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31.080.01 : Semiconductor devices in general

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  • IEC 60749-18 (2019-04)

    IEC 60749-18:2019 Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
    4/10/2019 - PDF - English, French - CEI
    Learn More
    €142.00

  • IEC 60749-18 Redline version (2019-04)

    IEC 60749-18:2019 RLV Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
    4/10/2019 - PDF - English - CEI
    Learn More
    €185.00

  • IEC 60749-17 (2019-03)

    IEC 60749-17:2019 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
    3/28/2019 - PDF - English, French - CEI
    Learn More
    €41.00

  • SAE ARP 6338A:2019-02-08

    Process for Assessment and Mitigation of Early Wearout of Life-Limited Microcircuits
    2/8/2019 - PDF - English - SAE
    Learn More
    €73.00

  • ANSI/ESDA/JEDEC JS-002:2018

    ESDA/JEDEC Joint Standard for Electrostatic Discharge Sensitivity Testing - Charged Device Model (CDM) - Device Level
    1/1/2019 - PDF - English - JEDEC
    Learn More
    €178.64

  • IEC 60050-521 AMD 2 (2018-12)

    IEC 60050-521:2002/AMD2:2018 Amendment 2 - International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
    12/6/2018 - PDF - English, French - CEI
    Learn More
    €10.00

  • DIN EN IEC 62969-3 VDE 0884-69-3:2018-12

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors (IEC 62969-3:2018); German version EN IEC 62969-3:2018
    12/1/2018 - Paper - German - VDE
    Learn More
    €74.10

  • DIN EN IEC 60749-20-1:2018-11

    Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018
    11/1/2018 - PDF - English, German - DIN
    Learn More
    €147.20

  • DIN EN IEC 60749-26 VDE 0884-749-26:2018-10

    Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 60749-26:2018); German version EN IEC 60749-26:2018
    10/1/2018 - Paper - German - VDE
    Learn More
    €121.28

  • DIN EN IEC 60749-13:2018-10

    Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (IEC 60749-13:2018); German version EN IEC 60749-13:2018
    10/1/2018 - PDF - German - DIN
    Learn More
    €89.00

  • DIN EN 60749-18:2018-10

    Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (IEC 47/2468/CDV:2018); German and English version prEN 60749-18:2018
    10/1/2018 - PDF - English, German - DIN
    Learn More
    €108.80

  • DIN EN IEC 62969-2 VDE 0884-69-2:2018-09

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors (IEC 62969-2:2018); German version EN IEC 62969-2:2018
    9/1/2018 - Paper - German - VDE
    Learn More
    €42.45

  • DIN EN IEC 62969-1 VDE 0884-69-1:2018-08

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors (IEC 62969-1:2017); German version EN IEC 62969-1:2018
    8/1/2018 - Paper - German - VDE
    Learn More
    €65.60

  • DIN EN 60749-17 VDE 0884-749-17:2018-07

    Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (IEC 47/2465/CDV:2018); German and English version prEN 60749-17:2018
    7/1/2018 - Paper - German - VDE
    Learn More
    €18.19

  • DIN EN IEC 60749-12:2018-07

    Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2017); German version EN IEC 60749-12:2018
    7/1/2018 - PDF - German - DIN
    Learn More
    €54.80

  • NF C96-013-4/A1, NF EN 60191-4/A1 (05/2018)

    Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
    5/18/2018 - PDF - French - UTE
    Learn More
    €77.83

  • NF C96-013-4/A1, NF EN 60191-4/A1 (05/2018)

    Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
    5/18/2018 - PDF - English - UTE
    Learn More
    €77.83

  • BS IEC 60191-2:1966+A20:2018

    Mechanical standardization of semiconductor devices. Dimensions
    5/1/2018 - PDF - English - BSI
    Learn More
    €556.60

  • DIN EN 60749-43:2018-05

    Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans (IEC 60749-43:2017); German version EN 60749-43:2017
    5/1/2018 - PDF - German - DIN
    Learn More
    €125.30

  • BS EN IEC 60191-1:2018

    Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of discrete devices
    4/30/2018 - PDF - English - BSI
    Learn More
    €236.90

  • BS EN IEC 60749-13:2018

    Semiconductor devices. Mechanical and climatic test methods. Salt atmosphere
    4/30/2018 - PDF - English - BSI
    Learn More
    €144.90

  • PR NF C96-271-1, PR NF EN 63011-1 (04/2018)

    Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions
    4/27/2018 - Paper - French - AFNOR
    Learn More
    €44.39

  • PR NF C96-271-2, PR NF EN 63011-2 (04/2018)

    Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
    4/27/2018 - Paper - French - AFNOR
    Learn More
    €44.39

  • BS EN IEC 60749-12:2018

    Semiconductor devices. Mechanical and climatic test methods. Vibration, variable frequency
    4/18/2018 - PDF - English - BSI
    Learn More
    €121.90

  • NF C96-022-13, NF EN IEC 60749-13 (04/2018)

