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01.100.25 : Electrical and electronics engineering drawings

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  • DIN EN IEC 60191-1:2018-10

    Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018
    10/1/2018 - PDF - German - DIN
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    €136.80

  • BS IEC 60191-2:1966+A20:2018

    Mechanical standardization of semiconductor devices Dimensions
    5/1/2018 - PDF - English - BSI
    Learn More
    €613.83

  • VG 95340-1:2017-10

    Complete circuit diagram - Part 1: Installation of power installations in cabins and motorcar box bodies, 400/230 V, 50 Hz, 32 A, interface standard; Text in German and English
    10/1/2017 - PDF - English, German - DIN
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    €47.60

  • VG 95340-2:2017-10

    Complete circuit diagram - Part 2: Installation of power installations in cabins and motorcar box bodies, 230 V, 50 Hz, 16 A, interface standard; Text in German and English
    10/1/2017 - PDF - English, German - DIN
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    €47.60

  • DIN EN 61240:2017-08

    Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (IEC 61240:2016); German version EN 61240:2017)
    8/1/2017 - PDF - German - DIN
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    €96.00

  • 15/30328077 DC

    BS EN 60191-2. Mechanical standardization of semiconductor devices. Part 2. Dimensions
    7/7/2015 - PDF - English - BSI
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    €23.70

  • NF C03-251-1, NF EN 61082-1 (05/2015)

    Preparation of documents used in electrotechnology - Part 1 : rules
    5/15/2015 - PDF - English - UTE
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    €199.43

  • NF EN 61082-1, C03-251-1 (05/2015)

    Preparation of documents used in electrotechnology - Part 1 : rules - Établissement des documents utilisés en électrotechnique - Partie 1 : règles
    5/1/2015 - Paper - French - AFNOR
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    €201.42

  • NF EN 62744, C03-254 (03/2015)

    Representation of states of objects by graphic symbols
    3/1/2015 - Paper - French - AFNOR
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    €103.60

  • 13/30290470 DC

    BS EN 60191-2/F71. Proposed new package outline. P-ZMP-P89
    9/11/2013 - PDF - English - BSI
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    €23.70

  • DIN EN 60191-6-22:2013-08

    Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
    8/1/2013 - PDF - German - DIN
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    €96.00

  • BS EN 60848:2013

    GRAFCET specification language for sequential function charts
    7/31/2013 - PDF - English - BSI
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    €300.99

  • DIN EN 60191-6-12:2011-12

    Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011
    12/1/2011 - PDF - German - DIN
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    €96.00

  • DIN EN 60191-6-17:2011-09

    Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
    9/1/2011 - PDF - German - DIN
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    €114.10

  • BS EN 60191-6-12:2011

    Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guidelines fine-pitch land grid array (FLGA)
    8/31/2011 - PDF - English - BSI
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    €215.67

  • BS EN 60191-6-17:2011

    Mechanical standardization of semiconductor devices General rules for the preparation outline drawings surface mounted device packages. Design guide stacked Fine-pitch ball grid array and fine-pitch land (P-PFBGA P-PFLGA)
    6/30/2011 - PDF - English - BSI
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    €215.67

  • DIN EN 60191-6-20:2011-03

    Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
    3/1/2011 - PDF - German - DIN
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    €82.60

  • DIN EN 60191-6-21:2011-03

    Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
    3/1/2011 - PDF - German - DIN
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    €96.00

  • DS-Handbook 166:2010

    A Guide to Reference Designations. Preparation of TAG Numbers, Letter Codes, Modularization and Interfaces between Systems
    9/2/2010 - PDF - English - DS
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    €144.00

  • DIN EN 60191-6-18:2010-08

    Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
    8/1/2010 - PDF - German - DIN
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    €103.00

  • DIN EN 60191-6:2010-06

    Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009
    6/1/2010 - PDF - German - DIN
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    €136.80

  • DIN EN 60191-3 Beiblatt 1:2006-08

    Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
    8/1/2006 - PDF - German - DIN
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    €54.80

  • NF EN 61988-3-1, C93-548-3-1 (03/2006)

    Plasma display panels - Part 3-1 : mechanical interface
    3/1/2006 - Paper - French - AFNOR
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    €78.60

  • DIN EN 60191-6-10:2004-05

    Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003
    5/1/2004 - PDF - German - DIN
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    €75.40

  • DIN EN 60191-6-4:2004-01

    Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
    1/1/2004 - PDF - German - DIN
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    €89.00

  • BS EN 60191-6-2:2002

    Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide 1,50 mm, 1,27 mm and 1,00 pitch ball column terminal
    3/4/2003 - PDF - English - BSI
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    €130.35

  • DIN 1304-9:2003-01

    Letter symbols for physical quantities - Part 9: Symbols for equivalent circuits of piezoelectric crystals
    1/1/2003 - PDF - German - DIN
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    €47.60

  • DIN EN 60191-6-2:2002-09

    Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002
    9/1/2002 - PDF - German - DIN
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    €75.40

  • DIN EN 60191-6-1:2002-08

    Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001
    8/1/2002 - PDF - German - DIN
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    €54.80

  • DIN EN 60191-6-5:2002-05

    Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001
    5/1/2002 - PDF - German - DIN
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    €75.40

  • DIN EN 60191-6-8:2002-05

    Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
    5/1/2002 - PDF - German - DIN
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    €75.40

  • BS EN 60191-6-1:2001

    Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide gull-wing lead terminals
    3/29/2002 - PDF - English - BSI
    Learn More
    €130.35

  • DIN EN 60191-6-6:2002-02

    Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001
    2/1/2002 - PDF - German - DIN
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    €75.40

  • BS EN 60191-6-8:2001

    Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide glass sealed ceramic quad flatpack (G-QFP)
    11/16/2001 - PDF - English - BSI
    Learn More
    €130.35

  • BS EN 60191-6-5:2001

    Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine-pitchball grid array (FBGA)
    11/15/2001 - PDF - English - BSI
    Learn More
    €130.35

  • DIN EN 60139:2001-10

    Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges (IEC 60139:2000); German version EN 60139:2001
    10/1/2001 - PDF - German - DIN
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    €114.10

  • BS EN 60191-6-6:2001

    Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Design guide fine pitch land grid array (FLGA) Proposed amendment on terminology
    9/5/2001 - PDF - English - BSI
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    €154.05

  • BS EN 60139:2001

    Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges
    8/15/2001 - PDF - English - BSI
    Learn More
    €253.59

  • DIN EN 60191-6-3:2001-06

    Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
    6/1/2001 - PDF - German - DIN
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    €61.70

  • BS EN 60191-6-3:2001

    Mechanical standardization of semiconductor devices. General rules for the preparation outline drawings surface mounted device packages Measuring methods package dimensions quad flat packs (QFP)
    5/15/2001 - PDF - English - BSI
    Learn More
    €154.05

  • DIN EN 60191-3:2000-07

    Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
    7/1/2000 - PDF - German - DIN
    Learn More
    €141.90

  • BS EN 60191-3:2000

    Mechanical standardization of semiconductor devices General rules for the preparation outline drawings integrated circuits
    6/15/2000 - PDF - English - BSI
    Learn More
    €300.99

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