanical devices - Part 13 : bend- and shear- type test methods of measuring adhesive strenght for MEMS structures
    12/1/2012 - PDF - French - UTE
    Learn More
    €77.83

  • NF C96-050-10, NF EN 62047-10 (12/2012)

    Semiconductor devices - Micro-electromechanical devices - Part 10 : micro-pillar compression test for MEMS materials
    12/1/2012 - PDF - French - UTE
    Learn More
    €77.83

  • IEC/TR 62258-4 (2012-08)

    IEC TR 62258-4:2012 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
    8/8/2012 - PDF - English, French - CEI
    Learn More
    €102.00

  • NF C96-050-12, NF EN 62047-12 (07/2012)

    Semiconductor devices - Micro-electromechanical devices - Part 12 : bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
    7/1/2012 - PDF - French - UTE
    Learn More
    €102.58

  • NF C96-016-4/A1, NF EN 60747-16-4/A1 (07/2012)

    Semiconductor devices - Part 16-4 : microwave integrated circuits - Switches
    7/1/2012 - PDF - French - UTE
    Learn More
    €63.42

  • UNE-EN 62047-13:2012

    Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (Endorsed by AENOR in June of 2012.)
    6/1/2012 - PDF - English - AENOR
    Learn More
    €65.00

  • UNE-EN 62047-14:2012

    Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (Endorsed by AENOR in June of 2012.)
    6/1/2012 - PDF - English - AENOR
    Learn More
    €68.00

  • UNE-EN 62047-9:2011

    Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)
    6/1/2012 - PDF - English - AENOR
    Learn More
    €75.00

  • UNE-EN 60747-15:2012

    Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (Endorsed by AENOR in June of 2012.)
    6/1/2012 - PDF - English - AENOR
    Learn More
    €75.00

  • BS EN 62047-13:2012

    Semiconductor devices. Micro-electromechanical devices. Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
    5/31/2012 - PDF - English - BSI
    Learn More
    €144.90

  • BS EN 62047-14:2012

    Semiconductor devices. Micro-electromechanical devices. Forming limit measuring method of metallic film materials
    5/31/2012 - PDF - English - BSI
    Learn More
    €144.90

  • NF C96-050-5, NF EN 62047-5 (05/2012)

    Semiconductor devices - Micro-electromechanical devices - Part 5 : RF MEMS switches
    5/1/2012 - PDF - French - UTE
    Learn More
    €112.42

  • BS EN 60747-15:2012

    Semiconductor devices. Discrete devices. Isolated power semiconductor devices
    4/30/2012 - PDF - English - BSI
    Learn More
    €202.40

  • IEC 62047-13 (2012-02)

    IEC 62047-13:2012 Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
    2/28/2012 - PDF - English, French - CEI
    Learn More
    €71.00

  • IEC 62047-14 (2012-02)

    IEC 62047-14:2012 Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
    2/28/2012 - PDF - English, French - CEI
    Learn More
    €102.00

  • UNE-EN 62047-12:2011

    Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (Endorsed by AENOR in February of 2012.)
    2/1/2012 - PDF - English - AENOR
    Learn More
    €78.00

  • DD IEC/PAS 60747-17:2011

    Semiconductor devices. Discrete devices. Magnetic and capacitive coupler for basic and reinforced isolation
    12/31/2011 - PDF - English - BSI
    Learn More
    €236.90

  • NF C96-034-2, NF EN 62258-2 (12/2011)

    Semiconductor die products - Part 2 : exchange data formats
    12/1/2011 - PDF - French - UTE
    Learn More
    €149.88

  • NF C96-050-7, NF EN 62047-7 (12/2011)

    Semiconductor devices - Micro-electromechanical devices - Part 7 : MEMS BAW filter and duplexer for radio frequency control and selection
    12/1/2011 - PDF - French - UTE
    Learn More
    €102.58

  • UNE-EN 62047-10:2011

    Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (Endorsed by AENOR in December of 2011.)
    12/1/2011 - PDF - English - AENOR
    Learn More
    €61.00

  • BS EN 62047-12:2011

    Semiconductor devices. Micro-electromechanical devices. Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
    11/30/2011 - PDF - English - BSI
    Learn More
    €236.90

  • IEC/PAS 60747-17 (2011-11)

    IEC PAS 60747-17:2011 Semiconductor devices - Discrete devices - Part 17: Magnetic and capacitive coupler for basic and reinforced isolation
    11/17/2011 - PDF - English - CEI
    Learn More
    €203.00

  • UNE-EN 62047-5:2011

    Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (Endorsed by AENOR in November of 2011.)
    11/1/2011 - PDF - English - AENOR
    Learn More
    €81.00