    Semiconductor devices - Mechanical and climatic test methods - Part 13 : salt atmosphere
    4/13/2018 - PDF - French - UTE
    Learn More
    €77.83

  • PR NF C96-014-1, PR NF EN 63150-1 (04/2018)

    Semiconductor devices - Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration environment - Part 1: Arbitrary and random mechanical vibrations
    4/13/2018 - Paper - French - AFNOR
    Learn More
    €71.80

  • NF C96-022-13, NF EN IEC 60749-13 (04/2018)

    Semiconductor devices - Mechanical and climatic test methods - Part 13 : salt atmosphere
    4/13/2018 - PDF - English - UTE
    Learn More
    €77.83

  • IEC 60191-2 AMD 20 (2018-04)

    IEC 60191-2:1966/AMD20:2018 Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    4/12/2018 - PDF - English - CEI
    Learn More
    €71.00

  • UNE-EN IEC 60749-12:2018

    Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (Endorsed by Asociación Española de Normalización in April of 2018.)
    4/1/2018 - PDF - English - AENOR
    Learn More
    €46.00

  • IEC 60191-4 AMD 1 (2018-03)

    IEC 60191-4:2013/AMD1:2018 Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
    3/27/2018 - PDF - English, French - CEI
    Learn More
    €71.00

  • IEC 60191-4 Edition 3.1 (2018-03)

    IEC 60191-4:2013+AMD1:2018 consolidated version Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
    3/27/2018 - PDF - English, French - CEI
    Learn More
    €279.00

  • NF C96-022-26, NF EN IEC 60749-26 (03/2018)

    Semiconductor devices - Mechanical and climatic test methods - Part 26 : electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
    3/23/2018 - PDF - French - UTE
    Learn More
    €135.47

  • NF C96-022-26, NF EN IEC 60749-26 (03/2018)

    Semiconductor devices - Mechanical and climatic test methods - Part 26 : electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
    3/23/2018 - PDF - English - UTE
    Learn More
    €135.47

  • BS IEC 62047-29:2017

    Semiconductor devices. Micro-electromechanical devices. Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
    3/15/2018 - PDF - English - BSI
    Learn More
    €121.90

  • NF C96-022-12, NF EN IEC 60749-12 (03/2018)

    Semiconductor devices - Mechanical and climatic test methods - Part 12 : vibration, variable frequency
    3/9/2018 - PDF - French - UTE
    Learn More
    €48.40

  • ASTM F1190-18

    Standard Guide for Neutron Irradiation of Unbiased Electronic Components
    3/1/2018 - PDF - English - ASTM
    Learn More
    €43.00

  • ASTM F1190-18 + Redline

    Standard Guide for Neutron Irradiation of Unbiased Electronic Components
    3/1/2018 - PDF - English - ASTM
    Learn More
    €52.00

  • ASTM F1893-18

    Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices
    3/1/2018 - PDF - English - ASTM
    Learn More
    €43.00

  • ASTM F1893-18 + Redline

    Guide for Measurement of Ionizing Dose-Rate Survivability and Burnout of Semiconductor Devices
    3/1/2018 - PDF - English - ASTM
    Learn More
    €52.00

  • IEC 60749-13 (2018-02)

    IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
    2/15/2018 - PDF - English, French - CEI
    Learn More
    €71.00

  • DIN EN 60749-28 VDE 0884-749-28:2018-02

    Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (IEC 60749-28:2017); German version EN 60749-28:2017
    2/1/2018 - Paper - German - VDE
    Learn More
    €110.67

  • PD IEC/TR 63133:2017

    Semiconductor devices. Scan based ageing level estimation for semiconductor devices
    1/29/2018 - PDF - English - BSI
    Learn More
    €144.90

  • IEC 60191-1 (2018-01)

    IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
    1/23/2018 - PDF - English - CEI
    Learn More
    €203.00

  • IEC 60749-26 (2018-01)

    IEC 60749-26:2018 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
    1/15/2018 - PDF - English, French - CEI
    Learn More
    €274.00

  • DIN EN 60749-3:2018-01

    Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017); German version EN 60749-3:2017
    1/1/2018 - PDF - German - DIN
    Learn More
    €82.60

  • DIN EN 60749-5:2018-01

    Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2017); German version EN 60749-5:2017
    1/1/2018 - PDF - German - DIN
    Learn More
    €75.40

  • EIA JESD 50C:2018

    Special Requirements for Maverick Product Elimination and Outlier Management
    1/1/2018 - PDF sécurisé - English - EIA
    Learn More
    €52.80

  • ANSI/ESD SP 27.1:2018

    ESD Association Standard Practice for the Recommended Information Flow Regarding Potential EOS Issues between Automotive OEM, Tier 1, and Semiconductor Manufacturers
    1/1/2018 - PDF - English - ESD
    Learn More
    €133.65

  • IEC 60749-12 (2017-12)

    IEC 60749-12:2017 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
    12/13/2017 - PDF - English, French - CEI
    Learn More
    €20.00

