Call +33 (1) 40 02 03 05

01.100.25 : Electrical and electronics engineering drawings

42 Item(s)

Set Ascending Direction
per page

List  Grid 

  • DIN EN IEC 60191-1:2018-10

    Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018
    10/1/2018 - PDF - German - DIN
    Learn More
    €136.80

  • BS IEC 60191-2:1966+A20:2018

    Mechanical standardization of semiconductor devices. Dimensions
    5/1/2018 - Paper - English - BSI
    Learn More
    €551.76

  • DIN EN 61837-2:2017-10

    Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1218/CD:2017)
    10/1/2017 - PDF - English, German - DIN
    Learn More
    €334.30

  • VG 95340-1:2017-10

    Complete circuit diagram - Part 1: Installation of power installations in cabins and motorcar box bodies, 400/230 V, 50 Hz, 32 A, interface standard; Text in German and English
    10/1/2017 - PDF - English, German - DIN
    Learn More
    €51.70

  • VG 95340-2:2017-10

    Complete circuit diagram - Part 2: Installation of power installations in cabins and motorcar box bodies, 230 V, 50 Hz, 16 A, interface standard; Text in German and English
    10/1/2017 - PDF - English, German - DIN
    Learn More
    €51.70

  • DIN EN 61240:2017-08

    Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (IEC 61240:2016); German version EN 61240:2017)
    8/1/2017 - PDF - German - DIN
    Learn More
    €96.00

  • NF C03-251-1, NF EN 61082-1 (05/2015)

    Preparation of documents used in electrotechnology - Part 1 : rules
    5/15/2015 - PDF - French - UTE
    Learn More
    €189.46

  • NF C03-251-1, NF EN 61082-1 (05/2015)

    Preparation of documents used in electrotechnology - Part 1 : rules
    5/15/2015 - PDF - English - UTE
    Learn More
    €189.46

  • NF C03-254, NF EN 62744 (03/2015)

    Representation of states of objects by graphic symbols
    3/25/2015 - PDF - French - UTE
    Learn More
    €97.45

  • DIN EN 61837-2:2014-10

    Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011 + A1:2014); German version EN 61837-2:2011 + A1:2014
    10/1/2014 - PDF - German - DIN
    Learn More
    €224.20

  • DIN EN 60191-6-22:2013-08

    Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
    8/1/2013 - PDF - German - DIN
    Learn More
    €96.00

  • BS EN 60848:2013

    GRAFCET specification language for sequential function charts
    7/31/2013 - Paper - English - BSI
    Learn More
    €271.32

  • DIN EN 60191-6-12:2011-12

    Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011
    12/1/2011 - PDF - German - DIN
    Learn More
    €96.00

  • DIN EN 60191-6-17:2011-09

    Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
    9/1/2011 - PDF - German - DIN
    Learn More
    €114.10

  • BS EN 60191-6-12:2011

    Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
    8/31/2011 - Paper - English - BSI
    Learn More
    €193.80

  • BS EN 60191-6-17:2011

    Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
    6/30/2011 - Paper - English - BSI
    Learn More
    €193.80

  • DIN EN 60191-6-20:2011-03

    Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
    3/1/2011 - PDF - German - DIN
    Learn More
    €82.60

  • DIN EN 60191-6-21:2011-03

    Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
    3/1/2011 - PDF - German - DIN
    Learn More
    €96.00

  • DS-Handbook 166:2010

    A Guide to Reference Designations. Preparation of TAG Numbers, Letter Codes, Modularization and Interfaces between Systems
    9/2/2010 - PDF - English - DS
    Learn More
    €144.00

  • DIN EN 60191-6-18:2010-08

    Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
    8/1/2010 - PDF - German - DIN
    Learn More
    €103.00

  • DIN EN 60191-6:2010-06

    Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009
    6/1/2010 - PDF - German - DIN
    Learn More
    €136.80

  • DIN EN 60191-3 Beiblatt 1:2006-08

    Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
    8/1/2006 - PDF - German - DIN
    Learn More
    €54.80

  • NF C93-548-3-1, NF EN 61988-3-1 (03/2006)

    Plasma display panels - Part 3-1 : mechanical interface
    3/1/2006 - PDF - French - UTE
    Learn More
    €73.94

  • DIN EN 60191-6-10:2004-05

    Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003
    5/1/2004 - PDF - German - DIN
    Learn More
    €75.40

  • DIN EN 60191-6-4:2004-01

    Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
    1/1/2004 - PDF - German - DIN
    Learn More
    €89.00

  • DIN 1304-9:2003-01

    Letter symbols for physical quantities - Part 9: Symbols for equivalent circuits of piezoelectric crystals
    1/1/2003 - PDF - German - DIN
    Learn More
    €47.60

  • DIN EN 60191-6-2:2002-09

    Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002
    9/1/2002 - PDF - German - DIN
    Learn More
    €75.40

  • DIN EN 60191-6-1:2002-08

    Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001
    8/1/2002 - PDF - German - DIN
    Learn More
    €54.80

  • DIN EN 60191-6-5:2002-05

    Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001
    5/1/2002 - PDF - German - DIN
    Learn More
    €75.40

  • DIN EN 60191-6-8:2002-05

    Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
    5/1/2002 - PDF - German - DIN
    Learn More
    €75.40

  • BS EN 60191-6-2:2002

    Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
    3/29/2002 - Paper - English - BSI
    Learn More
    €116.28

  • BS EN 60191-6-1:2001

    Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals
    3/29/2002 - Paper - English - BSI
    Learn More
    €116.28

  • DIN EN 60191-6-6:2002-02

    Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001
    2/1/2002 - PDF - German - DIN
    Learn More
    €75.40

  • BS EN 60191-6-8:2001

    Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP)
    11/16/2001 - Paper - English - BSI
    Learn More
    €116.28

  • BS EN 60191-6-5:2001

    Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitchball grid array (FBGA)
    11/15/2001 - Paper - English - BSI
    Learn More
    €116.28

  • DIN EN 60139:2001-10

    Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges (IEC 60139:2000); German version EN 60139:2001
    10/1/2001 - PDF - German - DIN
    Learn More
    €114.10

  • BS EN 60191-6-6:2001

    Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine pitch land grid array (FLGA). Proposed amendment on terminology
    9/5/2001 - Paper - English - BSI
    Learn More
    €139.08

  • BS EN 60139:2001

    Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges
    8/15/2001 - Paper - English - BSI
    Learn More
    €225.72

  • DIN EN 60191-6-3:2001-06

    Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
    6/1/2001 - PDF - German - DIN
    Learn More
    €61.70

  • BS EN 60191-6-3:2001

    Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP)
    5/15/2001 - Paper - English - BSI
    Learn More
    €139.08

  • DIN EN 60191-3:2000-07

    Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
    7/1/2000 - PDF - German - DIN
    Learn More
    €141.90

  • BS EN 60191-3:2000

    Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of integrated circuits
    6/15/2000 - Paper - English - BSI
    Learn More
    €271.32

42 Item(s)

Set Ascending Direction
per page

List  Grid 

To top