  • UNE-EN 62047-7:2011

    Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (Endorsed by AENOR in November of 2011.)
    11/1/2011 - PDF - English - AENOR
    Learn More
    €78.00

  • NF C96-050-8, NF EN 62047-8 (10/2011)

    Semiconductor devices - Micro-electromechanical devices - Part 8 : strip bending test method for tensile property measurement of thin films
    10/1/2011 - PDF - French - UTE
    Learn More
    €77.83

  • UNE-EN 62258-2:2011

    Semiconductor die products - Part 2: Exchange data formats (Endorsed by AENOR in October of 2011.)
    10/1/2011 - PDF - English - AENOR
    Learn More
    €117.00

  • BS EN 62047-5:2011

    Semiconductor devices. Micro-electromechanical devices. RF MEMS switches
    9/30/2011 - PDF - English - BSI
    Learn More
    €236.90

  • BS EN 62047-10:2011

    Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials
    9/30/2011 - PDF - English - BSI
    Learn More
    €144.90

  • IEC 62047-12 (2011-09)

    IEC 62047-12:2011 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
    9/13/2011 - PDF - English, French - CEI
    Learn More
    €173.00

  • NF C96-034-1, NF EN 62258-1 (09/2011)

    Semiconductor die products - Part 1 : procurement and use
    9/1/2011 - PDF - French - UTE
    Learn More
    €124.52

  • UNE-EN 62047-8:2011

    Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (Endorsed by AENOR in September of 2011.)
    9/1/2011 - PDF - English - AENOR
    Learn More
    €70.00

  • BS EN 62047-7:2011

    Semiconductor devices. Micro-electromechanical devices. MEMS BAW filter and duplexer for radio frequency control and selection
    8/31/2011 - PDF - English - BSI
    Learn More
    €236.90

  • BS EN 62258-2:2011

    Semiconductor die products. Exchange data formats
    7/31/2011 - PDF - English - BSI
    Learn More
    €303.60

  • IEC 62047-10 (2011-07)

    IEC 62047-10:2011 Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
    7/26/2011 - PDF - English, French - CEI
    Learn More
    €41.00

  • IEC 62047-5 (2011-07)

    IEC 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
    7/13/2011 - PDF - English, French - CEI
    Learn More
    €203.00

  • IEC 62047-9 (2011-07)

    IEC 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
    7/13/2011 - PDF - English, French - CEI
    Learn More
    €142.00

  • BS EN 62047-8:2011

    Semiconductor devices. Micro-electromechanical devices. Strip bending test method for tensile property measurement of thin films
    6/30/2011 - PDF - English - BSI
    Learn More
    €144.90

  • IEC 62047-7 (2011-06)

    IEC 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
    6/16/2011 - PDF - English, French - CEI
    Learn More
    €173.00

  • IEC 62258-2 (2011-05)

    IEC 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
    5/25/2011 - PDF - English, French - CEI
    Learn More
    €305.00

  • UNE-EN 60747-5-5:2011

    Semiconductor devices - Discrete devices -- Part 5-5: Optoelectronic devices - Photocouplers (Endorsed by AENOR in May of 2011.)
    5/1/2011 - PDF - English - AENOR
    Learn More
    €98.00

  • IEC 60747-16-4 Edition 1.1 (2011-04)

    IEC 60747-16-4:2004+AMD1:2009 consolidated version Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    4/21/2011 - PDF - English - CEI
    Learn More
    €254.00

  • IEC 60747-16-4 Edition 1.1 (2011-04)

    IEC 60747-16-4:2004+AMD1:2009 consolidated version Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    4/21/2011 - PDF - English, French - CEI
    Learn More
    €254.00

  • UNE-EN 60747-16-4:2004/A1:2011

    Semiconductor devices -- Part 16-4: Microwave integrated circuits - Switches (Endorsed by AENOR in April of 2011.)
    4/1/2011 - PDF - English - AENOR
    Learn More
    €30.00

  • IEC 62384 Edition 1.1 (2011-03)

    IEC 62384:2006+AMD1:2009 consolidated version DC or AC supplied electronic control gear for LED modules - Performance requirements
    3/30/2011 - PDF - English, French - CEI
    Learn More
    €107.00

  • IEC 62047-8 (2011-03)

    IEC 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
    3/14/2011 - PDF - English, French - CEI
    Learn More
    €102.00

  • UNE-EN 62047-4:2010

    Semiconductor devices - Micro-electromechanical devices -- Part 4: Generic specification for MEMS (Endorsed by AENOR in February of 2011.)
    2/1/2011 - PDF - English - AENOR
    Learn More
    €71.00