  • BS EN 60749-4:2017

    Semiconductor devices. Mechanical and climatic test methods. Damp heat, steady state, highly accelerated stress test (HAST)
    11/28/2017 - PDF - English - BSI
    Learn More
    €121.90

  • BS EN 60749-9:2017

    Semiconductor devices. Mechanical and climatic test methods. Permanence of marking
    11/27/2017 - PDF - English - BSI
    Learn More
    €121.90

  • BS EN 60749-6:2017

    Semiconductor devices. Mechanical and climatic test methods. Storage at high temperature
    11/24/2017 - PDF - English - BSI
    Learn More
    €121.90

  • BS EN 60749-3:2017

    Semiconductor devices. Mechanical and climatic test methods. External visual examination
    11/24/2017 - PDF - English - BSI
    Learn More
    €144.90

  • DIN EN 60749-6:2017-11

    Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2017); German version EN 60749-6:2017
    11/1/2017 - PDF - German - DIN
    Learn More
    €61.70

  • DIN EN 60749-4:2017-11

    Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017); German version EN 60749-4:2017
    11/1/2017 - PDF - German - DIN
    Learn More
    €75.40

  • DIN EN 60749-9:2017-11

    Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2017); German version EN 60749-9:2017
    11/1/2017 - PDF - German - DIN
    Learn More
    €61.70

  • JIS C 5630-26:2017

    Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
    10/20/2017 - PDF - Japanese - JSA
    Learn More
    €36.27

  • IEC/TR 63133 (2017-10)

    IEC TR 63133:2017 Semiconductor devices - Scan based ageing level estimation for semiconductor devices
    10/11/2017 - PDF - English - CEI
    Learn More
    €102.00

  • UNE-EN 60749-43:2017

    Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans (Endorsed by Asociación Española de Normalización in October of 2017.)
    10/1/2017 - PDF - English - AENOR
    Learn More
    €84.00

  • BS EN 60749-43:2017

    Semiconductor devices - Mechanical and climatic test methods. Guidelines for IC reliability qualification plans
    9/22/2017 - PDF - English - BSI
    Learn More
    €236.90

  • NF C96-022-43, NF EN 60749-43 (09/2017)

    Semiconductor devices - Mechanical and climatic test methods - Part 43 : guidelines for IC reliability qualification plans
    9/1/2017 - PDF - French - UTE
    Learn More
    €112.42

  • NF C96-022-43, NF EN 60749-43 (09/2017)

    Semiconductor devices - Mechanical and climatic test methods - Part 43 : guidelines for IC reliability qualification plans
    9/1/2017 - PDF - English - UTE
    Learn More
    €112.42

  • IEC 60050-521 AMD 1 (2017-08)

    IEC 60050-521:2002/AMD1:2017 Amendment 1 - International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
    8/30/2017 - PDF - English, French - CEI
    Learn More
    €10.00

  • IEC 62880-1 (2017-08)

    IEC 62880-1:2017 Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard
    8/23/2017 - PDF - English - CEI
    Learn More
    €142.00

  • EIA JESD 30H:2017

    Descriptive Designation System for Electronic-device Packages
    8/1/2017 - PDF sécurisé - English - EIA
    Learn More
    €102.08

  • UNE-EN 60749-5:2017

    Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (Endorsed by Asociación Española de Normalización in August of 2017.)
    8/1/2017 - PDF - English - AENOR
    Learn More
    €46.00

  • UNE-EN 60749-28:2017

    Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (Endorsed by Asociación Española de Normalización in August of 2017.)
    8/1/2017 - PDF - English - AENOR
    Learn More
    €87.00

  • BS EN 60749-5:2017

    Semiconductor devices. Mechanical and climatic test methods. Steady-state temperature humidity bias life test
    7/20/2017 - PDF - English - BSI
    Learn More
    €144.90

  • NF C96-435-2, NF EN 62435-2 (07/2017)

    Electronic components - Long-term storage of electronic semiconductor devices - Part 2 : deterioration mechanisms
    7/14/2017 - PDF - French - UTE
    Learn More
    €91.08

  • NF C96-435-1, NF EN 62435-1 (07/2017)

    Electronic components - Long-term storage of electronic semiconductor devices - Part 1: general
    7/14/2017 - PDF - French - UTE
    Learn More
    €102.58

  • NF C96-435-2, NF EN 62435-2 (07/2017)

    Electronic components - Long-term storage of electronic semiconductor devices - Part 2 : deterioration mechanisms
    7/14/2017 - PDF - English - UTE
    Learn More
    €91.08

  • NF C96-435-1, NF EN 62435-1 (07/2017)

    Electronic components - Long-term storage of electronic semiconductor devices - Part 1: general
    7/14/2017 - PDF - English - UTE
    Learn More
    €102.58

  • BS EN 60749-28:2017

    Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). Device level
    7/10/2017 - PDF - English - BSI
    Learn More
    €257.60

