31.080 : Semiconductor devices

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  • PR NF C71-250, PR NF EN 62031 (04/2018)

    IEC 62031 Ed. 2: LED modules for general lighting - Safety specifications
    4/2/2018 - Paper - French - AFNOR
    Learn More
    €63.76

  • PR NF C96-069-2, PR NF EN 62969-2 (04/2018)

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
    4/2/2018 - Paper - French - AFNOR
    Learn More
    €44.39

  • DIN EN 60747-16-4:2018-04

    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (IEC 60747-16-4:2004 + A1:2009 + A2:2017); German version EN 60747-16-4:2004 + A1:2011 + A2:2017
    4/1/2018 - PDF - German - DIN
    Learn More
    €114.10

  • DIN EN 60747-16-3:2018-04

    Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002 + A1:2009 + A2:2017); German version EN 60747-16-3:2002 + A1:2009 + A2:2017
    4/1/2018 - PDF - German - DIN
    Learn More
    €141.90

  • PR NF C96-069-3, PR NF EN 62969-3 (03/2018)

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
    3/28/2018 - Paper - French - AFNOR
    Learn More
    €63.76

  • IEC 60191-4 AMD 1 (2018-03)

    IEC 60191-4:2013/AMD1:2018 Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
    3/27/2018 - PDF - English, French - CEI
    Learn More
    €77.00

  • IEC 60191-4 Edition 3.1 (2018-03)

    IEC 60191-4:2013+AMD1:2018 consolidated version Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
    3/27/2018 - PDF - English, French - CEI
    Learn More
    €303.00

  • BS IEC 62047-29:2017

    Semiconductor devices. Micro-electromechanical devices. Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
    3/15/2018 - Paper - English - BSI
    Learn More
    €116.28

  • BS EN 61954:2011+A2:2017

    Static var compensators (SVC). Testing of thyristor valves
    3/14/2018 - Paper - English - BSI
    Learn More
    €271.32

  • IEC 62031 (2018-03)

    IEC 62031:2018 LED modules for general lighting - Safety specifications
    3/8/2018 - PDF - English, French - CEI
    Learn More
    €154.00

  • IEC 62031 Redline version (2018-03)

    IEC 62031:2018 RLV LED modules for general lighting - Safety specifications
    3/8/2018 - PDF - English - CEI
    Learn More
    €200.00

  • IEC 62969-2 (2018-03)

    IEC 62969-2:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
    3/8/2018 - PDF - English, French - CEI
    Learn More
    €44.00

  • BS EN IEC 62969-1:2018

    Semiconductor devices. Semiconductor interface for automotive vehicles. General requirements of power interface for automotive vehicle sensors
    2/22/2018 - Paper - English - BSI
    Learn More
    €139.08

  • IEC 60749-13 (2018-02)

    IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
    2/15/2018 - PDF - English, French - CEI
    Learn More
    €77.00

  • PR NF C96-022-26, PR NF EN 60749-26 (02/2018)

    Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
    2/6/2018 - Paper - French - AFNOR
    Learn More
    €94.83

  • BS IEC 60747-2:2016

    Semiconductor devices. Discrete devices. Rectifier diodes
    2/6/2018 - Paper - English - BSI
    Learn More
    €255.36

  • DIN EN 60749-28 VDE 0884-749-28:2018-02

    Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (IEC 60749-28:2017); German version EN 60749-28:2017
    2/1/2018 - Paper - German - VDE
    Learn More
    €110.67

  • PD IEC/TR 63133:2017

    Semiconductor devices. Scan based ageing level estimation for semiconductor devices
    1/29/2018 - Paper - English - BSI
    Learn More
    €139.08

  • IEC 60191-1 (2018-01)

    IEC 60191-1:2018 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
    1/23/2018 - PDF - English - CEI
    Learn More
    €220.00

  • IEC 60749-26 (2018-01)

    IEC 60749-26:2018 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
    1/15/2018 - PDF - English, French - CEI
    Learn More
    €297.00

  • PR NF C96-022-13, PR NF EN 60749-13 (01/2018)

    Semiconductor devices - Mechanical and climatic test methods - Part 13 : Salt atmosphere
    1/3/2018 - Paper - French - AFNOR
    Learn More
    €54.48

  • DIN EN 60749-3:2018-01

    Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (IEC 60749-3:2017); German version EN 60749-3:2017
    1/1/2018 - PDF - German - DIN
    Learn More
    €82.60

  • DIN EN 60749-5:2018-01

    Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2017); German version EN 60749-5:2017
    1/1/2018 - PDF - German - DIN
    Learn More
    €75.40

  • EIA JESD 50C:2018

    Special Requirements for Maverick Product Elimination and Outlier Management
    1/1/2018 - PDF sécurisé - English - EIA
    Learn More
    €51.00

  • DIN EN 61954 VDE 0533-100:2018-01

    Static VAR compensators (SVC) - Testing of thyristor valves (IEC 61954:2011 + A1:2013 + A2:2017); German version EN 61954:2011 + A1:2013 + A2:2017
    1/1/2018 - Paper - German - VDE
    Learn More
    €110.67