  • UNE-EN 62258-1:2010

    Semiconductor die products -- Part 1: Procurement and use (Endorsed by AENOR in February of 2011.)
    2/1/2011 - PDF - English - AENOR
    Learn More
    €87.00

  • IEC 60747-15 (2010-12)

    IEC 60747-15:2010 Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices
    12/16/2010 - PDF - English, French - CEI
    Learn More
    €142.00

  • BS EN 62047-4:2010

    Semiconductor devices. Micro-electromechanical devices. Generic specification for MEMS
    11/30/2010 - PDF - English - BSI
    Learn More
    €202.40

  • BS EN 62258-1:2010

    Semiconductor die products. Procurement and use
    11/30/2010 - PDF - English - BSI
    Learn More
    €257.60

  • IEC 62374-1 (2010-09)

    IEC 62374-1:2010 Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
    9/29/2010 - PDF - English, French - CEI
    Learn More
    €71.00

  • IEC/TR 62258-3 (2010-08)

    IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
    8/6/2010 - PDF - English, French - CEI
    Learn More
    €274.00

  • IEC/TR 62258-3 (2010-08)

    IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
    8/6/2010 - PDF - Russian - CEI
    Learn More
    €274.00

  • UNE-EN 62047-6:2010

    Semiconductor devices - Micro-electromechanical devices -- Part 6: Axial fatigue testing methods of thin film materials (Endorsed by AENOR in June of 2010.)
    6/1/2010 - PDF - English - AENOR
    Learn More
    €67.00

  • BS EN 62047-6:2010

    Semiconductor devices. Micro-electromechanical devices. Axial fatigue testing methods of thin film materials
    4/30/2010 - PDF - English - BSI
    Learn More
    €144.90

  • IEC 60747-16-3 Edition 1.1 (2010-04)

    IEC 60747-16-3:2002+AMD1:2009 consolidated version Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    4/28/2010 - PDF - English, French - CEI
    Learn More
    €305.00

  • BS EN 60904-4:2009

    Photovoltaic devices. Reference solar devices. Procedures for establishing calibration traceability
    1/31/2010 - PDF - English - BSI
    Learn More
    €202.40

  • BS IEC 60747-14-3:2009

    Semiconductor devices. Semiconductor sensors. Pressure sensors
    7/31/2009 - PDF - English - BSI
    Learn More
    €202.40

  • IEC 62384 AMD 1 (2009-07)

    IEC 62384:2006/AMD1:2009 Amendment 1 - DC or AC supplied electronic control gear for LED modules - Performance requirements
    7/14/2009 - PDF - English, French - CEI
    Learn More
    €10.00

  • UNE-EN 60747-16-3:2002/A1:2009

    Semiconductor devices -- Part 16-3: Microwave integrated circuits - Frequency converters (Endorsed by AENOR in July of 2009.)
    7/1/2009 - PDF - English - AENOR
    Learn More
    €30.00

  • IEC 60747-14-3 (2009-04)

    IEC 60747-14-3:2009 Semiconductor devices - Part 14-3: Semiconductor sensors - Pressure sensors
    4/29/2009 - PDF - English, French - CEI
    Learn More
    €102.00

  • IEC 62047-6 (2009-04)

    IEC 62047-6:2009 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
    4/7/2009 - PDF - English, French - CEI
    Learn More
    €71.00

  • IEC 62258-1 (2009-04)

    IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
    4/7/2009 - PDF - English, French - CEI
    Learn More
    €244.00

  • UNE-EN 62031:2009

    LED modules for general lighting - Safety specifications
    4/1/2009 - PDF - Spanish - AENOR
    Learn More
    €50.00

  • IEC 60747-16-3 AMD 1 (2009-03)

    IEC 60747-16-3:2002/AMD1:2009 Amendment 1 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    3/10/2009 - PDF - English - CEI
    Learn More
    €20.00

  • IEC 60747-16-4 AMD 1 (2009-03)

    IEC 60747-16-4:2004/AMD1:2009 Amendment 1 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    3/10/2009 - PDF - English - CEI
    Learn More
    €20.00

  • IEC 60747-16-3 AMD 1 (2009-03)

    IEC 60747-16-3:2002/AMD1:2009 Amendment 1 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    3/10/2009 - PDF - English, French - CEI
    Learn More
    €20.00

  • IEC 60747-16-4 AMD 1 (2009-03)

    IEC 60747-16-4:2004/AMD1:2009 Amendment 1 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    3/10/2009 - PDF - English, French - CEI
    Learn More
    €20.00

Items 1 to 200 of 268 total

Set Ascending Direction
per page

List  Grid 

Page:
  1. 1
  2. 2