  • UNE-EN 60749-3:2017

    Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (Endorsed by Asociación Española de Normalización in July of 2017.)
    7/1/2017 - PDF - English - AENOR
    Learn More
    €61.00

  • UNE-EN 60749-4:2017

    Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (Endorsed by Asociación Española de Normalización in July of 2017.)
    7/1/2017 - PDF - English - AENOR
    Learn More
    €46.00

  • UNE-EN 60749-6:2017

    Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (Endorsed by Asociación Española de Normalización in July of 2017.)
    7/1/2017 - PDF - English - AENOR
    Learn More
    €40.00

  • UNE-EN 60749-9:2017

    Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (Endorsed by Asociación Española de Normalización in July of 2017.)
    7/1/2017 - PDF - English - AENOR
    Learn More
    €46.00

  • IEC 60749-43 (2017-06)

    IEC 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
    6/15/2017 - PDF - English, French - CEI
    Learn More
    €203.00

  • IPC 7091:2017

    Design and Assembly Process Implementation of 3D Components
    6/1/2017 - Paper - English - IPC
    Learn More
    €176.00

  • NF C96-435-5, NF EN 62435-5 (05/2017)

    Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - die and wafer devices
    5/19/2017 - PDF - French - UTE
    Learn More
    €91.08

  • NF C96-435-5, NF EN 62435-5 (05/2017)

    Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - die and wafer devices
    5/19/2017 - PDF - English - UTE
    Learn More
    €91.08

  • NF C53-975/A1, NF EN 61975/A1 (04/2017)

    High-voltage direct current (HVDC) installations - System tests
    4/15/2017 - PDF - French - UTE
    Learn More
    €91.08

  • NF C53-975/A1, NF EN 61975/A1 (04/2017)

    High-voltage direct current (HVDC) installations - System tests
    4/15/2017 - PDF - English - UTE
    Learn More
    €91.08

  • IEC 60749-5 (2017-04)

    IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
    4/10/2017 - PDF - English - CEI
    Learn More
    €41.00

  • DIN EN 60749-44:2017-04

    Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016
    4/1/2017 - PDF - German - DIN
    Learn More
    €103.00

  • DIN EN 60749-41:2017-04

    Semiconductor devices - Mechanical and climatic test methods - Part 41: Reliability testing methods of non-volatile memory devices (IEC 47/2325/CD:2016)
    4/1/2017 - PDF - English, German - DIN
    Learn More
    €103.00

  • IEC 60749-28 (2017-03)

    IEC 60749-28:2017 Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
    3/28/2017 - PDF - English - CEI
    Learn More
    €244.00

  • IEC 60749-3 (2017-03)

    IEC 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
    3/3/2017 - PDF - English - CEI
    Learn More
    €41.00

  • IEC 60749-4 (2017-03)

    IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
    3/3/2017 - PDF - English - CEI
    Learn More
    €41.00

  • IEC 60749-6 (2017-03)

    IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
    3/3/2017 - PDF - English - CEI
    Learn More
    €20.00

  • IEC 60749-9 (2017-03)

    IEC 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
    3/3/2017 - PDF - English - CEI
    Learn More
    €41.00

  • DIN EN 62779-3 VDE 0884-79-3:2017-03

    Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (IEC 62779-3:2016); German version EN 62779-3:2016
    3/1/2017 - Paper - German - VDE
    Learn More
    €49.48

  • UNE-EN 61975:2010/A1:2017

    High-voltage direct current (HVDC) installations - System tests (Endorsed by Asociación Española de Normalización in March of 2017.)
    3/1/2017 - PDF - English - AENOR
    Learn More
    €71.00

  • NF C96-013-6-13, NF EN 60191-6-13 (01/2017)

    Mechanical standardization of semiconductor devices - Part 6-13 : design guideline of open-top-type sockets for fine-pitch ball grid array (FBGA) and fine-pitch land grid array (FLGA)
    1/14/2017 - PDF - French - UTE
    Learn More
    €77.83

  • NF C96-013-6-13, NF EN 60191-6-13 (01/2017)

    Mechanical standardization of semiconductor devices - Part 6-13 : design guideline of open-top-type sockets for fine-pitch ball grid array (FBGA) and fine-pitch land grid array (FLGA)
    1/14/2017 - PDF - English - UTE
    Learn More
    €77.83

  • DIN EN 62779-1 VDE 0884-79-1:2017-01

    Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (IEC 62779-1:2016); German version EN 62779-1:2016
    1/1/2017 - Paper - German - VDE
    Learn More
    €61.54

  • DIN EN 62779-2 VDE 0884-79-2:2017-01

    Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (IEC 62779-2:2016); German version EN 62779-2:2016
    1/1/2017 - Paper - German - VDE
    Learn More
    €57.53

  • UNE-EN 60191-6-13:2016

    Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (Endorsed by Asociación Española de Normalización in January of 2017.)
    1/1/2017 - PDF - English - AENOR
    Learn More
    €71.00

  • IEEE 1804:2017

    IEEE Standard for Fault Accounting and Coverage Reporting (FACR) for Digital Modules
    1/1/2017 - PDF - English - IEEE
    Learn More
    €51.48