  • UNE-EN 60747-16-3:2002/A2:2017

    Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (Endorsed by Asociación Española de Normalización in January of 2018.)
    1/1/2018 - PDF - English - AENOR
    Learn More
    €40.00

  • JIS C 8158:2017

    Self-ballasted LED-lamps for general lighting services by voltage > 50 V
    12/20/2017 - PDF - Japanese - JSA
    Learn More
    €36.27

  • JIS C 8160:2017

    Non-integrated linear LED lamps with GX16t-5 cap for general lighting services
    12/20/2017 - PDF - Japanese - JSA
    Learn More
    €25.00

  • PR NF C96-013-4/A1, PR NF EN 60191-4/A1 (12/2017)

    Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
    12/15/2017 - Paper - French - AFNOR
    Learn More
    €54.48

  • IEC 60749-12 (2017-12)

    IEC 60749-12:2017 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
    12/13/2017 - PDF - English, French - CEI
    Learn More
    €22.00

  • IEC 62969-1 (2017-12)

    IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
    12/13/2017 - PDF - English, French - CEI
    Learn More
    €77.00

  • IEC 62969-1 (2017-12)

    IEC 62969-1:2017 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
    12/13/2017 - PDF - English - CEI
    Learn More
    €77.00

  • UNE-EN 60747-16-4:2004/A2:2017

    Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches (Endorsed by Asociación Española de Normalización in December of 2017.)
    12/1/2017 - PDF - English - AENOR
    Learn More
    €40.00

  • BS EN 60749-4:2017

    Semiconductor devices. Mechanical and climatic test methods. Damp heat, steady state, highly accelerated stress test (HAST)
    11/28/2017 - Paper - English - BSI
    Learn More
    €116.28

  • BS EN 60749-9:2017

    Semiconductor devices. Mechanical and climatic test methods. Permanence of marking
    11/27/2017 - Paper - English - BSI
    Learn More
    €116.28

  • BS EN 60749-6:2017

    Semiconductor devices. Mechanical and climatic test methods. Storage at high temperature
    11/24/2017 - Paper - English - BSI
    Learn More
    €116.28

  • BS EN 60749-3:2017

    Semiconductor devices. Mechanical and climatic test methods. External visual examination
    11/24/2017 - Paper - English - BSI
    Learn More
    €139.08

  • IEC 62047-29 (2017-11)

    IEC 62047-29:2017 Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
    11/22/2017 - PDF - English - CEI
    Learn More
    €77.00

  • DIN EN 60749-6:2017-11

    Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2017); German version EN 60749-6:2017
    11/1/2017 - PDF - German - DIN
    Learn More
    €61.70

  • DIN EN 60749-4:2017-11

    Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017); German version EN 60749-4:2017
    11/1/2017 - PDF - German - DIN
    Learn More
    €75.40

  • DIN EN 60749-9:2017-11

    Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2017); German version EN 60749-9:2017
    11/1/2017 - PDF - German - DIN
    Learn More
    €61.70

  • DIN EN 61975 VDE 0553-975:2017-11

    High-voltage direct current (HVDC) installations - System tests (IEC 61975:2010 + A1:2016); German version EN 61975:2010 + A1:2017
    11/1/2017 - Paper - German - VDE
    Learn More
    €160.33

  • JIS C 5630-26:2017

    Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
    10/20/2017 - PDF - Japanese - JSA
    Learn More
    €36.27

  • IEC/TR 63133 (2017-10)

    IEC TR 63133:2017 Semiconductor devices - Scan based ageing level estimation for semiconductor devices
    10/11/2017 - PDF - English - CEI
    Learn More
    €110.00

  • BS IEC 62047-30:2017

    Semiconductor devices. Micro-electromechanical devices. Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
    10/9/2017 - Paper - English - BSI
    Learn More
    €139.08

  • DIN EN 60747-16-1:2017-10

    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (IEC 60747-16-1:2001 - A1:2007 - A2:2017); German version EN 60747-16-1:2002 + A1:2007 + A2:2017
    10/1/2017 - PDF - German - DIN
    Learn More
    €163.80

  • DIN EN 62477-1 VDE 0558-477-1:2017-10

    Safety requirements for power electronic converter systems and equipment - Part 1: General (IEC 62477-1:2012 + A1:2016); German version EN 62477-1:2012 + A11:2014 + A1:2017
    10/1/2017 - Paper - German - VDE
    Learn More
    €268.93

  • BS EN 60749-43:2017

    Semiconductor devices - Mechanical and climatic test methods. Guidelines for IC reliability qualification plans
    9/22/2017 - Paper - English - BSI
    Learn More
    €225.72

  • IEC 62047-30 (2017-09)

    IEC 62047-30:2017 Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film
    9/15/2017 - PDF - English - CEI
    Learn More
    €110.00

  • NF C96-022-43, NF EN 60749-43 (09/2017)

    Semiconductor devices - Mechanical and climatic test methods - Part 43 : guidelines for IC reliability qualification plans
    9/1/2017 - PDF - French - AFNOR
    Learn More
    €106.80

  • NF C96-022-43, NF EN 60749-43 (09/2017)

    Semiconductor devices - Mechanical and climatic test methods - Part 43 : guidelines for IC reliability qualification plans
    9/1/2017 - PDF - English - AFNOR
    Learn More
    €106.80

  • IEC 60050-521 AMD 1 (2017-08)

    IEC 60050-521:2002/AMD1:2017 Amendment 1 - International Electrotechnical Vocabulary - Part 521: Semiconductor devices and integrated circuits
    8/30/2017 - PDF - English, French - CEI
    Learn More
    €11.00

  • IEC 62880-1 (2017-08)

    IEC 62880-1:2017 Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard
    8/23/2017 - PDF - English - CEI
    Learn More
    €154.00

  • NF C96-016-1/A2, NF EN 60747-16-1/A2 (08/2017)

    Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
    8/19/2017 - PDF - French - AFNOR
    Learn More
    €60.25

  • NF C96-016-1/A2, NF EN 60747-16-1/A2 (08/2017)

    Semiconductor devices - Part 16-1 : microwave integrated circuits - Amplifiers
    8/19/2017 - PDF - English - AFNOR
    Learn More
    €60.25

  • IEC 60747-16-3 Edition 1.2 (2017-08)

    IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 consolidated version Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    8/16/2017 - PDF - English - CEI
    Learn More
    €330.00

  • IEC 60747-16-3 AMD 2 (2017-08)

    IEC 60747-16-3:2002/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    8/16/2017 - PDF - English - CEI
    Learn More
    €11.00

  • IEC 60747-16-4 Edition 1.2 (2017-08)

    IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 consolidated version Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    8/16/2017 - PDF - English - CEI
    Learn More
    €275.00

  • IEC 60747-16-4 AMD 2 (2017-08)

    IEC 60747-16-4:2004/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    8/16/2017 - PDF - English - CEI
    Learn More
    €11.00

  • BS IEC 62830-2:2017

    Semiconductor devices. Semiconductor devices for energy harvesting and generation. Thermo power based thermoelectric energy harvesting
    8/10/2017 - Paper - English - BSI
    Learn More
    €139.08

  • DIN EN 60749-12:2017-08

    Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 47/2386/CDV:2017); German version prEN 60749-12:2017
    8/1/2017 - PDF - English, German - DIN
    Learn More
    €47.60

  • EIA JESD 30H:2017

    Descriptive Designation System for Electronic-device Packages
    8/1/2017 - PDF sécurisé - English - EIA
    Learn More
    €98.60

  • UNE-EN 60749-5:2017

    Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (Endorsed by Asociación Española de Normalización in August of 2017.)
    8/1/2017 - PDF - English - AENOR
    Learn More
    €46.00

  • UNE-EN 60749-28:2017

    Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (Endorsed by Asociación Española de Normalización in August of 2017.)
    8/1/2017 - PDF - English - AENOR
    Learn More
    €87.00

  • UNE-EN 61954:2011/A2:2017

    Static VAR compensators (SVC) - Testing of thyristor valves (Endorsed by Asociación Española de Normalización in August of 2017.)
    8/1/2017 - PDF - English - AENOR
    Learn More
    €27.00

  • DIN EN 60747-16-6:2017-08

    Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 47E/568/CD:2017)
    8/1/2017 - PDF - English, German - DIN
    Learn More
    €114.10

  • BS EN 60749-5:2017

    Semiconductor devices. Mechanical and climatic test methods. Steady-state temperature humidity bias life test
    7/20/2017 - Paper - English - BSI
    Learn More
    €139.08

  • NF C96-435-2, NF EN 62435-2 (07/2017)

    Electronic components - Long-term storage of electronic semiconductor devices - Part 2 : deterioration mechanisms
    7/14/2017 - PDF - French - AFNOR
    Learn More
    €86.53

  • NF C96-435-1, NF EN 62435-1 (07/2017)

    Electronic components - Long-term storage of electronic semiconductor devices - Part 1: general
    7/14/2017 - PDF - French - AFNOR
    Learn More
    €97.45

  • NF C96-435-2, NF EN 62435-2 (07/2017)

    Electronic components - Long-term storage of electronic semiconductor devices - Part 2 : deterioration mechanisms
    7/14/2017 - PDF - English - AFNOR
    Learn More
    €86.53

  • NF C96-435-1, NF EN 62435-1 (07/2017)

    Electronic components - Long-term storage of electronic semiconductor devices - Part 1: general
    7/14/2017 - PDF - English - AFNOR
    Learn More
    €97.45

  • BS EN 60749-28:2017

    Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Charged device model (CDM). Device level
    7/10/2017 - Paper - English - BSI
    Learn More
    €255.36

  • DIN EN 60749-13:2017-07

    Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (IEC 47/2377/CDV:2017); German version prEN 60749-13:2017
    7/1/2017 - PDF - English, German - DIN
    Learn More
    €82.60

  • DIN EN 60749-26 VDE 0884-749-26:2017-07

    Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 47/2343/CDV:2017); German version prEN 60749-26:2017
    7/1/2017 - Paper - German - VDE
    Learn More
    €49.48