  • BS EN 60191-6-13:2016

    Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
    12/31/2016 - PDF - English - BSI
    Learn More
    €202.40

  • NF C96-022-44, NF EN 60749-44 (12/2016)

    Semiconductor devices - Mechanical and climatic test methods - Part 44 : neutron beam irradiated single event effect (SEE) test method for semiconductor devices
    12/23/2016 - PDF - French - UTE
    Learn More
    €102.58

  • NF C96-022-44, NF EN 60749-44 (12/2016)

    Semiconductor devices - Mechanical and climatic test methods - Part 44 : neutron beam irradiated single event effect (SEE) test method for semiconductor devices
    12/23/2016 - PDF - English - UTE
    Learn More
    €102.58

  • DIN EN 62047-26:2016-12

    Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016); German version EN 62047-26:2016
    12/1/2016 - PDF - German - DIN
    Learn More
    €114.10

  • DIN EN 62047-1:2016-12

    Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016); German version EN 62047-1:2016
    12/1/2016 - PDF - German - DIN
    Learn More
    €125.30

  • UNE-EN 60749-44:2016

    Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
    12/1/2016 - PDF - English - AENOR
    Learn More
    €73.00

  • BS EN 60749-44:2016

    Semiconductor devices. Mechanical and climatic test methods. Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
    11/30/2016 - PDF - English - BSI
    Learn More
    €202.40

  • ANSI/ESD STM 5.5.1:2016

    ESD Association Standard Test Method for Electrostatic Discharge (ESD) Sensitivity Testing - Transmission Line Pulse (TLP) - Device Level
    11/2/2016 - PDF - English - ESD
    Learn More
    €200.97

  • EIA JESD 22-A106B.01:2016

    Thermal Shock
    11/1/2016 - PDF sécurisé - English - EIA
    Learn More
    €44.88

  • EIA JESD 31E:2016

    General Requirements for Authorized Distributors of Commercial and Military Semiconductor Devices
    11/1/2016 - PDF sécurisé - English - EIA
    Learn More
    €65.12

  • IEC 60191-6-13 (2016-09)

    IEC 60191-6-13:2016 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
    9/27/2016 - PDF - English, French - CEI
    Learn More
    €102.00

  • IEC 61975 Edition 1.1 (2016-09)

    IEC 61975:2010+AMD1:2016 consolidated version High-voltage direct current (HVDC) installations - System tests

    9/12/2016 - PDF - English, French - CEI
    Learn More
    €508.00

  • IEC 61975 AMD 1 (2016-09)

    IEC 61975:2010/AMD1:2016 Amendment 1 - High-voltage direct current (HVDC) installations - System tests
    9/12/2016 - PDF - English, French - CEI
    Learn More
    €102.00

  • NF C96-779-3, NF EN 62779-3 (09/2016)

    Semiconductor devices - Semiconductor interface for human body communication - Part 3 : functional type and its operational conditions
    9/3/2016 - PDF - French - UTE
    Learn More
    €77.83

  • EIA JEP 122H:2016

    Failure Mechanisms and Models for Semiconductor Devices
    9/1/2016 - PDF sécurisé - English - EIA
    Learn More
    €143.44

  • EIA JESD 22-B103B.01:2016

    Vibration, Variable Frequency
    9/1/2016 - PDF sécurisé - English - EIA
    Learn More
    €49.28

  • NF C96-779-2, NF EN 62779-2 (08/2016)

    Semiconductor devices - Semiconductor interface for human body communication - Part 2 : characterization of interfacing performances
    8/27/2016 - PDF - French - UTE
    Learn More
    €77.83

  • NF C96-779-1, NF EN 62779-1 (08/2016)

    Semiconductor devices - Semiconductor interface for human body communication - Part 1 : general requirements
    8/13/2016 - PDF - French - UTE
    Learn More
    €91.08

  • IEC 60749-44 (2016-07)

    IEC 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
    7/21/2016 - PDF - English, French - CEI
    Learn More
    €142.00

  • UNE-EN 62779-1:2016

    Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (Endorsed by AENOR in July of 2016.)
    7/1/2016 - PDF - English - AENOR
    Learn More
    €68.00

  • UNE-EN 62779-2:2016

    Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (Endorsed by AENOR in July of 2016.)
    7/1/2016 - PDF - English - AENOR
    Learn More
    €68.00

  • UNE-EN 62779-3:2016

    Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (Endorsed by AENOR in July of 2016.)
    7/1/2016 - PDF - English - AENOR
    Learn More
    €64.00

  • BS EN 62779-1:2016

    Semiconductor devices. Semiconductor interface for human body communication. General requirements
    6/30/2016 - PDF - English - BSI
    Learn More
    €144.90

  • BS EN 62779-2:2016

    Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
    6/30/2016 - PDF - English - BSI
    Learn More
    €144.90