  • UNE-EN 60747-16-1:2002/A2:2017

    Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers (Endorsed by Asociación Española de Normalización in July of 2017.)
    7/1/2017 - PDF - English - AENOR
    Learn More
    €37.00

  • IEC 60749-43 (2017-06)

    IEC 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
    6/15/2017 - PDF - English, French - CEI
    Learn More
    €220.00

  • IPC 7091:2017

    Design and Assembly Process Implementation of 3D Components
    6/1/2017 - Paper - English - IPC
    Learn More
    €169.60

  • DIN EN 60700-2 VDE 0553-2:2017-06

    Thyristor valves for high voltage direct current (HVDC) power transmission - Part 2: Terminology (IEC 60700-2:2016); German version EN 60700-2:2016
    6/1/2017 - Paper - German - VDE
    Learn More
    €69.60

  • NF C96-435-5, NF EN 62435-5 (05/2017)

    Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - die and wafer devices
    5/19/2017 - PDF - French - AFNOR
    Learn More
    €86.53

  • NF C96-435-5, NF EN 62435-5 (05/2017)

    Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - die and wafer devices
    5/19/2017 - PDF - English - AFNOR
    Learn More
    €86.53

  • BS IEC 62830-3:2017

    Semiconductor devices. Semiconductor devices for energy harvesting and generation. Vibration based electromagnetic energy harvesting
    4/30/2017 - Paper - English - BSI
    Learn More
    €193.80

  • NF C53-975/A1, NF EN 61975/A1 (04/2017)

    High-voltage direct current (HVDC) installations - System tests
    4/15/2017 - PDF - French - AFNOR
    Learn More
    €86.53

  • NF C53-975/A1, NF EN 61975/A1 (04/2017)

    High-voltage direct current (HVDC) installations - System tests
    4/15/2017 - PDF - English - AFNOR
    Learn More
    €86.53

  • IEC 61954 Edition 2.2 (2017-04)

    IEC 61954:2011+AMD1:2013+AMD2:2017 consolidated version Static var compensators (SVC) - Testing of thyristor valves
    4/12/2017 - PDF - English, French - CEI
    Learn More
    €385.00

  • IEC 61954 AMD 2 (2017-04)

    IEC 61954:2011/AMD2:2017 Amendment 2 - Static var compensators (SVC) - Testing of thyristor valves
    4/12/2017 - PDF - English, French - CEI
    Learn More
    €11.00

  • IEC 60749-5 (2017-04)

    IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
    4/10/2017 - PDF - English - CEI
    Learn More
    €44.00

  • IEC 62951-1 (2017-04)

    IEC 62951-1:2017 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
    4/10/2017 - PDF - English - CEI
    Learn More
    €77.00

  • DIN EN 60749-44:2017-04

    Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016
    4/1/2017 - PDF - German - DIN
    Learn More
    €103.00

  • DIN EN 60749-41:2017-04

    Semiconductor devices - Mechanical and climatic test methods - Part 41: Reliability testing methods of non-volatile memory devices (IEC 47/2325/CD:2016)
    4/1/2017 - PDF - English, German - DIN
    Learn More
    €103.00

  • DIN EN 62047-25:2017-04

    Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
    4/1/2017 - PDF - German - DIN
    Learn More
    €103.00

  • IEC 60749-28 (2017-03)

    IEC 60749-28:2017 Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
    3/28/2017 - PDF - English - CEI
    Learn More
    €264.00

  • IEC 62830-3 (2017-03)

    IEC 62830-3:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
    3/28/2017 - PDF - English, French - CEI
    Learn More
    €154.00

  • JIS C 5630-1:2017

    Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
    3/21/2017 - PDF - Japanese - JSA
    Learn More
    €41.86

  • IEC 60749-3 (2017-03)

    IEC 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
    3/3/2017 - PDF - English - CEI
    Learn More
    €44.00

  • IEC 60749-4 (2017-03)

    IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
    3/3/2017 - PDF - English - CEI
    Learn More
    €44.00

  • IEC 60749-6 (2017-03)

    IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
    3/3/2017 - PDF - English - CEI
    Learn More
    €22.00

  • IEC 60749-9 (2017-03)

    IEC 60749-9:2017 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
    3/3/2017 - PDF - English - CEI
    Learn More
    €44.00

  • IEC 62830-1 (2017-03)

    IEC 62830-1:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
    3/3/2017 - PDF - English, French - CEI
    Learn More
    €154.00

  • DIN EN 62779-3 VDE 0884-79-3:2017-03

    Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (IEC 62779-3:2016); German version EN 62779-3:2016
    3/1/2017 - Paper - German - VDE
    Learn More
    €49.48

  • EIA JESD 210A:2017

    Avalanche Breakdown Diode (ABD) Transient Voltage Suppressors
    3/1/2017 - PDF sécurisé - English - EIA
    Learn More
    €68.00

  • IEC 60747-16-1 Edition 1.2 (2017-02)

    IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 consolidated version Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    2/15/2017 - PDF - English, French - CEI
    Learn More
    €495.00

  • IEC 60747-16-1 AMD 2 (2017-02)