  • BS EN 62779-3:2016

    Semiconductor devices. Semiconductor interface for human body communication. Functional type and its operational conditions
    6/30/2016 - PDF - English - BSI
    Learn More
    €144.90

  • EIA JESD 22-A122A:2016

    Power Cycling
    6/1/2016 - PDF sécurisé - English - EIA
    Learn More
    €52.80

  • IEC 62779-3 (2016-04)

    IEC 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
    4/26/2016 - PDF - English, French - CEI
    Learn More
    €71.00

  • IEC 62779-1 (2016-02)

    IEC 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
    2/18/2016 - PDF - English, French - CEI
    Learn More
    €102.00

  • IEC 62779-2 (2016-02)

    IEC 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
    2/18/2016 - PDF - English, French - CEI
    Learn More
    €102.00

  • DIN EN 60747-17 VDE 0884-17:2016-01

    Semiconductor devices - Magnetic and capacitive coupler for basic and reinforced insulation (IEC 47E/511/CD:2015)
    1/1/2016 - Paper - German - VDE
    Learn More
    €45.89

  • DIN EN 62047-16:2015-12

    Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015
    12/1/2015 - PDF - German - DIN
    Learn More
    €82.60

  • DIN EN 62047-17:2015-12

    Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015); German version EN 62047-17:2015
    12/1/2015 - PDF - German - DIN
    Learn More
    €108.80

  • JIS C 5630-20:2015

    Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
    11/20/2015 - PDF - Japanese - JSA
    Learn More
    €46.02

  • NF C93-801-1, NF EN 62007-1 (10/2015)

    Semiconductor optoelectronic devices for fibre optic system applications - Part 1 : specification template for essential ratings and characteristics
    10/2/2015 - PDF - French - UTE
    Learn More
    €112.42

  • EIA JEP 151:2015

    Test Procedure for the Measurement of Terrestrial Cosmic Ray Induced Destructive Effects in Power Semiconductor Devices
    9/1/2015 - PDF sécurisé - English - EIA
    Learn More
    €54.56

  • BS EN 62007-1:2015

    Semiconductor optoelectronic devices for fibre optic system applications. Specification template for essential ratings and characteristics
    7/31/2015 - PDF - English - BSI
    Learn More
    €236.90

  • EIA JEP 172A:2015

    Discontinuing Use of the Machine Model for Device ESD Qualification
    7/1/2015 - PDF sécurisé - English - EIA
    Learn More
    €54.56

  • EIA JEP 159A:2015

    Procedure for the Evaluation of Low-k/Metal Inter/Intra-Level Dielectric Integrity
    7/1/2015 - PDF sécurisé - English - EIA
    Learn More
    €65.12

  • DIN EN 60749-42:2015-05

    Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage (IEC 60749-42:2014); German version EN 60749-42:2014
    5/1/2015 - PDF - German - DIN
    Learn More
    €61.70

  • UNE-EN 60747-5-5:2011/A1:2015

    Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers (Endorsed by AENOR in May of 2015.)
    5/1/2015 - PDF - English - AENOR
    Learn More
    €37.00

  • DIN EN 62047-20:2015-04

    Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 62047-20:2014); German version EN 62047-20:2014
    4/1/2015 - PDF - German - DIN
    Learn More
    €153.40

  • DIN EN 62047-21:2015-04

    Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 62047-21:2014); German version EN 62047-21:2014
    4/1/2015 - PDF - German - DIN
    Learn More
    €89.00

  • DIN EN 62047-22:2015-04

    Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
    4/1/2015 - PDF - German - DIN
    Learn More
    €75.40

  • IEC 62007-1 (2015-03)

    IEC 62007-1:2015 Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics
    3/30/2015 - PDF - English, French - CEI
    Learn More
    €203.00

  • NF C96-022-42, NF EN 60749-42 (03/2015)

    Semiconductor devices - Mechanical and climatic test methods - Part 42 : temperature humidity storage
    3/11/2015 - PDF - French - UTE
    Learn More
    €63.42

  • JIS C 5630-18:2014

    Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
    12/22/2014 - PDF - Japanese - JSA
    Learn More
    €25.00

  • UNE-EN 60749-42:2014

    Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage (Endorsed by AENOR in November of 2014.)
    11/1/2014 - PDF - English - AENOR
    Learn More
    €46.00

  • BS EN 60749-42:2014

    Semiconductor devices. Mechanical and climatic test methods. Temperature and humidity storage
    10/31/2014 - PDF - English - BSI
    Learn More
    €121.90

  • NF C96-022-26, NF EN 60749-26 (09/2014)

    Semiconductor devices - Mechanical and climatic test methods - Part 26 : electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
    9/20/2014 - PDF - French - UTE
    Learn More
    €135.47

  • NF C96-013-4, NF EN 60191-4 (08/2014)

    Mechanical standardization of semiconductor devices - Part 4 : coding system and classification into forms of package outlines for semiconductor device packages
    8/23/2014 - PDF - French - UTE
    Learn More
    €91.08

  • IEC 60749-42 (2014-08)