    IEC 60747-16-1:2001/AMD2:2017 Amendment 2 - Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers
    2/15/2017 - PDF - English, French - CEI
    Learn More
    €22.00

  • IEC 60747-4 AMD 1 (2017-01)

    IEC 60747-4:2007/AMD1:2017 Amendment 1 - Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
    1/30/2017 - PDF - English, French - CEI
    Learn More
    €22.00

  • IEC 60747-4 Edition 2.1 (2017-01)

    IEC 60747-4:2007+AMD1:2017 consolidated version Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
    1/30/2017 - PDF - English, French - CEI
    Learn More
    €495.00

  • IEC 62047-27 (2017-01)

    IEC 62047-27:2017 Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
    1/20/2017 - PDF - English - CEI
    Learn More
    €77.00

  • IEC 62047-28 (2017-01)

    IEC 62047-28:2017 Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices
    1/20/2017 - PDF - English - CEI
    Learn More
    €110.00

  • IEC 62830-2 (2017-01)

    IEC 62830-2:2017 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
    1/20/2017 - PDF - English, French - CEI
    Learn More
    €77.00

  • NF C96-013-6-13, NF EN 60191-6-13 (01/2017)

    Mechanical standardization of semiconductor devices - Part 6-13 : design guideline of open-top-type sockets for fine-pitch ball grid array (FBGA) and fine-pitch land grid array (FLGA)
    1/14/2017 - PDF - French - AFNOR
    Learn More
    €73.94

  • NF C96-013-6-13, NF EN 60191-6-13 (01/2017)

    Mechanical standardization of semiconductor devices - Part 6-13 : design guideline of open-top-type sockets for fine-pitch ball grid array (FBGA) and fine-pitch land grid array (FLGA)
    1/14/2017 - PDF - English - AFNOR
    Learn More
    €73.94

  • DIN EN 62779-1 VDE 0884-79-1:2017-01

    Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (IEC 62779-1:2016); German version EN 62779-1:2016
    1/1/2017 - Paper - German - VDE
    Learn More
    €61.54

  • DIN EN 62779-2 VDE 0884-79-2:2017-01

    Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (IEC 62779-2:2016); German version EN 62779-2:2016
    1/1/2017 - Paper - German - VDE
    Learn More
    €57.53

  • ANSI/ESD STM 5.5.1:2017

    ESD Association Standard Test Method for Electrostatic Discharge (ESD) Sensitivity Testing - Transmission Line Pulse (TLP) - Device Level
    1/1/2017 - PDF sécurisé - English - ESD
    Learn More
    €172.55

  • UNE-EN 60191-6-13:2016

    Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (Endorsed by Asociación Española de Normalización in January of 2017.)
    1/1/2017 - PDF - English - AENOR
    Learn More
    €71.00

  • IEEE 1804:2017

    IEEE Standard for Fault Accounting and Coverage Reporting (FACR) for Digital Modules
    1/1/2017 - PDF sécurisé - English - IEEE
    Learn More
    €44.20

  • UNE-EN 60700-2:2016

    Thyristor valves for high voltage direct current (HVDC) power transmission - Part 2: Terminology (Endorsed by Asociación Española de Normalización in January of 2017.)
    1/1/2017 - PDF - English - AENOR
    Learn More
    €74.00

  • DIN VDE V 0884-11 VDE V 0884-11:2017-01

    Semiconductor devices - Part 11: Magnetic and capacitive coupler for basic and reinforced isolation
    1/1/2017 - Paper - German - VDE
    Learn More
    €104.79

  • UNE-EN 62047-25:2016

    Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (Endorsed by Asociación Española de Normalización in January of 2017.)
    1/1/2017 - PDF - English - AENOR
    Learn More
    €74.00

  • BS EN 60191-6-13:2016

    Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
    12/31/2016 - Paper - English - BSI
    Learn More
    €193.80

  • NF C96-050-25, NF EN 62047-25 (12/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
    12/30/2016 - PDF - French - AFNOR
    Learn More
    €86.53

  • NF C96-050-25, NF EN 62047-25 (12/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 25 : silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
    12/30/2016 - PDF - English - AFNOR
    Learn More
    €86.53

  • NF C96-022-44, NF EN 60749-44 (12/2016)

    Semiconductor devices - Mechanical and climatic test methods - Part 44 : neutron beam irradiated single event effect (SEE) test method for semiconductor devices
    12/23/2016 - PDF - French - AFNOR
    Learn More
    €97.45

  • NF C96-022-44, NF EN 60749-44 (12/2016)

    Semiconductor devices - Mechanical and climatic test methods - Part 44 : neutron beam irradiated single event effect (SEE) test method for semiconductor devices
    12/23/2016 - PDF - English - AFNOR
    Learn More
    €97.45

  • DIN EN 62047-26:2016-12

    Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016); German version EN 62047-26:2016
    12/1/2016 - PDF - German - DIN
    Learn More
    €114.10

  • DIN EN 62047-1:2016-12

    Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016); German version EN 62047-1:2016
    12/1/2016 - PDF - German - DIN
    Learn More
    €125.30

  • UNE-EN 60749-44:2016

    Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
    12/1/2016 - PDF - English - AENOR
    Learn More
    €73.00

  • DIN EN 62477-2 VDE 0558-477-2:2016-12

    Safety requirements for power electronic converter systems and equipment - Part 2: Power electronic converters from 1000 V a.c. or 1500 V d.c. up to 36 kV a.c. or 54 kV d.c. (IEC 22/275/CDV:2016); German version prEN 62477-2:2016
    12/1/2016 - Paper - German - VDE
    Learn More
    €95.02

  • BS EN 60749-44:2016

    Semiconductor devices. Mechanical and climatic test methods. Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
    11/30/2016 - Paper - English - BSI
    Learn More
    €193.80

  • BS EN 62047-25:2016

    Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area
    11/30/2016 - Paper - English - BSI
    Learn More
    €193.80

  • PR NF C71-504/A1, PR NF EN 62504/A1 (11/2016)

    Amendment 1 - General lighting - Light emitting diode (LED) products and related equipment - Terms and definitions
    11/10/2016 - Paper - French - AFNOR
    Learn More
    €25.03

  • SAE TB 0003A:2016-11-08

    Counterfeit Parts & Materials Risk Mitigation
    11/8/2016 - PDF - English - SAE
    Learn More
    €66.30

  • NF C96-050-1, NF EN 62047-1 (11/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 1 : terms and definitions
    11/5/2016 - PDF - French - AFNOR
    Learn More
    €97.45

  • NF C96-050-1, NF EN 62047-1 (11/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 1 : terms and definitions
    11/5/2016 - PDF - English - AFNOR
    Learn More
    €97.45

  • EIA JESD 22-A106B.01:2016

    Thermal Shock
    11/1/2016 - PDF sécurisé - English - EIA
    Learn More
    €43.35

  • EIA JESD 31E:2016

    General Requirements for Authorized Distributors of Commercial and Military Semiconductor Devices
    11/1/2016 - PDF sécurisé - English - EIA
    Learn More
    €62.90

  • IEC 60191-6-13 (2016-09)

    IEC 60191-6-13:2016 Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
    9/27/2016 - PDF - English, French - CEI
    Learn More
    €110.00

  • IEC 61975 Edition 1.1 (2016-09)

    IEC 61975:2010+AMD1:2016 consolidated version High-voltage direct current (HVDC) installations - System tests

    9/12/2016 - PDF - English, French - CEI
    Learn More
    €550.00

  • IEC 61975 AMD 1 (2016-09)

    IEC 61975:2010/AMD1:2016 Amendment 1 - High-voltage direct current (HVDC) installations - System tests
    9/12/2016 - PDF - English, French - CEI
    Learn More
    €110.00

  • NF C96-779-3, NF EN 62779-3 (09/2016)

    Semiconductor devices - Semiconductor interface for human body communication - Part 3 : functional type and its operational conditions
    9/3/2016 - PDF - French - AFNOR
    Learn More
    €73.94

  • DIN EN 62969-2 VDE 0884-69-2:2016-09

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors (IEC 47/2273/CD:2016)
    9/1/2016 - Paper - German - VDE
    Learn More
    €20.45

  • EIA JEP 122H:2016

    Failure Mechanisms and Models for Semiconductor Devices
    9/1/2016 - PDF sécurisé - English - EIA
    Learn More
    €138.55

  • EIA JESD 22-B103B.01:2016

    Vibration, Variable Frequency
    9/1/2016 - PDF sécurisé - English - EIA
    Learn More
    €47.60

  • IEC 62047-25 (2016-08)

    IEC 62047-25:2016 Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
    8/29/2016 - PDF - English, French - CEI
    Learn More
    €154.00

  • NF C96-779-2, NF EN 62779-2 (08/2016)

    Semiconductor devices - Semiconductor interface for human body communication - Part 2 : characterization of interfacing performances
    8/27/2016 - PDF - French - AFNOR
    Learn More
    €73.94

  • NF C96-779-1, NF EN 62779-1 (08/2016)

    Semiconductor devices - Semiconductor interface for human body communication - Part 1 : general requirements
    8/13/2016 - PDF - French - AFNOR
    Learn More
    €86.53

  • DIN EN 62047-29:2016-08

    Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature (IEC 47F/243/CD:2016)
    8/1/2016 - PDF - English, German - DIN
    Learn More
    €68.30

  • DIN EN 62047-30:2016-08

    Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film (IEC 47F/241/CD:2016)
    8/1/2016 - PDF - English, German - DIN
    Learn More
    €103.00

  • DIN EN 62969-4 VDE 0884-69-4:2016-08

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors (IEC 47/2275/CD:2016)
    8/1/2016 - Paper - German - VDE
    Learn More
    €22.72

  • DIN EN 62969-1 VDE 0884-69-1:2016-08

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors (IEC 47/2272/CD:2016)
    8/1/2016 - Paper - German - VDE
    Learn More
    €22.72

  • IEC 60749-44 (2016-07)

    IEC 60749-44:2016 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
    7/21/2016 - PDF - English, French - CEI
    Learn More
    €154.00

  • UNE-EN 62779-1:2016

    Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (Endorsed by AENOR in July of 2016.)
    7/1/2016 - PDF - English - AENOR
    Learn More
    €68.00