    IEC 60749-42:2014 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
    8/12/2014 - PDF - English, French - CEI
    Learn More
    €20.00

  • UNE-EN 60749-26:2014

    Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (Endorsed by AENOR in July of 2014.)
    7/1/2014 - PDF - English - AENOR
    Learn More
    €86.00

  • ASTM E722-14 + Redline

    Standard Practice for Characterizing Neutron Fluence Spectra in Terms of an Equivalent Monoenergetic Neutron Fluence for Radiation-Hardness Testing of Electronics
    6/1/2014 - PDF - English - ASTM
    Learn More
    €75.00

  • ASTM E722-14

    Standard Practice for Characterizing Neutron Fluence Spectra in Terms of an Equivalent Monoenergetic Neutron Fluence for Radiation-Hardness Testing of Electronics
    6/1/2014 - PDF - English - ASTM
    Learn More
    €62.00

  • DIN EN 62047-11:2014-04

    Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013
    4/1/2014 - PDF - German - DIN
    Learn More
    €103.00

  • DIN EN 62047-18:2014-04

    Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
    4/1/2014 - PDF - German - DIN
    Learn More
    €89.00

  • BS EN 60191-4:2014+A1:2018

    Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages
    3/31/2014 - PDF - English - BSI
    Learn More
    €236.90

  • JIS C 5630-12:2014

    Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
    2/20/2014 - PDF - Japanese - JSA
    Learn More
    €36.27

  • JIS C 5630-13:2014

    Semiconductor devices - Micro-electromechanical devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
    2/20/2014 - PDF - Japanese - JSA
    Learn More
    €25.00

  • EIA JEP 148B:2014

    Reliability Qualification of Semiconductor Devices Based on Physics of Failure Risk and Opportunity Assessment
    1/1/2014 - PDF sécurisé - English - EIA
    Learn More
    €68.64

  • BS IEC 62483:2013

    Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
    10/31/2013 - PDF - English - BSI
    Learn More
    €282.90

  • IEC 60191-4 (2013-10)

    IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
    10/10/2013 - PDF - English, French - CEI
    Learn More
    €142.00

  • EIA JESD 22-C101F:2013

    Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components
    10/1/2013 - PDF sécurisé - English - EIA
    Learn More
    €51.92

  • IEC 62483 (2013-09)

    IEC 62483:2013 Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
    9/25/2013 - PDF - English, French - CEI
    Learn More
    €244.00

  • NF C96-013-6-22, NF EN 60191-6-22 (09/2013)

    Mechanical standardization of semiconductor devices - Part 6-22 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (SFBGA and S-FLGA)
    9/14/2013 - PDF - French - UTE
    Learn More
    €77.83

  • NF C96-015, NF EN 60747-15 (06/2013)

    Semiconductor devices - Discrete devices - Part 15 : isolated power semiconductor devices
    6/8/2013 - PDF - French - UTE
    Learn More
    €102.58

  • PR NF C96-022-28, PR NF EN 60749-28 (05/2013)

    Semiconductor devices - Mechanical and climatic test methods - Part 28 : Electrostatic Discharge (ESD) Sensitivity Testing - Direct contact charged device model (DC-CDM)
    5/31/2013 - PDF - French - UTE
    Learn More
    €54.25

  • IEC 60747-5-5 AMD 1 (2013-05)

    IEC 60747-5-5:2007/AMD1:2013 Amendment 1 - Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers
    5/13/2013 - PDF - English, French - CEI
    Learn More
    €10.00

  • IEC 60747-5-5 Edition 1.1 (2013-05)

    IEC 60747-5-5:2007+AMD1:2013 consolidated version Semiconductor devices - Discrete devices - Part 5-5: Optoelectronicdevices - Photocouplers
    5/13/2013 - PDF - English, French - CEI
    Learn More
    €355.00

  • BS EN 60191-6-22:2013

    Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
    4/30/2013 - PDF - English - BSI
    Learn More
    €144.90

  • DIN EN 60749-27:2013-04

    Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006 + A1:2012); German version EN 60749-27:2006 + A1:2012
    4/1/2013 - PDF - German - DIN
    Learn More
    €89.00

  • EIA JEP 167:2013

    Characterization of Interfacial Adhesion in Semiconductor Packages
    4/1/2013 - PDF sécurisé - English - EIA
    Learn More
    €63.36

  • UNE-EN 60191-6-22:2013

    Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (Endorsed by AENOR in April of 2013.)
    4/1/2013 - PDF - English - AENOR
    Learn More
    €68.00

  • NF C96-022-27/A1, NF EN 60749-27/A1 (03/2013)

    Semiconductor devices - Mechanical and climatic test methods - Part 27 : electrostatic discharge (ESD) sensivity testing - Machine model (MM)
    3/20/2013 - PDF - French - UTE
    Learn More
    €48.40

  • NF C96-013-1, NF EN 60191-1 (02/2013)