  • UNE-EN 62779-2:2016

    Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (Endorsed by AENOR in July of 2016.)
    7/1/2016 - PDF - English - AENOR
    Learn More
    €68.00

  • UNE-EN 62779-3:2016

    Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (Endorsed by AENOR in July of 2016.)
    7/1/2016 - PDF - English - AENOR
    Learn More
    €64.00

  • DIN EN 60700-1 VDE 0553-1:2016-07

    Thyristor valves for high voltage direct current (HVDC) power transmission - Part 1: Electrical testing (IEC 60700-1:2015); German version EN 60700-1:2015
    7/1/2016 - Paper - German - VDE
    Learn More
    €116.31

  • BS EN 62779-1:2016

    Semiconductor devices. Semiconductor interface for human body communication. General requirements
    6/30/2016 - Paper - English - BSI
    Learn More
    €139.08

  • BS EN 62779-2:2016

    Semiconductor devices. Semiconductor interface for human body communication. Characterization of interfacing performances
    6/30/2016 - Paper - English - BSI
    Learn More
    €139.08

  • BS EN 62779-3:2016

    Semiconductor devices. Semiconductor interface for human body communication. Functional type and its operational conditions
    6/30/2016 - Paper - English - BSI
    Learn More
    €139.08

  • NF C96-050-26, NF EN 62047-26 (06/2016)

    Semiconductor devices - Micro-electromechanical devices - Part 26 : description and measurement methods for micro trench and needle structures
    6/25/2016 - PDF - French - AFNOR
    Learn More
    €97.45

  • EIA JESD 22-A122A:2016

    Power Cycling
    6/1/2016 - PDF sécurisé - English - EIA
    Learn More
    €51.00

  • UNE-EN 62047-26:2016

    Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (Endorsed by AENOR in June of 2016.)
    6/1/2016 - PDF - English - AENOR
    Learn More
    €78.00

  • BS EN 62047-26:2016

    Semiconductor devices. Micro-electromechanical devices. Description and measurement methods for micro trench and needle structures
    5/31/2016 - Paper - English - BSI
    Learn More
    €225.72

  • DIN EN 62969-3:2016-05

    Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors (IEC 47/2274/CD:2016)
    5/1/2016 - PDF - German - DIN
    Learn More
    €108.80

  • UNE-EN 62047-1:2016

    Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (Endorsed by AENOR in May of 2016.)
    5/1/2016 - PDF - English - AENOR
    Learn More
    €81.00

  • BS IEC 60747-6:2016

    Semiconductor devices. Discrete devices. Thyristors
    4/30/2016 - Paper - English - BSI
    Learn More
    €335.16

  • BS EN 62047-1:2016

    Semiconductor devices. Micro-electromechanical devices. Terms and definitions
    4/30/2016 - Paper - English - BSI
    Learn More
    €225.72

  • IEC 62779-3 (2016-04)

    IEC 62779-3:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
    4/26/2016 - PDF - English, French - CEI
    Learn More
    €77.00

  • IEC 60747-2 (2016-04)

    IEC 60747-2:2016 Semiconductor devices - Part 2: Discrete devices - Rectifier diodes
    4/13/2016 - PDF - English, French - CEI
    Learn More
    €264.00

  • IEC 60747-6 (2016-04)

    IEC 60747-6:2016 Semiconductor devices - Part 6: Discrete devices - Thyristors
    4/13/2016 - PDF - English, French - CEI
    Learn More
    €363.00

  • JIS C 6790:2016

    Load test of a bolt-clamped Langevin vibrator using wattmeter method
    3/22/2016 - PDF - Japanese - JSA
    Learn More
    €25.00

  • IEC 60747-5-6 (2016-02)

    IEC 60747-5-6:2016 Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
    2/23/2016 - PDF - English, French - CEI
    Learn More
    €330.00

  • IEC 60747-5-7 (2016-02)

    IEC 60747-5-7:2016 Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors
    2/23/2016 - PDF - English, French - CEI
    Learn More
    €154.00

  • IEC 62779-1 (2016-02)

    IEC 62779-1:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
    2/18/2016 - PDF - English, French - CEI
    Learn More
    €110.00

  • IEC 62779-2 (2016-02)

    IEC 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
    2/18/2016 - PDF - English, French - CEI
    Learn More
    €110.00

  • IEC 62047-26 (2016-01)

    IEC 62047-26:2016 Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
    1/7/2016 - PDF - English, French - CEI
    Learn More
    €187.00

  • IEC 62047-1 (2016-01)

    IEC 62047-1:2016 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
    1/6/2016 - PDF - English, French - CEI
    Learn More
    €220.00

  • DIN EN 62047-15:2016-01

    Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass (IEC 62047-15:2015); German version EN 62047-15:2015
    1/1/2016 - PDF - German - DIN
    Learn More
    €82.60

  • DIN EN 60747-17 VDE 0884-17:2016-01

    Semiconductor devices - Magnetic and capacitive coupler for basic and reinforced insulation (IEC 47E/511/CD:2015)
    1/1/2016 - Paper - German - VDE
    Learn More
    €45.89

  • AS IEC 62477.1:2016

    Safety requirements for power electronic converter systems and equipment General
    1/1/2016 - PDF sécurisé - English - SA
    Learn More
    €197.62

  • SAE ARP 6338:2015-12-06

    Process for Assessment and Mitigation of Early Wearout of Life-limited Microcircuits
    12/6/2015 - PDF - English - SAE
    Learn More
    €66.30

  • DIN EN 62047-16:2015-12

    Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015
    12/1/2015 - PDF - German - DIN
    Learn More
    €82.60

  • DIN EN 62047-17:2015-12

    Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015); German version EN 62047-17:2015
    12/1/2015 - PDF - German - DIN
    Learn More
    €108.80

  • JIS C 5630-20:2015

    Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
    11/20/2015 - PDF - Japanese - JSA
    Learn More
    €46.02

  • NF C96-050-15, NF EN 62047-15 (11/2015)

    Semiconductor devices - Micro-electromechanical devices - Part 15 : test method of bonding strength between PDMS and glass
    11/14/2015 - PDF - French - AFNOR
    Learn More
    €73.94

  • NF C96-050-16, NF EN 62047-16 (11/2015)

    Semiconductor devices - Micro-electromechanical devices - Part 16 : test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
    11/14/2015 - PDF - French - AFNOR
    Learn More
    €73.94

  • NF C96-050-17, NF EN 62047-17 (11/2015)

    Semiconductor devices - Micro-electromechanical devices - Part 17 : bulge test method for measuring mechanical properties of thin films
    11/14/2015 - PDF - French - AFNOR
    Learn More
    €97.45

  • UNE-EN 60700-1:2015

    Thyristor valves for high voltage direct current (HVDC) power transmission - Part 1: Electrical testing (Endorsed by AENOR in November of 2015.)
    11/1/2015 - PDF - English - AENOR
    Learn More
    €89.00

  • BS EN 60700-1:2015

    Thyristor valves for high voltage direct current (HVDC) power transmission. Electrical testing
    10/31/2015 - Paper - English - BSI
    Learn More
    €271.32

  • NF C93-801-1, NF EN 62007-1 (10/2015)

    Semiconductor optoelectronic devices for fibre optic system applications - Part 1 : specification template for essential ratings and characteristics
    10/2/2015 - PDF - French - AFNOR
    Learn More
    €106.80

  • EIA JEP 151:2015

    Test Procedure for the Measurement of Terrestrial Cosmic Ray Induced Destructive Effects in Power Semiconductor Devices
    9/1/2015 - PDF sécurisé - English - EIA
    Learn More
    €52.70

  • PR NF C96-830-3, PR NF EN 62830-3 (08/2015)

    Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3 : vibration based electromagnetic energy harvesting
    8/28/2015 - Paper - French - AFNOR
    Learn More
    €63.76

  • DIN EN 62047-27:2015-08

    Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) (IEC 47F/216/CD:2015)
    8/1/2015 - PDF - English, German - DIN
    Learn More
    €89.00

  • UNE-EN 62007-1:2015

    Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics (Endorsed by AENOR in August of 2015.)
    8/1/2015 - PDF - English - AENOR
    Learn More
    €81.00

  • UNE-EN 62047-15:2015

    Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass (Endorsed by AENOR in August of 2015.)
    8/1/2015 - PDF - English - AENOR
    Learn More
    €62.00

  • UNE-EN 62047-16:2015

    Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (Endorsed by AENOR in August of 2015.)
    8/1/2015 - PDF - English - AENOR
    Learn More
    €61.00

  • UNE-EN 62047-17:2015

    Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (Endorsed by AENOR in August of 2015.)
    8/1/2015 - PDF - English - AENOR
    Learn More
    €77.00

  • BS EN 62007-1:2015

    Semiconductor optoelectronic devices for fibre optic system applications. Specification template for essential ratings and characteristics
    7/31/2015 - Paper - English - BSI
    Learn More
    €225.72

  • BS EN 62047-15:2015

    Semiconductor devices. Micro-electromechanical devices. Test method of bonding strength between PDMS and glass
    7/31/2015 - Paper - English - BSI
    Learn More
    €139.08

  • BS EN 62047-17:2015

    Semiconductor devices. Micro-electromechanical devices. Bulge test method for measuring mechanical properties of thin films
    7/31/2015 - Paper - English - BSI
    Learn More
    €225.72

  • BS EN 62047-16:2015

    Semiconductor devices. Micro-electromechanical devices. Test methods for determining residual stresses of MEMS films. Wafer curvature and cantilever beam deflection methods
    7/31/2015 - Paper - English - BSI
    Learn More
    €139.08

  • EIA JEP 172A:2015

    Discontinuing Use of the Machine Model for Device ESD Qualification
    7/1/2015 - PDF sécurisé - English - EIA
    Learn More
    €52.70

  • EIA JEP 159A:2015

    Procedure for the Evaluation of Low-k/Metal Inter/Intra-Level Dielectric Integrity
    7/1/2015 - PDF sécurisé - English - EIA
    Learn More
    €62.90

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