    Mechanical standardization of semiconductor devices - Part 1 : general rules for the preparation of outline drawings of discrete devices
    2/28/2013 - PDF - French - UTE
    Learn More
    €112.42

  • NF C96-013-6-16, NF EN 60191-6-16 (01/2013)

    Mechanical standardization of semiconductor devices - Part 6-16 : glossary of semiconductor test and burn-in sockets for BGA, LGA, FBGA and FLGA
    1/5/2013 - PDF - French - UTE
    Learn More
    €77.83

  • UNE-EN 60749-27:2006/A1:2012

    Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (Endorsed by AENOR in January of 2013.)
    1/1/2013 - PDF - English - AENOR
    Learn More
    €15.00

  • IEC 60191-6-22 (2012-12)

    IEC 60191-6-22:2012 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
    12/11/2012 - PDF - English, French - CEI
    Learn More
    €102.00

  • IEC 60191-2 AMD 19 (2012-10)

    IEC 60191-2:1966/AMD19:2012 Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
    10/2/2012 - PDF - English, French - CEI
    Learn More
    €142.00

  • DIN EN 62047-14:2012-10

    Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012
    10/1/2012 - PDF - German - DIN
    Learn More
    €96.00

  • DIN EN 62047-13:2012-10

    Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012
    10/1/2012 - PDF - German - DIN
    Learn More
    €96.00

  • NF C96-013-6-17, NF EN 60191-6-17 (10/2012)

    Mechanical standardization of semiconductor devices - Part 6-17 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
    10/1/2012 - PDF - French - UTE
    Learn More
    €91.08

  • IEC 60749-27 Edition 2.1 (2012-09)

    IEC 60749-27:2006+AMD1:2012 consolidated version Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
    9/25/2012 - PDF - English, French - CEI
    Learn More
    €107.00

  • IEC 60749-27 AMD 1 (2012-09)

    IEC 60749-27:2006/AMD1:2012 Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
    9/25/2012 - PDF - English, French - CEI
    Learn More
    €10.00

  • IEC 60191-2 (2012-09)

    IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
    9/21/2012 - PDF - English, French - CEI
    Learn More
    €305.00

  • PR NF C96-483, PR NF EN 62483 (08/2012)

    Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes
    8/24/2012 - PDF - French - UTE
    Learn More
    €87.16

  • DIN EN 60747-15:2012-08

    Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (IEC 60747-15:2010); German version EN 60747-15:2012
    8/1/2012 - PDF - German - DIN
    Learn More
    €108.80

  • EIA JESD 77D:2012

    Terms, Definitions, and Letter Symbols for Discrete Semiconductor and Optoelectronic Devices
    8/1/2012 - PDF sécurisé - English - EIA
    Learn More
    €200.64

  • NF C96-022-29, NF EN 60749-29 (08/2012)

    Semiconductor devices - Mechanical and climatic test methods - Part 29 : latch-up test
    8/1/2012 - PDF - French - UTE
    Learn More
    €102.58

  • ASTM F1892-12 + Redline

    Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices
    7/1/2012 - PDF - English - ASTM
    Learn More
    €75.00

  • UNE-EN 60749-20:2009

    Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (Endorsed by AENOR in July of 2012.)
    7/1/2012 - PDF - English - AENOR
    Learn More
    €77.00

  • ASTM F1892-12(2018)

    Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices
    7/1/2012 - PDF - English - ASTM
    Learn More
    €68.00

  • DIN EN 62047-12:2012-06

    Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011
    6/1/2012 - PDF - German - DIN
    Learn More
    €114.10

  • NF C96-022-21, NF EN 60749-21 (06/2012)

    Semiconductor devices - Mechanical and climatic test methods - Part 21 : solderability
    6/1/2012 - PDF - French - UTE
    Learn More
    €91.08

  • JIS B 9960-33:2012 (R2017)

    Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment
    5/21/2012 - PDF - Japanese - JSA
    Learn More
    €72.41

  • NF C96-022-23/A1, NF EN 60749-23/A1 (05/2012)

    Semiconductor devices - Mechanical and climatic test methods - Part 23 : high temperature operating life
    5/1/2012 - PDF - French - UTE
    Learn More
    €48.40

  • NF C96-050-9, NF EN 62047-9 (04/2012)

    Semiconductor devices - Micro-electromechanical devices - Part 9 : wafer to wafer bonding strength measurement for MEMS
    4/1/2012 - PDF - French - UTE
    Learn More
    €91.08

  • DIN EN 62047-5:2012-03

    Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (IEC 62047-5:2011); German version EN 62047-5:2011
    3/1/2012 - PDF - German - DIN
    Learn More
    €125.30

  • DIN EN 62047-9:2012-03

    Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
    3/1/2012 - PDF - German - DIN
    Learn More
    €108.80

  • DIN EN 62047-10:2012-03

    Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
    3/1/2012 - PDF - German - DIN
    Learn More
    €82.60

  • DIN EN 62047-7:2012-02

    Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011); German version EN 62047-7:2011
    2/1/2012 - PDF - German - DIN
    Learn More
    €114.10

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